JPH04265849A - Humidity sensitive element and its manufacture - Google Patents
Humidity sensitive element and its manufactureInfo
- Publication number
- JPH04265849A JPH04265849A JP3047452A JP4745291A JPH04265849A JP H04265849 A JPH04265849 A JP H04265849A JP 3047452 A JP3047452 A JP 3047452A JP 4745291 A JP4745291 A JP 4745291A JP H04265849 A JPH04265849 A JP H04265849A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- humidity
- sensitive element
- humidity sensitive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010408 film Substances 0.000 claims abstract description 22
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 18
- 239000011737 fluorine Substances 0.000 claims abstract description 18
- 239000004642 Polyimide Substances 0.000 claims abstract description 16
- 229920001721 polyimide Polymers 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000007858 starting material Substances 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims abstract description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 15
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims 1
- 239000012298 atmosphere Substances 0.000 abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 2
- 241001274961 Rubus repens Species 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- -1 dew condensation Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、有機高分子樹脂材料を
感湿膜とする容量式の感湿素子およびその製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitive moisture sensing element whose moisture sensing film is made of an organic polymer resin material and a method for manufacturing the same.
【0002】0002
【従来の技術】従来より、この種の感湿素子としては、
セルロースアセテートブチレート,セルロースアセテー
トプロピオネート,ポリイミドイミドもしくは線状の高
分子量のポリアミド酸を重合した線状ポリアミドなどの
有機高分子を感湿材料として用い、この感湿材料により
形成される感湿膜の電気容量値変化を湿度検出に利用し
た感湿容量素子が提案されている(特開昭62−889
51号公報)。[Prior Art] Conventionally, this type of moisture sensing element has
Organic polymers such as cellulose acetate butyrate, cellulose acetate propionate, polyimide-imide, or linear polyamide polymerized with linear high-molecular-weight polyamic acid are used as moisture-sensitive materials. A moisture-sensitive capacitive element has been proposed that uses changes in the capacitance of a membrane for humidity detection (Japanese Patent Laid-Open No. 62-889).
Publication No. 51).
【0003】0003
【発明が解決しようとする課題】しかしながら、このよ
うに構成された感湿素子は、親水性(水を引き付ける性
質)が高く、吸水率が大きいため、その化学吸着によっ
て高分子と強固に結合した水が多分に残留する。このた
め、例えば40℃,90%程度の高温・高湿度雰囲気中
で長時間にわたって使用すると、その出力値がドリフト
するなど長期の安定性に欠けるという問題があった。ま
た、吸湿過程と脱湿過程とでの感湿特性の差(ヒステリ
シス)が低温度側で小さく、高温度側で大きくなり、セ
ンサレスポンスが遅くなるという問題があった。さらに
低湿度雰囲気中で長期間にわたって使用すると、ヒステ
リシスが大きくなるという問題があった。また、結露の
発生,水浸漬によりその出力値がドリフトするという問
題があった。また、有機溶剤雰囲気に晒すと、その出力
値がドリフトするという問題があった。また、感湿素子
が温度特性を持つ場合は感温素子(温度センサ)で温度
補正する必要があるという問題があった。[Problems to be Solved by the Invention] However, the moisture-sensitive element configured in this way has high hydrophilicity (the property of attracting water) and has a high water absorption rate, so it has a strong bond with polymers due to chemical adsorption. A lot of water remains. For this reason, when used for a long time in an atmosphere of high temperature and high humidity of about 40° C. and 90%, for example, there is a problem that the output value drifts and lacks long-term stability. Furthermore, there is a problem in that the difference in moisture sensitivity characteristics (hysteresis) between the moisture absorption process and the moisture removal process is small at low temperatures and large at high temperatures, resulting in slow sensor response. Furthermore, when used for a long period of time in a low humidity atmosphere, there is a problem in that hysteresis becomes large. Furthermore, there is a problem in that the output value drifts due to the occurrence of dew condensation or immersion in water. Furthermore, there is a problem in that the output value drifts when exposed to an organic solvent atmosphere. Furthermore, when the humidity sensing element has temperature characteristics, there is a problem in that it is necessary to perform temperature correction using the temperature sensing element (temperature sensor).
【0004】したがって本発明は、低温度から高温度ま
で、また、低湿度から高湿度までの使用範囲においてヒ
ステリシスが小さく、センサレスポンスの速い感湿素子
を提供することを目的としている。また、高湿度,高温
度高湿度,低湿度放置,有機溶剤雰囲気,結露もしくは
水浸漬などの条件に長期的にわたって晒されても安定し
た出力値が得られる感湿素子を提供することを目的とし
ている。また、温度特性が小さく、温度補正が不要な感
湿素子を提供することを目的としている。[0004] Accordingly, an object of the present invention is to provide a moisture sensing element that has a small hysteresis and a fast sensor response in the range of use from low to high temperatures and from low humidity to high humidity. In addition, our aim is to provide a humidity sensing element that can obtain stable output values even when exposed to conditions such as high humidity, high temperature and high humidity, low humidity, organic solvent atmosphere, dew condensation, or water immersion for a long period of time. There is. Another object of the present invention is to provide a moisture sensing element that has small temperature characteristics and does not require temperature correction.
