JPH04371367A - Nitrogen gas reflow apparatus - Google Patents
Nitrogen gas reflow apparatusInfo
- Publication number
- JPH04371367A JPH04371367A JP3145834A JP14583491A JPH04371367A JP H04371367 A JPH04371367 A JP H04371367A JP 3145834 A JP3145834 A JP 3145834A JP 14583491 A JP14583491 A JP 14583491A JP H04371367 A JPH04371367 A JP H04371367A
- Authority
- JP
- Japan
- Prior art keywords
- heating chamber
- gas
- nitrogen gas
- organic
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910001873 dinitrogen Inorganic materials 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 64
- 239000007789 gas Substances 0.000 claims abstract description 34
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 15
- 239000003960 organic solvent Substances 0.000 abstract description 15
- 239000001301 oxygen Substances 0.000 abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000003517 fume Substances 0.000 abstract 1
- 239000011368 organic material Substances 0.000 abstract 1
- 239000000779 smoke Substances 0.000 description 12
- 239000005416 organic matter Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はチッソリフロー装置に係
り、加熱室に発生する煙や有機溶剤ガスなどの有機物や
、加熱室に侵入した酸素を分解して除去するようにした
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nitrogen reflow apparatus, which decomposes and removes organic substances such as smoke and organic solvent gas generated in a heating chamber, as well as oxygen that has entered the heating chamber.
【０００２】0002
【従来の技術】電子部品が搭載された基板はリフロー装
置の加熱室へ送られ、半田の加熱処理が行われる。この
加熱室内の空気は、基板を半田の溶融温度（一般に約１
８３℃）以上まで加熱するために、ヒータによりかなり
の温度（一般に約３００℃）まで加熱される。2. Description of the Related Art A board on which electronic components are mounted is sent to a heating chamber of a reflow apparatus, where a solder heat treatment is performed. The air in this heating chamber heats the board at the melting temperature of the solder (generally about 1
In order to heat the sample to a temperature of 83° C. or higher, it is heated by a heater to a considerable temperature (generally about 300° C.).
【０００３】0003
【発明が解決しようとする課題】上記のように加熱室内
の空気が高温度となることにより、基板に付着したごみ
類が燃焼し、煙が発生する。このため従来、加熱された
空気を少しずつ加熱室外へ排出して、煙の除去を行って
いた。[Problems to be Solved by the Invention] As the air inside the heating chamber reaches a high temperature as described above, dust adhering to the substrate burns and smoke is generated. For this reason, smoke has conventionally been removed by gradually exhausting the heated air outside the heating chamber.
【０００４】ところがこのように加熱された空気を加熱
室へ排出すると、それだけ熱効率が低下し、ランニング
コストが高くなる問題点があった。However, when the heated air is discharged into the heating chamber, there is a problem in that the thermal efficiency decreases and the running cost increases.
【０００５】また半田のヌレ性を改善するために、一般
にフラックスが使用されるが、加熱室内においてこのフ
ラックスが加熱されることにより、フラックスに含まれ
る有害な有機溶剤が蒸発して、加熱室内の有機溶剤ガス
濃度が次第に高くなり、この有機溶剤ガスが基板表面に
凝縮して半田のヌレ性に悪影響を生じやすい問題点があ
った。[0005] Flux is generally used to improve the wettability of solder, but when this flux is heated in the heating chamber, harmful organic solvents contained in the flux evaporate, causing the inside of the heating chamber to evaporate. There is a problem in that the organic solvent gas concentration gradually increases, and this organic solvent gas tends to condense on the substrate surface and adversely affect solder wettability.
【０００６】また、半田、回路パターン、電子部品の電
極等の金属物質の酸化を防止するために、加熱室にチッ
ソガスを送り、高温のチッソガス雰囲気中において半田
の加熱処理を行うことが知られている。[0006] Furthermore, in order to prevent oxidation of metal materials such as solder, circuit patterns, and electrodes of electronic components, it is known that nitrogen gas is sent to a heating chamber and the solder is heat-treated in a high-temperature nitrogen gas atmosphere. There is.
