JPH04361079A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH04361079A
JPH04361079A JP3136735A JP13673591A JPH04361079A JP H04361079 A JPH04361079 A JP H04361079A JP 3136735 A JP3136735 A JP 3136735A JP 13673591 A JP13673591 A JP 13673591A JP H04361079 A JPH04361079 A JP H04361079A
Authority
JP
Japan
Prior art keywords
protective film
substrate
thermal head
cover
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3136735A
Other languages
Japanese (ja)
Other versions
JP2742338B2 (en
Inventor
Fumiaki Tagashira
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP3136735A priority Critical patent/JP2742338B2/en
Publication of JPH04361079A publication Critical patent/JPH04361079A/en
Application granted granted Critical
Publication of JP2742338B2 publication Critical patent/JP2742338B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To prevent electrostatic discharge failure of a thermal head protective film by making a cover of conductive material, making a piece thereof contact to the protective film, and connecting the cover to ground.
CONSTITUTION: A metallic heat sink 3 contacts to an insulating (alumina) substrate 1-1 of a head substrate 1 and to a print substrate 2-2 of a circuit substrate 2. The heat sink 3 is connected to an earth potential point 13. Accordingly, as a protective film 8 of a thermal head and the earth point 13 are connected electrically by route of a protective film 8 of the thermal head will not be electrified. In addition, as there is no conductor pattern other than ground line at the bottom face of a part 4-1 contacting to the protective film 8 of the metallic cover 4, electric current does not leak to the metallic cover from a conductor pattern 7 of the substrate 1 even if pinholes are generated on the protective film 8.
COPYRIGHT: (C)1992,JPO&Japio
JP3136735A 1991-06-07 1991-06-07 Thermal head Expired - Fee Related JP2742338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3136735A JP2742338B2 (en) 1991-06-07 1991-06-07 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3136735A JP2742338B2 (en) 1991-06-07 1991-06-07 Thermal head

Publications (2)

Publication Number Publication Date
JPH04361079A true JPH04361079A (en) 1992-12-14
JP2742338B2 JP2742338B2 (en) 1998-04-22

Family

ID=15182284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3136735A Expired - Fee Related JP2742338B2 (en) 1991-06-07 1991-06-07 Thermal head

Country Status (1)

Country Link
JP (1) JP2742338B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009132069A (en) * 2007-11-30 2009-06-18 Tdk Corp Thermal head, manufacturing method for thermal head, and printing apparatus
JP2009184175A (en) * 2008-02-05 2009-08-20 Tdk Corp Thermal head, method for manufacturing the same, and image printer
US7791625B2 (en) * 2007-11-30 2010-09-07 Tdk Corporation Thermalhead, method for manufacture of same, and printing device provided with same
JP2011042163A (en) * 2009-07-24 2011-03-03 Rohm Co Ltd Thermal print head, thermal printer and printer system
JP5385456B2 (en) * 2010-04-26 2014-01-08 京セラ株式会社 Thermal head
JP2016016552A (en) * 2014-07-07 2016-02-01 サトーホールディングス株式会社 Printer
US10507655B2 (en) * 2017-04-13 2019-12-17 Seiko Epson Corporation Liquid ejecting head, manufacturing method thereof, and liquid ejecting apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166430U (en) * 1987-04-18 1988-10-28
JPH02215546A (en) * 1989-02-16 1990-08-28 Matsushita Electric Ind Co Ltd Thermal head

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166430U (en) * 1987-04-18 1988-10-28
JPH02215546A (en) * 1989-02-16 1990-08-28 Matsushita Electric Ind Co Ltd Thermal head

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009132069A (en) * 2007-11-30 2009-06-18 Tdk Corp Thermal head, manufacturing method for thermal head, and printing apparatus
US7791625B2 (en) * 2007-11-30 2010-09-07 Tdk Corporation Thermalhead, method for manufacture of same, and printing device provided with same
JP4556991B2 (en) * 2007-11-30 2010-10-06 Ｔｄｋ株式会社 Thermal head, thermal head manufacturing method and printing apparatus
JP2009184175A (en) * 2008-02-05 2009-08-20 Tdk Corp Thermal head, method for manufacturing the same, and image printer
JP2011042163A (en) * 2009-07-24 2011-03-03 Rohm Co Ltd Thermal print head, thermal printer and printer system
JP5385456B2 (en) * 2010-04-26 2014-01-08 京セラ株式会社 Thermal head
JP2016016552A (en) * 2014-07-07 2016-02-01 サトーホールディングス株式会社 Printer
US10507655B2 (en) * 2017-04-13 2019-12-17 Seiko Epson Corporation Liquid ejecting head, manufacturing method thereof, and liquid ejecting apparatus

Also Published As

Publication number Publication date
JP2742338B2 (en) 1998-04-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees