JPH04290248A - Cutting method of semiconductor element - Google Patents

Cutting method of semiconductor element

Info

Publication number
JPH04290248A
JPH04290248A JP3054442A JP5444291A JPH04290248A JP H04290248 A JPH04290248 A JP H04290248A JP 3054442 A JP3054442 A JP 3054442A JP 5444291 A JP5444291 A JP 5444291A JP H04290248 A JPH04290248 A JP H04290248A
Authority
JP
Japan
Prior art keywords
led array
cutting
dicing
array chips
cutting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3054442A
Other languages
Japanese (ja)
Inventor
Masahiro Ito
昌弘 伊藤
Yoshikatsu Asano
浅野 義勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Japan Ltd
Original Assignee
Eastman Kodak Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Japan Ltd filed Critical Eastman Kodak Japan Ltd
Priority to JP3054442A priority Critical patent/JPH04290248A/en
Publication of JPH04290248A publication Critical patent/JPH04290248A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To cut a plurality of LED array chips without producing chippings and to obtain the LED array chips for LED printer head use. CONSTITUTION:When a plurality of LED array chips 2 formed on a semiconductor wafer 1 are cut by a dicing process, scribing lines 5 are formed at gaps between the LED array chips so as to match the width of a blade 3 used at a dicing operation. When the dicing operation is performed along the scribing lines, it is possible to prevent the blade 3 from coming into contact with the surface of the LED array chips and to restrain chippings from being produced.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は半導体素子切削方法、特
にチッピングの発生を抑止する切削方法の改良に関する
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a semiconductor device, and more particularly to an improvement in a cutting method for suppressing the occurrence of chipping.

【0002】0002

【従来の技術】従来より、LEDプリンタヘッドに使用
されるLEDアレイは半導体ウエーハ上に形成された複
数のLEDアレイチップを切断することにより得ている
。以下、図2を用いて従来の半導体素子切削方法を説明
する。
2. Description of the Related Art Conventionally, LED arrays used in LED printer heads have been obtained by cutting a plurality of LED array chips formed on a semiconductor wafer. A conventional semiconductor device cutting method will be described below with reference to FIG.

【0003】まず、図2(a)に示されるように半導体
ウエーハ1上に複数の発光部を有する各LEDアレイチ
ップ2が形成され、各LEDアレイチップ2の間隔は切
断のために各発光部の間隔よりも広く設定される。なお
、図2(b)には図1(a)の断面図が示されている。 そして、図2(c)に示されるように各LEDアレイチ
ップ2の間隔で先端にダイヤモンドを使用したブレード
3でダイシングングにより切断する。
First, as shown in FIG. 2(a), each LED array chip 2 having a plurality of light emitting parts is formed on a semiconductor wafer 1, and the intervals between each LED array chip 2 are adjusted so that each light emitting part is set wider than the interval between. Note that FIG. 2(b) shows a cross-sectional view of FIG. 1(a). Then, as shown in FIG. 2(c), the LED array chips 2 are cut by dicing using a blade 3 having a diamond tip at intervals between each LED array chip 2.

【0004】0004

【発名が解決しようとする課題】しかしながら、この従
来の半導体切削方法によれば図2(d)に示されるよう
に切断工程時にチップ表面の切断面にはチッピング4が
生じてしまうという問題があった。
[Problem to be solved by naming] However, this conventional semiconductor cutting method has the problem that chipping 4 occurs on the cut surface of the chip surface during the cutting process, as shown in FIG. 2(d). there were.

【0005】特に、近年の高密度化の要求に応えるため
に発光部のピッチを小さくする場合には、各LEDアレ
イチップの端と端の発光部も同様のピッチで整列する必
要があり、従ってチッピングが発光部に近くなり輝度低
下や寿命の低下を引き起こしてしまう問題があった。
[0005] In particular, when reducing the pitch of the light emitting parts to meet recent demands for higher density, it is necessary to align the light emitting parts at the ends of each LED array chip with the same pitch. There is a problem in that the chipping is close to the light emitting part, causing a decrease in brightness and a decrease in life.

【0006】本発明は上記従来技術の有する課題に鑑み
なされたものであり、その目的は切断時のチッピングを
抑止して輝度向上、寿命向上を図ることが可能な半導体
素子切削方法を提供することにある。
The present invention has been made in view of the above-mentioned problems of the prior art, and its purpose is to provide a semiconductor device cutting method that can suppress chipping during cutting and improve brightness and life. It is in.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明の半導体素子切削方法は半導体ウエーハ上の
ダイシングすべき領域にスクライブラインを形成するス
クライブライン形成工程と、スクライブラインに沿って
前記半導体ウエーハを切断するダイシング工程とを有す
ることを特徴とする。
[Means for Solving the Problems] In order to achieve the above object, the semiconductor device cutting method of the present invention includes a scribe line forming step of forming a scribe line in a region to be diced on a semiconductor wafer, and a step of forming a scribe line in a region to be diced on a semiconductor wafer; The method is characterized by comprising a dicing step of cutting the semiconductor wafer.