【０００７】ところがこのようなチッソリフロー装置に
おいては、加熱室の入口や出口から加熱室内に外部の空
気が徐々に侵入し、加熱室内の酸素濃度が次第に高くな
って、上記金属物質が酸化されやすく、また上記煙や有
機溶剤ガスを除去するために排気を行うと、チッソガス
が無駄に消耗されて、ランニングコストが高くなる問題
点があった。However, in such a nitrogen reflow apparatus, outside air gradually enters the heating chamber from the inlet and outlet of the heating chamber, and the oxygen concentration in the heating chamber gradually increases, making it easy for the metal substances mentioned above to be oxidized. Furthermore, when exhaust is performed to remove the smoke and organic solvent gas, nitrogen gas is wasted and running costs increase.
【０００８】したがって本発明は、加熱室に発生する煙
や有機溶剤ガスなどの有機物や、加熱室に侵入した酸素
を効果的に分解して除去できるチッソリフロー装置を提
供することを目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a nitrogen reflow apparatus that can effectively decompose and remove organic substances such as smoke and organic solvent gas generated in a heating chamber, as well as oxygen that has entered the heating chamber.
【０００９】[0009]
【課題を解決するための手段】本発明は、加熱室と、こ
の加熱室に配設されたヒータ及びファンと、この加熱室
に設けられた熱風の循環路と、この循環路に配設された
酸化触媒から成る有機物分解ユニットと、この加熱室に
チッソガスを供給するチッソ供給手段と、可燃性有機ガ
スを供給する可燃性有機ガス供給手段とからチッソリフ
ロー装置を構成している。[Means for Solving the Problems] The present invention provides a heating chamber, a heater and a fan disposed in the heating chamber, a hot air circulation path provided in the heating chamber, and a hot air circulation path disposed in the circulation path. The nitrogen reflow apparatus is composed of an organic substance decomposition unit comprising an oxidation catalyst, a nitrogen supply means for supplying nitrogen gas to the heating chamber, and a combustible organic gas supply means for supplying combustible organic gas.
【００１０】0010
【作用】上記構成において、加熱室内の加熱空気は、循
環路を循環し、その途中において、これに含まれる煙の
成分である有機物は有機物分解ユニットにより分解され
る。また外部から加熱室内に侵入してチッソガスに混入
した酸素は、有機物を酸化するための酸素として消費さ
れることから、労せずに除去される。[Operation] In the above structure, the heated air in the heating chamber circulates through the circulation path, and during the circulation, the organic substances contained in the air, which are components of smoke, are decomposed by the organic substance decomposition unit. Furthermore, oxygen that enters the heating chamber from the outside and mixes with the nitrogen gas is consumed as oxygen for oxidizing organic matter, and is therefore removed without effort.
【００１１】この場合、加熱室に可燃性有機ガスを供給
することにより、チッソリフローにおける不純物である
酸素の燃焼消費が著しく促進され、酸素をきわめて効率
よく分解除去できる。In this case, by supplying a flammable organic gas to the heating chamber, combustion consumption of oxygen, which is an impurity in the nitrogen reflow process, is significantly promoted, and oxygen can be decomposed and removed very efficiently.
【００１２】0012
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments Next, embodiments of the present invention will be described with reference to the drawings.
【００１３】図１は、チッソリフロー装置の側面図であ
る。１は加熱室であり、その内部には、ヒータ２、ファ
ン３、コンベヤ４が設けられている。コンベヤ４は、電
子部品６が搭載された基板５を入口９から出口１０へ向
かって搬送する。７は基板５をコンベヤ４に搬入する搬
入コンベヤ、８は搬出コンベヤである。FIG. 1 is a side view of the nitrogen reflow apparatus. Reference numeral 1 denotes a heating chamber, in which a heater 2, a fan 3, and a conveyor 4 are provided. The conveyor 4 conveys the board 5 on which the electronic component 6 is mounted from the entrance 9 toward the exit 10. 7 is a carry-in conveyor for carrying the substrate 5 into the conveyor 4, and 8 is a carry-out conveyor.
