JPH0433360A - Semiconductor device cooler - Google Patents

Abstract

PURPOSE:To improve a heat diffusion efficiency and obtain a high heat radiation effect by a method wherein a rotary fin which has a plurality of rotary blades and is made to rotate by the application of an external wind pressure is provided on the radiation plane of a semiconductor device. CONSTITUTION:A radiation fin 7 having protrusions with certain intervals is attached to the surface of a heat transmitting plate 3. A shaft 8 is fixed to the center part of the radiation fin 7 with screws. A rotary fin 7 is supported by the shaft 8 with bearings 9 therebetween. A plurality of rotary blades are attached to the rotary fin 10 symmetrically and radially along its vertical direction. If an air flow is produced by the rotation of a fan 11, the rotary fin 10 is made to rotate by a wind pressure caused by the air flow. By the rotation of the rotary fin 10, the heat coming out of the radiation fins 10 is made to ascend and the heat is diffused. With this constitution, heat is radiated by the fan 11 not only along a horizontal direction but also along a vertical direction to improve a heat radiation efficiency. Therefore, the temperature rise of the air supplied to a semiconductor device provided behind the radiation fin can be reduced, so that the cooling efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology for cooling semiconductor devices, and in particular to a technology that can be effectively used to improve the cooling efficiency of semiconductor devices that are mounted in high density.

[Conventional technology]

For example, logic LSIs (Large Scale Integrated Circuits) used in large-scale convenience stores generate a large amount of heat due to their high-density packaging, and require some kind of heat dissipation means. As this heat dissipation means, for example, "Nikkei Electronics Special Issue J
As described in pages 136 to 137 published on June 11, 1984, there is one in which a plurality of heat radiation pins are erected on the heat radiation surface to increase the heat radiation area. Other methods include installing a radiator with multiple protrusions set up at regular intervals, water-cooling that circulates water around the radiator, or forced air cooling that uses an electric fan to blow air onto the radiator. .

By the way, the present inventor has studied the problem of improving the efficiency of heat dissipation due to the increase in the size of semiconductor devices and the cooling of applied devices using a large number of semiconductor devices.

The following are the techniques studied by the present inventor, and the outline thereof is as follows.

That is, in a large computer, a large number of semiconductor devices such as logic LSIs are arranged on a plane. and,
Each semiconductor device is cooled by, for example, blowing air through a heat radiating section using a fan driven by a motor.

[Problem to be solved by the invention]

However, in the air cooling method using a fan as described above, as a means to improve heat dissipation, the heat radiator attached to each semiconductor device is increased in size, or a sufficient air volume is provided to semiconductor devices located far from the fan. Although countermeasures such as increasing the number of fans have been taken, the inventor of the present invention has found that there is a problem in that this increases the size and cost of the device.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a technology that can achieve sufficient heat dissipation while minimizing the size of the fan and radiator.

The above objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, a cooler that cools a semiconductor device by a cooling means other than leaving it in the air, and has a plurality of rotary blades and a rotating fin that rotates in response to wind pressure applied from the outside is provided on the heat dissipation surface of the semiconductor device. There is.

[Effect]

According to the above-described means, the fan that rotates in response to cooling air applied from the outside causes not only horizontal heat diffusion due to the wind, but also heat diffusion perpendicular to this direction.

This improves heat diffusion efficiency and provides a high heat dissipation effect.

[Embodiment 1] Fig. 1 is a sectional view showing an embodiment of a cooler for a semiconductor device according to the present invention, and Figs. 2 and 3 are a front view and a plan view showing the usage state of the embodiment of Fig. 1. It is.

The semiconductor device 1 includes a flat base 2 with an opening formed in the center, a heat conductive plate 3 bonded to the upper surface of the base 2 and having a pedestal part that can be expanded in the opening, and a heat conductive plate 3 attached to the pedestal part. It is configured to include a pellet 4 to be attached, a plurality of lead bins 5 erected around the periphery of the base 2, and a cap 6 joined to the base 2 so as to cover the pellet 4 and its periphery.

A heat dissipation fin 7 made of aluminum and having protrusions provided at regular intervals is attached to the surface of the heat conduction plate 3, and a bearing 8 is supported by a screw in the center of the heat dissipation fin 7. A rotary fin 10 is pivotally supported by the bearing 8 via a bearing 9.

The rotary fin 10 has a plurality of rotary blades installed symmetrically and radially with respect to the axis in the vertical direction. The rotating fin 10 may be made of a material having a low specific gravity, such as a metal such as aluminum or a synthetic resin material such as plastic.

Furthermore, each rotor blade of the rotary fin 10 is installed with an inclination in the vertical direction (furthermore, with a twist as necessary), so that it is easy to receive rotational energy from wind force applied from the horizontal direction. That's what I do.

In the above configuration, as shown in FIGS. 2 and 3, for a semiconductor device installed in a device such as a computer,
A fan 11 is attached to the housing so that cooling air obtained by rotation comes into contact with the fan 11. When the rotation of the fan 11 generates an airflow as shown in the figure, the rotating fins 10 rotate due to the wind pressure caused by this airflow.

