JPH0434747U - - Google Patents
Info
- Publication number
- JPH0434747U JPH0434747U JP7565590U JP7565590U JPH0434747U JP H0434747 U JPH0434747 U JP H0434747U JP 7565590 U JP7565590 U JP 7565590U JP 7565590 U JP7565590 U JP 7565590U JP H0434747 U JPH0434747 U JP H0434747U
- Authority
- JP
- Japan
- Prior art keywords
- container
- weight
- parts
- lead terminal
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7565590U JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7565590U JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0434747U true JPH0434747U (US20090163788A1-20090625-C00002.png) | 1992-03-23 |
JP2518721Y2 JP2518721Y2 (ja) | 1996-11-27 |
Family
ID=31616422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7565590U Expired - Lifetime JP2518721Y2 (ja) | 1990-07-16 | 1990-07-16 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2518721Y2 (US20090163788A1-20090625-C00002.png) |
-
1990
- 1990-07-16 JP JP7565590U patent/JP2518721Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2518721Y2 (ja) | 1996-11-27 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |