JPH0431283B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a flooring material, and more particularly to a method for manufacturing a flooring material having a chip pattern.

[Conventional technology]

Conventionally, flooring with a chip pattern, which is made by arranging and integrating a large number of chips made of synthetic resin chips or small pieces of natural materials on the surface of the flooring material, has been mainly covered with a chip pattern on the entire surface. Ta. Therefore, various studies have been conducted on techniques for producing flooring materials whose entire surface is covered with a chip pattern by arranging chips densely on the surface of a base material layer and integrating the chips with the base material layer. It had been.

For example, a backing material coated with synthetic resin paste is placed on a moving table, and a large number of chips held in close rows on a roll are transferred to the paste.
One such method is sintering and hot pressing. According to this method, a large number of chips arranged closely so as to cover the entire surface of the base material layer are integrated with the base material layer, so that a flooring material whose entire surface is covered with a chip pattern is manufactured.

However, in recent years, in addition to flooring whose entire surface is covered with a chip pattern, there has been a demand for flooring with chip patterns scattered over the surface, and the development of technology to manufacture such flooring has become necessary. It's long awaited.

[Problem that the invention seeks to solve]

However, as mentioned above, in the past, flooring materials whose entire surface was covered with a chip pattern were the mainstream.
Not much research has been done on the method of producing flooring materials with chip patterns scattered on the surface, and in order to meet the above requirements, it is necessary to manually place chips at intervals on a pellet layer made of synthetic resin. A method was used in which the pellets were arranged with openings, then the pellet layer was sintered to form a base material layer, and then hot pressed. However, with this method, it takes a lot of effort to line up the chips manually.
There are some problems that make it unsuitable for mass production.

The present invention solves this problem by arranging large chips at intervals on a synthetic resin powder layer or pellet layer that is continuously moved on a moving table, and then carrying out the above-mentioned sintering process. The purpose of the present invention is to provide a method for continuously manufacturing a flooring material having chip patterns sparsely scattered on its surface by hot pressing.

[Means for solving problems]

In order to solve the above-mentioned problems, the method of the present invention provides a flooring manufacturing method in which synthetic resin powder or pellets are fed onto a continuously moving movable table and are hot-pressed to a substantially uniform thickness. The gist of this method is to intermittently feed the chips onto the diaphragm, move them while vibrating them, and continuously feed them to the powder layer or pellet layer while maintaining a distance between the chips.

[Effect]

According to the above means, even if many large chips are fed onto the diaphragm at once, the chips are gradually lined up sparsely while vibrating on the diaphragm, and then the chips are kept spaced apart from each other. In this state, the pellets are continuously fed from the diaphragm onto the pellet layer. Therefore, through subsequent sintering and hot pressing, a flooring material with chip pattern patterns sparsely scattered on the surface is manufactured. Furthermore, since large chips are intermittently fed to the diaphragm, the chips are continuously fed from the diaphragm to the powder layer or pellet layer while maintaining appropriate intervals.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

The method of the present invention can be carried out using the continuous flooring manufacturing apparatus illustrated in FIG. In this device, reference numeral 1 denotes a movable table consisting of an endless belt wound around rollers 2, 2, and is continuously moved at a predetermined speed in a fixed direction (to the right in the drawing) by a drive source (not shown). Synthetic resin pellets (or synthetic resin powder) stored in a hopper 3 are continuously fed to the moving table 1. The pellets fed onto the movable table 1 move on the movable table 1, and are smoothed to a uniform thickness by the action of the leveling plate 4 to form a pellet layer P. Next, chips C are fed onto this pellet layer P. Chips C are stored in a hopper 5, and the chips C falling from the hopper 5 fall onto a diaphragm 7 through a gate 6 that opens and closes intermittently, and move on this diaphragm 7 while vibrating to form pellets. It is sent to layer P. By moving the large chips C while vibrating on the diaphragm 7 in this way, even if the chips C are heaped up when they fall onto the diaphragm 7 through the gate 6, the diaphragm 7
While moving over the top, the mountain collapses, and the individual chips C, which were initially stacked one on top of the other, gradually become scattered and scattered, and the chips C maintain a distance between each other. Therefore, the chips C slide apart from the diaphragm 7, and together with the fact that the pellet layer P is continuously moving on the moving table 1, the chips C that are fed to the pellet layer P are The distance between the pellet layers P in the moving direction and the width direction is maintained. Chips C are intermittently supplied to the diaphragm 7, but the timing of the supply is set before the chips previously supplied to the chip drop location on the diaphragm 7 run out. If the chips C are fed to the diaphragm at this timing, the chips C fed to the pellet layer P will not stop, and the chips C will be scattered at substantially uniform intervals over the entire length of the pellet layer P. In order to change the mutual spacing between the chips C fed to the pellet layer P, it is effective to change the amplitude of the diaphragm 7, the length of the diaphragm 7, and the inclination angle of the diaphragm 7, for example. The gate 6 that opens and closes in a batch manner includes a gate 6 that opens and closes a pair of swinging lids 61, 61 simultaneously between the position of the imaginary line and the position of the solid line in the figure, as illustrated in FIG. , roll type, etc. can be used. The swinging lid 61 has approximately the same width as the pellet layer, but the swinging plate 61 itself may be in the form of a single plate, or may be divided into several pieces so that they can move separately.

