JPH0442742U - - Google Patents

Info

Publication number
JPH0442742U
JPH0442742U JP8534790U JP8534790U JPH0442742U JP H0442742 U JPH0442742 U JP H0442742U JP 8534790 U JP8534790 U JP 8534790U JP 8534790 U JP8534790 U JP 8534790U JP H0442742 U JPH0442742 U JP H0442742U
Authority
JP
Japan
Prior art keywords
semiconductor device
constriction
sealing resin
lead frame
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8534790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8534790U priority Critical patent/JPH0442742U/ja
Publication of JPH0442742U publication Critical patent/JPH0442742U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8534790U 1990-08-10 1990-08-10 Pending JPH0442742U (US06724976-20040420-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8534790U JPH0442742U (US06724976-20040420-M00002.png) 1990-08-10 1990-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8534790U JPH0442742U (US06724976-20040420-M00002.png) 1990-08-10 1990-08-10

Publications (1)

Publication Number Publication Date
JPH0442742U true JPH0442742U (US06724976-20040420-M00002.png) 1992-04-10

Family

ID=31634445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8534790U Pending JPH0442742U (US06724976-20040420-M00002.png) 1990-08-10 1990-08-10

Country Status (1)

Country Link
JP (1) JPH0442742U (US06724976-20040420-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012127696A1 (ja) * 2011-03-24 2012-09-27 三菱電機株式会社 パワー半導体モジュール及びパワーユニット装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012127696A1 (ja) * 2011-03-24 2012-09-27 三菱電機株式会社 パワー半導体モジュール及びパワーユニット装置
JP5701377B2 (ja) * 2011-03-24 2015-04-15 三菱電機株式会社 パワー半導体モジュール及びパワーユニット装置
US9129931B2 (en) 2011-03-24 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module and power unit device

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