【００１４】１１は加熱室１の入口側に設けられたフー
ドであり、その内部には、ＵＶランプ１２と、ミラー１
３が配設されている。このＵＶランプ１２は、基板５に
電子部品６を仮接着するＵＶ樹脂を硬化させる。Reference numeral 11 denotes a hood provided on the entrance side of the heating chamber 1, and inside the hood there are a UV lamp 12 and a mirror 1.
3 are arranged. This UV lamp 12 cures the UV resin that temporarily adheres the electronic component 6 to the substrate 5.
【００１５】１４はフード１１に連結されたダクトであ
って、このダクト１４は加熱室１外へ延出している。１
５はダクトの途中に設けられたオゾン分解触媒である。
ＵＶ光が照射されると、有害なオゾンが発生することか
ら、この触媒１５はオゾンを分解して除去する。Reference numeral 14 denotes a duct connected to the hood 11, and this duct 14 extends outside the heating chamber 1. 1
5 is an ozone decomposition catalyst provided in the middle of the duct. When UV light is irradiated, harmful ozone is generated, so this catalyst 15 decomposes and removes ozone.
【００１６】３１は加熱室１にチッソガスを供給するチ
ッソガス供給手段である。このチッソガス供給手段３１
としては、空気からチッソガスを分解生成するチッソ発
生機、液体チッソタンク、高圧チッソガスボンベなどが
適用できる。Reference numeral 31 denotes nitrogen gas supply means for supplying nitrogen gas to the heating chamber 1. This nitrogen gas supply means 31
Applicable examples include a nitrogen generator that decomposes nitrogen gas from air, a liquid nitrogen tank, and a high-pressure nitrogen gas cylinder.
【００１７】３２は可燃性有機ガスを加熱室１に供給す
る可燃性有機ガス供給手段である。可燃性有機ガスは、
外部から加熱室１内に侵入した空気中の酸素を消費して
、酸素を除去するためのものである。この可燃性有機ガ
スとしては、加熱室１内の雰囲気温度である３００℃程
度で、酸化触媒（後述）の作用により酸化が促進される
ものが好ましく、例えば水素ガス（Ｈ２）やメタンガス
（ＣＨ４）が適用される。Reference numeral 32 denotes a combustible organic gas supply means for supplying flammable organic gas to the heating chamber 1. Flammable organic gas is
This is for consuming and removing oxygen from the air that has entered the heating chamber 1 from the outside. The combustible organic gas is preferably one that can be oxidized by the action of an oxidation catalyst (described later) at an ambient temperature of about 300°C in the heating chamber 1, such as hydrogen gas (H2) or methane gas (CH4). applies.
【００１８】なお上記チッソガス供給手段３１として、
チッソガスの純度を上げるために水素を混合したものが
知られているが、このようなチッソガス供給手段３１を
使用すれば、可燃性有機ガス供給手段として兼務させる
ことができる。[0018] As the nitrogen gas supply means 31,
It is known that nitrogen is mixed with hydrogen to increase the purity of nitrogen gas, but if such nitrogen gas supply means 31 is used, it can also serve as a combustible organic gas supply means.
【００１９】図２は加熱室１の断面図を示している。図
中、２１は加熱室１の両側部に配設された仕切板である
。この仕切板２１と加熱室１の側壁の間には、ヒータ２
２と有機物分解ユニット２３が設けられている。ファン
３が回転すると、ヒータ２，２２に加熱された空気は、
熱風となって破線矢印で示すような循環路を循環する。FIG. 2 shows a sectional view of the heating chamber 1. In the figure, 21 is a partition plate arranged on both sides of the heating chamber 1. Between this partition plate 21 and the side wall of the heating chamber 1, there is a heater 2.