The pellet layer P to which the chips C have been fed then passes through a sintering furnace 8. In the sintering furnace 8, the pellet layer P is heated, the surface layer of the pellet is melted, and the pellets are thermally fused and integrated. As a result, the pellet layer P becomes a strip-shaped base material layer 9. Therefore,
In the base material layer 9, the center of the pellet, that is,
While passing through the sintering furnace 8, portions that are not melted and remain as they were will be scattered densely. Next, the base material layer 9 is hot pressed together with the chips C scattered thereon. Hot pressing may be carried out by passing the base material layer 9 between a pair of upper and lower rolls 10 under elevated temperature conditions, or may be carried out in batches using a press plate. By this hot pressing, the gaps existing between the pellets are filled, the surface of the base layer 9 becomes smooth, and the chips C are embedded in the base layer 9. After the base layer 9 is cooled and hardened, a predetermined process such as attaching a backing material to the back surface of the base layer 9 is performed. The predetermined treatments include attaching a backing material and surface coating with acrylic resin or the like.

FIG. 3 illustrates a tile-shaped chip-patterned flooring material A obtained by cutting a long flooring material continuously manufactured by the above method into rectangular pieces, for example, 30 cm square. In the figure, 11 is a backing material. Such a chip-patterned flooring material A has chips C scattered on the surface of the base material layer 9, and the base material layer 9 between the chips C.
The surface of the pellet is densely scattered with portions where the pellet was not melted during the sintering described above. Therefore, it becomes a flooring material with a surface pattern that is unprecedented. In the chip-patterned flooring A of the present invention, if the chips C and the base material layer 9 have different surface smoothness, the flooring as a whole will exhibit an anti-slip effect. Also suitable for materials such as wood. Furthermore, even if the chips C are embedded in the base material layer 9 by the above-mentioned hot press, the chips C may bulge out from the base material layer 9. It can provide flooring material and is also useful in terms of anti-slip properties.

The composition of the synthetic resin pellets used in the method of the present invention may be, for example, 100 parts of PVC, 50 parts of DOP, and 100 to 150 parts of calcium carbonate, and pellets having a size of about 5 to 10 cm can be suitably used.
To color the base layer, an appropriate amount of pigment is added to the above composition. When a pigment is added, a difference in color appears between the unmelted portions of the pellets that are densely scattered on the surface of the base material layer and the molten portions, and this creates a difference in color between the chips that are sparsely scattered on the surface of the base material layer. It interacts with the pattern to create a new surface pattern that has never been seen before. Further, as chips, it is possible to use not only synthetic resin chips made by cutting synthetic resin such as PVC plates, but also chips made from crushed natural materials such as wood chips and minerals. The type of chip to be used should be determined appropriately by taking into consideration the color tone and design of the area where the flooring material is to be installed, as well as the properties required of the flooring material.

〔Effect of the invention〕

As is clear from the above explanation, the method of the present invention can be carried out by only making slight improvements to the conventional chip patterned flooring manufacturing equipment, so the method of the present invention can be carried out without making any major changes to the conventional equipment. It becomes possible to continuously mass-produce flooring materials with chip patterns scattered on the surface at low cost. In addition, the chip pattern of the chip patterned flooring material manufactured by the method of the present invention is a pattern that has not been widely used in the past, and is not only a new pattern, but also has a difference in the slipperiness between the chip and the base material layer. Because it can also exhibit anti-slip effects, it is suitable for floors that are installed in places where elegance and non-slip properties are required, such as sloping aisles in condominiums and department stores, poolsides, etc. Ideal as a material.

[Brief explanation of drawings]

Fig. 1 is a schematic side view showing a continuous flooring manufacturing equipment, Fig. 2 is a schematic side view illustrating a gate, and Fig. 3 is a schematic side view showing a continuous flooring manufacturing equipment.
The figure is a perspective view of a chip-patterned flooring material manufactured by the method of the present invention. DESCRIPTION OF SYMBOLS 1...Moving table, 4... Leveling plate, 6... Gate, 7... Vibration plate, 8... Sintering furnace, 9... Base material layer, 10... Roll for hot press, P... Pellet Layer, C...chip layer.

Claims (1)

[Claims] 1. In a flooring manufacturing method in which synthetic resin powder or pellets fed onto a continuously moving moving table are hot-pressed to a substantially uniform thickness, chips larger than the pellets are intermittently fed onto a diaphragm. A method for manufacturing flooring with a patterned chip pattern, characterized in that the chips are continuously fed to the powder layer or pellet layer by moving the chips while vibrating and maintaining a gap between the chips.