JPH0437575B2 - - Google Patents
Info
- Publication number
- JPH0437575B2 JPH0437575B2 JP2459183A JP2459183A JPH0437575B2 JP H0437575 B2 JPH0437575 B2 JP H0437575B2 JP 2459183 A JP2459183 A JP 2459183A JP 2459183 A JP2459183 A JP 2459183A JP H0437575 B2 JPH0437575 B2 JP H0437575B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- resist
- film thickness
- coating film
- rotation speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は塗布装置、特に半導体、液晶などのホ
トレジ塗布工程で用いるホトレジスト塗布装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a coating apparatus, and particularly to a photoresist coating apparatus used in a photoresist coating process for semiconductors, liquid crystals, and the like.
従来のホトレジスト塗布装置として、ホトレジ
温度変動によるホトレジ粘度変動をなくすため、
ホトレジの温度を直接制御する方法があつた。し
かしこの方法は、レジスト貯蔵ビンは温度制御し
ているものの、注入ポンプ、注入ノズルを含む配
管系全体の温度制御が事実上困難であるため、実
際に基板上に注入されるレジストの温度を正確に
制御できない。温度コントロールをしているた
め、数百ワツトの電力を必要とし省エネ指向に反
するなどの欠点があつた。
As a conventional photoresist coating device, in order to eliminate photoresist viscosity fluctuations due to photoresist temperature fluctuations,
There was a way to directly control the temperature of the photoresist. However, although this method controls the temperature of the resist storage bottle, it is difficult to control the temperature of the entire piping system, including the injection pump and injection nozzle, so it is difficult to accurately control the temperature of the resist actually injected onto the substrate. cannot be controlled. Because the temperature is controlled, it requires several hundred watts of electricity, which goes against the energy-saving trend.
本発明はより少いエネルギーでより高精度に塗
布膜厚を制御する装置を提供することを目的とす
る。
An object of the present invention is to provide an apparatus that can control coating film thickness with higher accuracy using less energy.
本発明は、レジストの温度を検出し、レジスト
温度変化による粘度変化を演算し、スピンドル回
転数を補正することを特徴とする。
The present invention is characterized in that the resist temperature is detected, the viscosity change due to the resist temperature change is calculated, and the spindle rotation speed is corrected.
以下、本発明の一実施例を図により説明する。
第１図はレジストの温度をパラメータとしたとき
のスピンナー回転数と塗布膜厚の関係を示し、１
はレジスト温度が規定値の場合、２はレジスト温
度が規定値より低い場合、３はレジスト温度が規
定値より高い場合をそれぞれ示す。温度が一定な
らば、回転数が増すと塗布膜厚が減り、逆に回転
数が低いと塗布膜厚が増す。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
Figure 1 shows the relationship between spinner rotation speed and coating film thickness when resist temperature is used as a parameter.
2 indicates a case where the resist temperature is a specified value, 2 indicates a case where the resist temperature is lower than the specified value, and 3 indicates a case where the resist temperature is higher than the specified value. If the temperature is constant, as the rotation speed increases, the coating film thickness decreases, and conversely, as the rotation speed decreases, the coating film thickness increases.
ここで、仮りに、規定のレジスト温度条件下で
回転数Ｎで塗布膜厚ｔを得ていたとき、温度が低
くなつたとすると、曲線２に示すように、回転数
Ｎでは塗布膜厚はｔ＋△ｔになり変化する。また
温度が高くなると、曲線３に示すように、塗布膜
厚はｔ−△ｔになり減少する。本発明はレジスト
温度が曲線１，２のように変わつても塗布膜厚を
ｔに一定に保つためスピンナー回転数をＮ＋△Ｎ
あるいはＮ−△Ｎに変化させることを特徴として
いる。 Here, if the coating film thickness t is obtained at the rotation speed N under the specified resist temperature condition, and the temperature becomes lower, as shown in curve 2, the coating film thickness will be t+ at the rotation speed N. It changes to Δt. Further, as the temperature increases, as shown by curve 3, the coating film thickness decreases to t-Δt. In the present invention, in order to keep the coating film thickness constant at t even when the resist temperature changes as shown in curves 1 and 2, the spinner rotation speed is set to N+△N.
Alternatively, it is characterized by changing it to N-ΔN.