2 and an organic matter decomposition unit 23 are provided. When the fan 3 rotates, the air heated by the heaters 2 and 22 is
It becomes hot air and circulates through the circulation path shown by the broken line arrow.
【００２０】この有機物分解ユニット２３には、酸化触
媒が収納されている。酸化触媒は、煙の成分である有機
物を吸着燃焼させて分解する。この吸着燃焼を促進する
ために、有機物分解ユニット２３の近傍にはヒータ２２
が配設されており、このヒータ２２により、有機物が吸
着燃焼しやすい温度である２００℃〜５００℃程度まで
空気を加熱する。[0020] This organic matter decomposition unit 23 houses an oxidation catalyst. The oxidation catalyst adsorbs, burns and decomposes organic matter that is a component of smoke. In order to promote this adsorption combustion, a heater 22 is installed near the organic matter decomposition unit 23.
This heater 22 heats the air to about 200°C to 500°C, which is a temperature at which organic substances are easily adsorbed and burned.
【００２１】また半田のヌレ性を改善するために、フラ
ックスが使用される。フラックスには有機溶剤が含まれ
ており、加熱室１内の空気が加熱されることにより、こ
の有機溶剤はガス化し、その濃度が大きくなると、基板
５の表面に凝集し、半田の加熱処理を阻害する。またこ
の有機溶剤ガスは有害であり、加熱室１外へ流出すると
、環境上の問題が生じる。Flux is also used to improve solder wetting properties. The flux contains an organic solvent, and when the air in the heating chamber 1 is heated, this organic solvent is gasified, and when its concentration becomes large, it aggregates on the surface of the substrate 5 and prevents the heat treatment of the solder. inhibit. Moreover, this organic solvent gas is harmful, and if it flows out of the heating chamber 1, it will cause environmental problems.
【００２２】ところがこのような有機溶剤ガスが有機物
分解ユニット２３の酸化触媒に接触すると、このガスも
吸着燃焼し、無害な水と炭酸ガスに分解される。However, when such organic solvent gas comes into contact with the oxidation catalyst of the organic matter decomposition unit 23, this gas is also adsorbed and burned and decomposed into harmless water and carbon dioxide gas.
【００２３】このような酸化触媒としては、例えばラン
タン、コバルト系のぺブロスカイトや、あるいは白金、
パラジウム、ロジウムなどが知られている。Examples of such an oxidation catalyst include lanthanum, cobalt-based perovskite, platinum,
Palladium, rhodium, etc. are known.
【００２４】上記構成において、基板５をコンベヤ４に
より搬送しながら、基板５を加熱すると、半田は加熱溶
融される。次いで、出口付近において基板５を冷却する
と、半田は固化し、電子部品６は基板５に接着される。In the above configuration, when the substrate 5 is heated while being conveyed by the conveyor 4, the solder is heated and melted. Next, when the board 5 is cooled near the exit, the solder is solidified and the electronic component 6 is bonded to the board 5.
【００２５】上記のように基板５が加熱されることによ
り、基板５に付着するごみ類は燃焼し、煙が発生するが
、ファン３が回転することにより、加熱室１内の空気は
、図２において破線矢印にて示すように熱風となって循
環しており、その途中において、有機物分解ユニット２
３により、有機成分である煙は分解除去される。また基
板５を加熱することにより生じた有害な有機溶剤も、有
機物分解ユニット２３により分解除去される。As the substrate 5 is heated as described above, the dust adhering to the substrate 5 is combusted and smoke is generated, but as the fan 3 rotates, the air inside the heating chamber 1 is 2, the hot air circulates as shown by the broken line arrow, and on the way, the organic matter decomposition unit 2
3, organic components of smoke are decomposed and removed. Further, harmful organic solvents generated by heating the substrate 5 are also decomposed and removed by the organic substance decomposition unit 23.
