JPH0446568U - - Google Patents
Info
- Publication number
- JPH0446568U JPH0446568U JP1990089383U JP8938390U JPH0446568U JP H0446568 U JPH0446568 U JP H0446568U JP 1990089383 U JP1990089383 U JP 1990089383U JP 8938390 U JP8938390 U JP 8938390U JP H0446568 U JPH0446568 U JP H0446568U
- Authority
- JP
- Japan
- Prior art keywords
- film
- attached
- heat sink
- platinum
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0446568U true JPH0446568U (US20110009641A1-20110113-C00185.png) | 1992-04-21 |
| JP2544761Y2 JP2544761Y2 (ja) | 1997-08-20 |
Family
ID=31823319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990089383U Expired - Lifetime JP2544761Y2 (ja) | 1990-08-27 | 1990-08-27 | 半導体レーザ用ヒートシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544761Y2 (US20110009641A1-20110113-C00185.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101065076B1 (ko) * | 2005-05-07 | 2011-09-15 | 삼성전자주식회사 | 발광소자 패키지용 서브마운트 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
-
1990
- 1990-08-27 JP JP1990089383U patent/JP2544761Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544761Y2 (ja) | 1997-08-20 |
