JPH0446551U - - Google Patents
Info
- Publication number
- JPH0446551U JPH0446551U JP8780190U JP8780190U JPH0446551U JP H0446551 U JPH0446551 U JP H0446551U JP 8780190 U JP8780190 U JP 8780190U JP 8780190 U JP8780190 U JP 8780190U JP H0446551 U JPH0446551 U JP H0446551U
- Authority
- JP
- Japan
- Prior art keywords
- case
- semiconductor element
- resin
- wiring pattern
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8780190U JPH0446551U (US06262066-20010717-C00315.png) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8780190U JPH0446551U (US06262066-20010717-C00315.png) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446551U true JPH0446551U (US06262066-20010717-C00315.png) | 1992-04-21 |
Family
ID=31820485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8780190U Pending JPH0446551U (US06262066-20010717-C00315.png) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446551U (US06262066-20010717-C00315.png) |
-
1990
- 1990-08-21 JP JP8780190U patent/JPH0446551U/ja active Pending