【００２６】このように本手段は、加熱室１内の循環路
を熱風を循環させながら、煙の分解除去を行うことがで
きるので、従来手段のように加熱室１内の煙を除去する
ために、加熱された空気を加熱室１外へ排出する必要は
なく、それだけ熱効率の向上を図ることができ、また有
機溶剤ガスも併せて分解除去することができる。As described above, the present means can decompose and remove smoke while circulating the hot air through the circulation path inside the heating chamber 1, so it is not necessary to remove the smoke inside the heating chamber 1 unlike the conventional means. Furthermore, it is not necessary to discharge the heated air to the outside of the heating chamber 1, so that the thermal efficiency can be improved accordingly, and the organic solvent gas can also be decomposed and removed.
【００２７】また加熱室１にチッソガスを供給して、チ
ッソガス雰囲気中において半田の加熱処理を行うチッソ
リフローの場合、加熱室１の入口９と出口１０から外部
空気が侵入し、加熱室１の酸化濃度が次第に高くなる。In addition, in the case of nitrogen reflow, in which nitrogen gas is supplied to the heating chamber 1 and the solder is heated in the nitrogen gas atmosphere, external air enters from the inlet 9 and outlet 10 of the heating chamber 1, causing oxidation of the heating chamber 1. The concentration increases gradually.
【００２８】ところが本装置によれば、加熱室１に侵入
してチッソガスに混入した空気中の酸素は、上記ごみ類
や、有機溶剤ガスを燃焼させるための酸素として積極的
に消費されるので、労せずして酸素を除去することがで
きる。However, according to this device, the oxygen in the air that has entered the heating chamber 1 and mixed with the nitrogen gas is actively consumed as oxygen for burning the above-mentioned garbage and organic solvent gas. Oxygen can be removed without much effort.
【００２９】しかも本装置は、加熱室１に水素ガスやメ
タンガスなどの可燃性有機ガスを積極的に供給している
ので、酸化触媒の作用と相まって、チッソリフローの不
純物である酸素を効果的に分解除去することができる。
因みに、可燃性有機ガスとして水素を使用する場合、酸
素と水素が反応して水蒸気が生成され、またメタンガス
を使用する場合は、炭酸ガスと水蒸気が生成されるが、
水蒸気や炭酸ガスは、リフローに殆ど悪影響を及ぼさな
い。Moreover, since this device actively supplies combustible organic gas such as hydrogen gas and methane gas to the heating chamber 1, combined with the action of the oxidation catalyst, it effectively removes oxygen, which is an impurity in the nitrogen reflow. Can be decomposed and removed. Incidentally, when hydrogen is used as a flammable organic gas, oxygen and hydrogen react to produce water vapor, and when methane gas is used, carbon dioxide gas and water vapor are produced.
Water vapor and carbon dioxide gas have almost no adverse effect on reflow.
【００３０】[0030]
【発明の効果】以上説明したように本発明は、加熱室と
、この加熱室に配設されたヒータ及びファンと、この加
熱室に設けられた熱風の循環路と、この循環路に配設さ
れた酸化触媒から成る有機物分解ユニットと、この加熱
室にチッソガスを供給するチッソガス供給手段と、可燃
性有機ガスを供給する可燃性有機ガス供給手段とからチ
ッソリフロー装置を構成しているので、加熱室内の加熱
された空気を加熱室外へ排出する必要はなく、循環路を
循環させながら煙や有機溶剤ガスを分解除去することが
でき、それだけ熱効率を向上させて、ランニングコスト
を下げることができ、更には外部から加熱室内に侵入し
た酸素も効果的に除去できる。As explained above, the present invention provides a heating chamber, a heater and a fan disposed in this heating chamber, a hot air circulation path provided in this heating chamber, and a hot air circulation path disposed in this circulation path. The nitrogen reflow apparatus is composed of an organic matter decomposition unit made of a oxidation catalyst, a nitrogen gas supply means for supplying nitrogen gas to this heating chamber, and a combustible organic gas supply means for supplying combustible organic gas. There is no need to discharge heated indoor air to the outside of the heating chamber, and smoke and organic solvent gas can be decomposed and removed while being circulated through the circulation path, improving thermal efficiency and lowering running costs. Furthermore, oxygen that has entered the heating chamber from the outside can also be effectively removed.