【0008】[0008]

【作用】このように、本発明の半導体素子切削方法は、
LEDアレイチップの切断を行うダイシング切断工程に
先立ち、切断領域にスクライブラインを形成しておき、
このスクライブラインによりチッピングを発光部から一
定の距離で抑止するものである。
[Operation] As described above, the semiconductor device cutting method of the present invention
Prior to the dicing cutting process for cutting the LED array chip, scribe lines are formed in the cutting area,
This scribe line prevents chipping at a certain distance from the light emitting section.

【0009】[0009]

【実施例】以下、図面を用いながら本発明に係る半導体
素子切削方法の好適な実施例を説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the semiconductor device cutting method according to the present invention will be described below with reference to the drawings.

【0010】図1には本実施例の切削説明図が示されて
いる。図2(a)と同様に半導体ウエーハ1上に複数の
発光部を有する各LEDアレイチップ2が形成され、各
LEDアレイチップ2の間隔は切断のために各発光部の
間隔よりも広く設定される。そして、ダイシングにより
両LEDアレイチップ2を切断するのだが、本実施例に
おいて特徴的なことは切断を行うダイシング工程に先立
ち、図1(a)に示されるようにブレード3の幅に合わ
せてその両端にスクライブによるラインを5を形成する
FIG. 1 shows a cutting diagram of this embodiment. Similarly to FIG. 2(a), each LED array chip 2 having a plurality of light emitting parts is formed on a semiconductor wafer 1, and the interval between each LED array chip 2 is set wider than the interval between each light emitting part for cutting. Ru. Then, both LED array chips 2 are cut by dicing, but what is unique about this embodiment is that, prior to the dicing process, the LED array chips 2 are cut by dicing to match the width of the blade 3, as shown in FIG. Lines 5 are formed by scribing on both ends.

【0011】そして、図1(b)に示されるようにこの
スクライブライン5に沿ってブレード3によりダイシン
グを行い、両LEDアレイチップを切断する。
Then, as shown in FIG. 1(b), dicing is performed with the blade 3 along the scribe line 5 to cut both LED array chips.

【0012】この時、ブレード3はチップ表側の表面に
接することなく切断が行われるため、チッピングが表面
に発生するのを防ぐことができる。
[0012] At this time, since the blade 3 cuts the chip without coming into contact with the front surface of the chip, it is possible to prevent chipping from occurring on the surface.

【0013】図1(c)には切断後の形状が示されてい
る。LEDアレイチップの表面にはチッピングがほとん
ど発生しておらず、各LEDアレイチップ2にほとんど
損傷がないことが理解される。
FIG. 1(c) shows the shape after cutting. It is understood that almost no chipping occurs on the surface of the LED array chip, and that each LED array chip 2 has almost no damage.

【0014】[0014]

【発明の効果】以上説明したように、本発明に係る半導
体素子切削方法によれば、チッピングをほとんど生じる
ことなくダイシングを行うことができ、従って損傷を与
えることなくLEDアレイチップを得ることができる。
[Effects of the Invention] As explained above, according to the semiconductor device cutting method according to the present invention, dicing can be performed with almost no chipping, and therefore, LED array chips can be obtained without causing damage. .

【0015】そして、このLEDアレイチップをLED
プリンタヘッドに用いた場合には高輝度及び高寿命を得
ることができる効果がある。
[0015] Then, this LED array chip is
When used in a printer head, it has the effect of providing high brightness and long life.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例の切削方法説明図である。FIG. 1 is an explanatory diagram of a cutting method according to an embodiment of the present invention.

【図2】従来の切削方法説明図である。FIG. 2 is an explanatory diagram of a conventional cutting method.

【符号の説明】[Explanation of symbols]

1  半導体ウエーハ 2  LEDアレイチップ 3  ブレード 4  チッピング 5  スクライブライン 1 Semiconductor wafer 2 LED array chip 3 Blade 4 Chipping 5 Scribe line

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  半導体ウエーハ上に形成された半導体
素子をダイシング工程により切断する半導体素子切削方
法において、半導体ウエーハ上のダイシングすべき領域
にスクライブラインを形成するスクライブライン形成工
程と、スクライブラインに沿って前記半導体ウエーハを
切断するダイシング工程と、を有することを特徴とする
半導体素子切削方法。
1. A semiconductor device cutting method in which a semiconductor device formed on a semiconductor wafer is cut by a dicing process, which includes a scribe line forming step of forming a scribe line in a region to be diced on the semiconductor wafer, and a step of dicing a semiconductor device along the scribe line. A method for cutting a semiconductor element, comprising: a dicing step of cutting the semiconductor wafer using a dicing process.
JP3054442A 1991-03-19 1991-03-19 Cutting method of semiconductor element Pending JPH04290248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3054442A JPH04290248A (en) 1991-03-19 1991-03-19 Cutting method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3054442A JPH04290248A (en) 1991-03-19 1991-03-19 Cutting method of semiconductor element

Publications (1)

Publication Number Publication Date
JPH04290248A true JPH04290248A (en) 1992-10-14

Family

ID=12970825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3054442A Pending JPH04290248A (en) 1991-03-19 1991-03-19 Cutting method of semiconductor element

Country Status (1)

Country Link
JP (1) JPH04290248A (en)

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