第２図は本発明の一実施例を示す。第２図はス
ピンナー部とその制御部を示す。従来は注入ノズ
ル４で注入されたレジストが基板５の上に滴下さ
れ、スピンモータ６が回転することにより塗布す
るのみであつた。本発明ではこの注入系で、ノズ
ル４の部分に温度センサ７を付加し、その検出信
号をインターフエース８を介して演算装置９に取
込んでいる。演算装置９の内部では、温度偏差を
粘度偏差に換算し、更にどのくらい回転数を変え
たら一定の塗布膜厚になるか計算している。この
計算結果はモータドライバ１０、回転数センサ１
１、回転センサインターフエース１２を使用し
て、スピンモータ６の回転数補正に使われる。以
上説明した方法によりレジスト温度が変化しても
常に一定膜厚で塗布が可能になる。 FIG. 2 shows an embodiment of the invention. FIG. 2 shows the spinner section and its control section. Conventionally, the resist injected by the injection nozzle 4 was dropped onto the substrate 5, and the resist was simply applied by rotating the spin motor 6. In the present invention, a temperature sensor 7 is added to the nozzle 4 in this injection system, and its detection signal is taken into the arithmetic unit 9 via the interface 8. Inside the arithmetic unit 9, the temperature deviation is converted into a viscosity deviation, and furthermore, it is calculated how much the rotational speed should be changed to obtain a constant coating film thickness. This calculation result is motor driver 10, rotation speed sensor 1
1. The rotation sensor interface 12 is used to correct the rotation speed of the spin motor 6. The method described above enables coating with a constant film thickness even if the resist temperature changes.
本発明によれば、レジスト塗布膜厚が均一にな
ることにより、製品の歩留が向上する。また従来
のように多大な電力を必要とする温度制御をして
いないので省エネになる。
According to the present invention, the yield of products is improved by making the thickness of the resist coating film uniform. It also saves energy because it does not require temperature control, which requires a large amount of electricity, as in the past.
第１図はレジスト温度をパラメータとしたとき
のスピンナー回転数と塗布膜厚の関係を示す図、
第２図は本発明の一実施例を示すブロツク図であ
る。
４……注入ノズル、５……基板、６……スピン
モータ、７……温度センサ、９……演算装置。
Figure 1 is a diagram showing the relationship between spinner rotation speed and coating film thickness when resist temperature is used as a parameter.
FIG. 2 is a block diagram showing one embodiment of the present invention. 4... Injection nozzle, 5... Substrate, 6... Spin motor, 7... Temperature sensor, 9... Arithmetic device.
Claims (1)
せ、この基板上に注入ノズルで塗布液を注入して
塗布する装置において、前記ノズルの部分に配置
された温度センサと、この温度センサの検出出力
に応答する前記スピンモータの回転数制御装置と
からなる塗布装置。1 In an apparatus that rotates a substrate to be processed using a spin motor and injects a coating liquid onto the substrate using an injection nozzle, a temperature sensor disposed at the nozzle and a detection output of this temperature sensor are used. and a rotational speed control device for the spin motor that responds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2459183A JPS59151424A (en) | 1983-02-18 | 1983-02-18 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2459183A JPS59151424A (en) | 1983-02-18 | 1983-02-18 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59151424A JPS59151424A (en) | 1984-08-29 |
| JPH0437575B2 true JPH0437575B2 (en) | 1992-06-19 |
Family
ID=12142395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2459183A Granted JPS59151424A (en) | 1983-02-18 | 1983-02-18 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59151424A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285716A (en) * | 1985-06-12 | 1986-12-16 | Hitachi Ltd | Resist coating method |
| JP2585050B2 (en) * | 1988-03-07 | 1997-02-26 | 東京エレクトロン株式会社 | Semiconductor manufacturing apparatus and processing method |
| US6025012A (en) * | 1995-09-20 | 2000-02-15 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for determining film thickness control conditions and discharging liquid to a rotating substrate |
| JP3516195B2 (en) * | 1996-05-28 | 2004-04-05 | 東京エレクトロン株式会社 | Method and apparatus for forming coating film |
| DE19722407A1 (en) * | 1997-05-28 | 1998-12-03 | Singulus Technologies Ag | Method and device for layer thickness control, in particular bond layer thickness control |
| JP3541001B2 (en) | 2000-11-13 | 2004-07-07 | Ｎｅｃトーキン富山株式会社 | Chip type solid electrolytic capacitor |
-
1983
- 1983-02-18 JP JP2459183A patent/JPS59151424A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59151424A (en) | 1984-08-29 |
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