As the rotating fins 1O rotate, the heat emitted from the heat radiation fins 7 rises, and heat is dissipated.

Thereby, in addition to the heat dissipation in the horizontal direction by the fan 11, heat dissipation is performed in the vertical direction, thereby increasing the heat dissipation effect.

In addition, in the past, all the heat dissipated by semiconductor devices flowed horizontally and was supplied as cooling air to semiconductor devices placed at the rear, so as the airflow moved toward the rear, the temperature rose and the cooling efficiency decreased. I was letting it happen. However, according to the present invention, part of the heat dissipation is distributed in the vertical direction, so that
It is possible to reduce the temperature rise of the air supplied to the semiconductor device disposed at the rear, and it is possible to improve the cooling efficiency.

FIG. 4 shows a modification of the embodiment shown in FIG. This embodiment is characterized in that a sirocco fan 12 is used, whereas the rotating fin 10 of the embodiment shown in FIG. 1 is in the form of a water wheel.

In this case, the heat dissipation by the sirocco fan 12 is in the horizontal direction, but it disturbs the hot air flow due to the heat radiation fins 7 or increases the air flow velocity on the heat radiation fins 7, so that the heat dissipation effect is improved compared to the conventional configuration. I can do it.

[Embodiment 2] FIG. 5 is a sectional view showing another embodiment of the present invention. Note that in this embodiment, the same reference numerals are used for the same parts as those used in FIG. 1, and therefore, redundant explanation will be omitted below.

In the embodiments described above, the rotary fins 10 are rotated by the separately provided fan 11, but in this embodiment, the rotary fins 10 are directly rotated by the motor 13.

In this configuration, the bearing 8 and the bearing 9 are unnecessary,
A motor 13 will be provided in place of these. Then, the holding portion of the rotating fin 10 is fixed to the rotating shaft of the motor 13 with screws or the like.

The motor 13 uses an ultra-compact DC motor.
The number of revolutions can be easily changed by simply changing the voltage, thereby making it possible to obtain any amount of generated air.

In this embodiment, the fan 11 can also be used together with the motor 13.
Cooling by chisel is also possible. When using only the motor 13, the power consumption (i.e. heat generation amount) of the applied semiconductor device
This can be dealt with by setting the size of the rotating fin 10 or the rotational speed of the motor accordingly.

In addition, when using the fan 11 together, this fan 11
The rotating fins 10 may be used to compensate for the insufficient heat dissipation due to the air volume given by the rotary fins 10.

In the embodiment shown in FIG. 5, since the fan shape is horizontally long,
It is most suitable for semiconductor devices having a rectangular shape.

Above, the invention made by the present inventor has been specifically explained based on Examples, but it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. stomach.

For example, in the above embodiment, the semiconductor device 1 has the heat radiation fin 7
However, it may be attached directly to the heat conductive plate 3.

Further, although an example in which the number of rotating fins 10 is one is shown, it is also possible to provide a plurality of rotating fins depending on the size of the semiconductor device.

In the above description, the invention made by the present inventor was mainly applied to LSI, which is its field of use, but the invention is not limited to this, for example,
It can also be applied to other semiconductor devices (power transistors, silices, diodes, etc.) and projection lamps.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical ones are as follows.

That is, a cooler that cools a semiconductor device by a cooling means other than leaving it in the air, and has a plurality of rotary blades and a rotating fin that rotates in response to wind pressure applied from the outside is provided on the heat dissipation surface of the semiconductor device. So,
It becomes possible to improve heat dissipation efficiency. Furthermore, it is possible to reduce the installation space and downsize the electric cooling fan.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of a cooler for a semiconductor device according to the present invention, FIG. 2 is a front view showing the usage state of the embodiment of FIG. 1, and FIG. 3 is a plan view of FIG. FIG. 4 is a sectional view showing a modification of the embodiment shown in FIG. 1, and FIG. 5 is a sectional view showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 2...Base, 3...Heat conductive plate, 4...Bellet, 5...Lead bin, 6...
Cap, 7...Radiation fin, 8...Bearing, 9...
・Bearing, 10...Rotating fin, 11...Fan, 12...Sirocco fan, 13...Motor. Agent: Patent Attorney Masaru Ogawa Figure 7: Radiation fin 13: Motor 6: Cap 11: Fan 7

Claims (1)

[Scope of Claims] 1. A cooler that cools a semiconductor device by a cooling means other than leaving it to stand, the semiconductor device having a plurality of rotary blades and a rotating fin that rotates under wind pressure applied from the outside. A cooler for a semiconductor device, characterized in that the cooler is provided on a heat radiation surface of the semiconductor device. 2. The cooler for a semiconductor device according to claim 1, wherein the rotating fin comprises a bearing fixed to the heat radiation surface and a bearing rotatably supporting the rotor blade on the bearing. 3. A cooler that cools a semiconductor device by a cooling means other than leaving it naturally, which includes a motor installed on or near the heat radiation surface of the semiconductor device, and the motor as a drive source. A cooler for a semiconductor device, comprising: a rotating fin having a plurality of rotating rotor blades.