JPH0437870B2 - - Google Patents

Info

Publication number
JPH0437870B2
JPH0437870B2 JP59247377A JP24737784A JPH0437870B2 JP H0437870 B2 JPH0437870 B2 JP H0437870B2 JP 59247377 A JP59247377 A JP 59247377A JP 24737784 A JP24737784 A JP 24737784A JP H0437870 B2 JPH0437870 B2 JP H0437870B2
Authority
JP
Japan
Prior art keywords
copper
parts
weight
adhesive
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59247377A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61126187A (ja
Inventor
Mitsuo Yokota
Minoru Morita
Takeshi Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP24737784A priority Critical patent/JPS61126187A/ja
Publication of JPS61126187A publication Critical patent/JPS61126187A/ja
Publication of JPH0437870B2 publication Critical patent/JPH0437870B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP24737784A 1984-11-22 1984-11-22 銅張積層板用接着剤 Granted JPS61126187A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24737784A JPS61126187A (ja) 1984-11-22 1984-11-22 銅張積層板用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24737784A JPS61126187A (ja) 1984-11-22 1984-11-22 銅張積層板用接着剤

Publications (2)

Publication Number Publication Date
JPS61126187A JPS61126187A (ja) 1986-06-13
JPH0437870B2 true JPH0437870B2 (enrdf_load_stackoverflow) 1992-06-22

Family

ID=17162518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24737784A Granted JPS61126187A (ja) 1984-11-22 1984-11-22 銅張積層板用接着剤

Country Status (1)

Country Link
JP (1) JPS61126187A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2650439B2 (ja) * 1988-12-05 1997-09-03 日立化成工業株式会社 金属張積層板用接着剤組成物
JP2650168B2 (ja) * 1991-08-09 1997-09-03 日立化成工業株式会社 銅張積層板用接着剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468840A (en) * 1977-11-11 1979-06-02 Hitachi Chem Co Ltd Adhesive for copper-lined laminate
JPS5534250A (en) * 1978-08-31 1980-03-10 Matsushita Electric Works Ltd Adhesive composition
JPS6079080A (ja) * 1983-10-07 1985-05-04 Nippon Mektron Ltd 接着剤組成物

Also Published As

Publication number Publication date
JPS61126187A (ja) 1986-06-13

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