JPH0456345A - Substrate for mounting electronic parts - Google Patents

Substrate for mounting electronic parts

Info

Publication number
JPH0456345A
JPH0456345A JP16963190A JP16963190A JPH0456345A JP H0456345 A JPH0456345 A JP H0456345A JP 16963190 A JP16963190 A JP 16963190A JP 16963190 A JP16963190 A JP 16963190A JP H0456345 A JPH0456345 A JP H0456345A
Authority
JP
Japan
Prior art keywords
recessed area
sealing resin
flows
substrate
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16963190A
Inventor
Atsushi Hiroi
Mitsuhiro Kondo
Kinya Oshima
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP16963190A priority Critical patent/JPH0456345A/en
Publication of JPH0456345A publication Critical patent/JPH0456345A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To enhance strength of close contactness with sealing resin by forming a recessed area which opening toward outside at the surface of an insulating base material to allow a part of the sealing resin to enter this recessed area.
CONSTITUTION: A sealing resin 22 also flows into each recessed area 17 opening toward the surface of an insulating base material 13. In this case, if each recessed area 17 is formed in sufficient length and in the predetermined direction, the sealing resin 22 naturally flows into each recessed area 17 and flows along each recessed area 17. Therefore, the sealing resin 22 flows into each recessed area 17 and also flows certainly into the other portions through this recessed area 17. Upon completion of flowing, the sealing resin 22 fills each recessed area 17 as well as the surface of the insulating base material 13. Thereby, bonding to a substrate 10 for mounting electronic parts with sufficient contact area can be ensured, resulting in the bonding with sufficient strength of contactness to the substrate 10 for mounting electronic parts.
COPYRIGHT: (C)1992,JPO&Japio
JP16963190A 1990-06-26 1990-06-26 Substrate for mounting electronic parts Pending JPH0456345A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16963190A JPH0456345A (en) 1990-06-26 1990-06-26 Substrate for mounting electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16963190A JPH0456345A (en) 1990-06-26 1990-06-26 Substrate for mounting electronic parts

Publications (1)

Publication Number Publication Date
JPH0456345A true JPH0456345A (en) 1992-02-24

Family

ID=15890081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16963190A Pending JPH0456345A (en) 1990-06-26 1990-06-26 Substrate for mounting electronic parts

Country Status (1)

Country Link
JP (1) JPH0456345A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102054793A (en) * 2009-10-30 2011-05-11 夏普株式会社 Substrate member, module, electric equipment, and manufacturing method of modules

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102054793A (en) * 2009-10-30 2011-05-11 夏普株式会社 Substrate member, module, electric equipment, and manufacturing method of modules
JP2011096865A (en) * 2009-10-30 2011-05-12 Sharp Corp Substrate member, module, electric equipment, and manufacturing method of modules

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