【図１】本発明に係るチッソリフロー装置の側面図[Fig. 1] Side view of a nitrogen reflow apparatus according to the present invention.
【図
２】本発明に係るチッソリフロー装置の断面図[Fig. 2] Cross-sectional view of the nitrogen reflow apparatus according to the present invention
１ 加熱室 ２ ヒータ ３ ファン ２３ 有機物分解ユニット ３１ チッソガス供給手段 ３２ 可燃性有機ガス供給手段 1 Heating chamber 2 Heater 3 Fan 23 Organic matter decomposition unit 31 Nitrogen gas supply means 32 Flammable organic gas supply means
Claims (1)
及びファンと、この加熱室に設けられた熱風の循環路と
、この循環路に配設された酸化触媒から成る有機物分解
ユニットと、この加熱室にチッソガスを供給するチッソ
ガス供給手段と、可燃性有機ガスを供給する可燃性有機
ガス供給手段とから成ることを特徴とするチッソリフロ
ー装置。Claim 1: An organic substance decomposition unit comprising a heating chamber, a heater and a fan disposed in the heating chamber, a hot air circulation path provided in the heating chamber, and an oxidation catalyst disposed in the circulation path. A nitrogen reflow apparatus comprising: a nitrogen gas supply means for supplying nitrogen gas to the heating chamber; and a combustible organic gas supply means for supplying a combustible organic gas.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145834A JP2990857B2 (en) | 1991-06-18 | 1991-06-18 | Chisso reflow device |
| US07/835,332 US5195674A (en) | 1991-02-14 | 1992-02-14 | Reflow system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3145834A JP2990857B2 (en) | 1991-06-18 | 1991-06-18 | Chisso reflow device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04371367A true JPH04371367A (en) | 1992-12-24 |
| JP2990857B2 JP2990857B2 (en) | 1999-12-13 |
Family
ID=15394191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3145834A Expired - Fee Related JP2990857B2 (en) | 1991-02-14 | 1991-06-18 | Chisso reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2990857B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303318A (en) * | 2005-04-22 | 2006-11-02 | Suzuki Co Ltd | Reflow furnace |
| JP2006351570A (en) * | 2005-06-13 | 2006-12-28 | Suzuki Co Ltd | Reflow furnace |
| JP2007273571A (en) * | 2006-03-30 | 2007-10-18 | Tamura Furukawa Machinery:Kk | Reflow furnace |
| US8883667B2 (en) | 2006-10-11 | 2014-11-11 | Nikki-Universal Co., Ltd. | Purification catalyst for reflow furnace gas, method for preventing contamination of reflow furnace, and reflow furnace |
-
1991
- 1991-06-18 JP JP3145834A patent/JP2990857B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303318A (en) * | 2005-04-22 | 2006-11-02 | Suzuki Co Ltd | Reflow furnace |
| JP2006351570A (en) * | 2005-06-13 | 2006-12-28 | Suzuki Co Ltd | Reflow furnace |
| JP2007273571A (en) * | 2006-03-30 | 2007-10-18 | Tamura Furukawa Machinery:Kk | Reflow furnace |
| US8883667B2 (en) | 2006-10-11 | 2014-11-11 | Nikki-Universal Co., Ltd. | Purification catalyst for reflow furnace gas, method for preventing contamination of reflow furnace, and reflow furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2990857B2 (en) | 1999-12-13 |
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