JPH04271150A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPH04271150A
JPH04271150A JP3290391A JP3290391A JPH04271150A JP H04271150 A JPH04271150 A JP H04271150A JP 3290391 A JP3290391 A JP 3290391A JP 3290391 A JP3290391 A JP 3290391A JP H04271150 A JPH04271150 A JP H04271150A
Authority
JP
Japan
Prior art keywords
semiconductor
manufacture
lead frame
leads
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3290391A
Other languages
Japanese (ja)
Other versions
JP2539548B2 (en
Inventor
Masumitsu Tanaka
Takashi Ikeda
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP3032903A priority Critical patent/JP2539548B2/en
Publication of JPH04271150A publication Critical patent/JPH04271150A/en
Application granted granted Critical
Publication of JP2539548B2 publication Critical patent/JP2539548B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To improve an accuracy of a product by plating ends of a stage and inner leads in high accuracy.
CONSTITUTION: When plated layers 7, 8 are formed on the ends of a stage 1 and inner leads 2, they are plated while the leads 2 remain integrated by binder 5, and then the binder 5 is punched and removed by pressing.
COPYRIGHT: (C)1992,JPO&Japio
JP3032903A 1991-02-27 1991-02-27 Method for manufacturing lead frame for semiconductor device Expired - Lifetime JP2539548B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3032903A JP2539548B2 (en) 1991-02-27 1991-02-27 Method for manufacturing lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3032903A JP2539548B2 (en) 1991-02-27 1991-02-27 Method for manufacturing lead frame for semiconductor device

Publications (2)

Publication Number Publication Date
JPH04271150A true JPH04271150A (en) 1992-09-28
JP2539548B2 JP2539548B2 (en) 1996-10-02

Family

ID=12371858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3032903A Expired - Lifetime JP2539548B2 (en) 1991-02-27 1991-02-27 Method for manufacturing lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JP2539548B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014099536A (en) * 2012-11-15 2014-05-29 Dainippon Printing Co Ltd Lead frame manufacturing method, semiconductor device manufacturing method, lead frame base material and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014099536A (en) * 2012-11-15 2014-05-29 Dainippon Printing Co Ltd Lead frame manufacturing method, semiconductor device manufacturing method, lead frame base material and semiconductor device

Also Published As

Publication number Publication date
JP2539548B2 (en) 1996-10-02

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