JPH0428477U - - Google Patents

Info

Publication number

JPH0428477U

JPH0428477U JP6860790U JP6860790U JPH0428477U JP H0428477 U JPH0428477 U JP H0428477U JP 6860790 U JP6860790 U JP 6860790U JP 6860790 U JP6860790 U JP 6860790U JP H0428477 U JPH0428477 U JP H0428477U

Authority

JP

Japan

Prior art keywords

circuit board

lands

pair

utility

scope

Prior art date

1990-06-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 238000001125 extrusion Methods 0.000 description 1
• 230000002265 prevention Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1