【0005】[0005]
【課題を解決するための手段】このような目的を達成す
るために本発明による感湿素子は、フッ素含有ポリイミ
ドオリゴマーを重合させたポリマーを用いて感湿膜を構
成するものである。また、本発明による感湿素子の製造
方法は、フッ素含有ポリイミドオリゴマーを出発材料と
して薄膜形成後、窒素雰囲気中で200℃以上の温度で
熱処理することにより感湿膜を形成するものである。[Means for Solving the Problems] In order to achieve the above object, the moisture sensitive element according to the present invention comprises a moisture sensitive film using a polymer obtained by polymerizing a fluorine-containing polyimide oligomer. Further, in the method for manufacturing a humidity-sensitive element according to the present invention, a moisture-sensitive film is formed by forming a thin film using a fluorine-containing polyimide oligomer as a starting material, and then heat-treating the film at a temperature of 200° C. or higher in a nitrogen atmosphere.
【0006】[0006]
【作用】本発明における感湿素子において、感湿膜をフ
ッ素含有ポリイミドオリゴマーを重合させたポリマーを
用いて形成することにより、吸水率(吸着水分量)が小
さくなり、ヒステリシスが小さくなる。また、本発明に
よる感湿素子の製造方法においては、吸水率が低く抑え
られ、疎水性が向上する。[Function] In the moisture-sensitive element of the present invention, by forming the moisture-sensitive film using a polymer obtained by polymerizing a fluorine-containing polyimide oligomer, the water absorption rate (absorbed water amount) is reduced and hysteresis is reduced. Furthermore, in the method for manufacturing a moisture-sensitive element according to the present invention, water absorption is suppressed to a low level and hydrophobicity is improved.
【0007】[0007]
【実施例】以下、図面を用いて本発明の実施例を詳細に
説明する。図1は本発明による感湿素子の一実施例によ
る構成を示す図であり、図(a)は斜視図、図(b)は
その平面図である。これらの図において、1は例えばア
ルミナ基板,ガラス基板,熱酸化シリコン基板などから
なる絶縁性基板、2は絶縁性基板1の上面部に形成され
た例えば白金などからなる下部電極、3はこの下部電極
2に交差するように積層塗着された感湿膜であり、この
感湿膜3はフッ素含有ポリイミドオリゴマーを重合させ
た感湿材料により形成されている。4はこの感湿膜3上
に形成された例えば金などからなる上部電極である。す
なわち感湿膜3は下部電極2と上部電極4とでサンドイ
ッチ状に挟み込み、この感湿膜3の相対湿度に対する電
気容量値の変化を検出すべく下部電極2および上部電極
4にそれぞれリード線2aおよび4aが接続されている
。Embodiments Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings. FIG. 1 is a diagram showing the structure of an embodiment of a moisture-sensitive element according to the present invention, in which FIG. 1A is a perspective view and FIG. 1B is a plan view thereof. In these figures, 1 is an insulating substrate made of, for example, an alumina substrate, a glass substrate, a thermally oxidized silicon substrate, etc., 2 is a lower electrode made of, for example, platinum, formed on the upper surface of the insulating substrate 1, and 3 is this lower part. This is a moisture-sensitive film that is laminated and applied across the electrode 2, and this moisture-sensitive film 3 is made of a moisture-sensitive material made by polymerizing a fluorine-containing polyimide oligomer. Reference numeral 4 denotes an upper electrode formed on the moisture sensitive film 3 and made of, for example, gold. That is, the humidity sensitive membrane 3 is sandwiched between the lower electrode 2 and the upper electrode 4, and lead wires 2a are connected to the lower electrode 2 and the upper electrode 4, respectively, in order to detect changes in the capacitance value of the moisture sensitive membrane 3 with respect to relative humidity. and 4a are connected.
【0008】次にこの感湿素子の製造方法について説明
する。まず、フッ素含有ポリイミドオリゴマーの粉末を
例えば5〜10gr用意し、例えばジエチレングリコー
ルジメチルエーテル10〜50mlに溶解してフッ素含
有ポリイミドオリゴマー溶液を得る。次にこのフッ素含
有ポリイミドオリゴマー溶液を絶縁性基板1上に形成さ
れた下部電極2上にスピンコート法により塗布した後、
大気中もしくは窒素雰囲気中で130〜150℃,0.
5〜1.0時間乾燥させて厚さ0.5〜5μmの感湿膜
3を得る。このとき、スピンナーの回転数は500〜5
000rpmとする。大気中もしくは窒素雰囲気で乾燥
後、今度は窒素雰囲気で180℃で0.5〜1時間,2
30℃で1〜2時間,最終的に400℃で0.25〜1
時間の熱処理を行なって重合反応を完結させる。なお、
出発材料であるフッ素含有ポリイミドオリゴマーは、化
1に示すような構造式であり、この式中の[]内の繰り
返し数nにより平均重合度が規定される。この平均重合
度nは1から30まで製造可能であり、出発材料として
は、いずれを用いても良く、また、これらの平均重合度
nが異なるものの2種類以上の混合でも良い。Next, a method for manufacturing this moisture sensitive element will be explained. First, for example, 5 to 10 grams of fluorine-containing polyimide oligomer powder is prepared and dissolved in, for example, 10 to 50 ml of diethylene glycol dimethyl ether to obtain a fluorine-containing polyimide oligomer solution. Next, after applying this fluorine-containing polyimide oligomer solution onto the lower electrode 2 formed on the insulating substrate 1 by a spin coating method,
130-150°C in air or nitrogen atmosphere, 0.
It is dried for 5 to 1.0 hours to obtain a moisture sensitive film 3 having a thickness of 0.5 to 5 μm. At this time, the rotation speed of the spinner is 500 to 5
000 rpm. After drying in air or nitrogen atmosphere, dry at 180°C for 0.5 to 1 hour in nitrogen atmosphere for 2 hours.
1-2 hours at 30℃, finally 0.25-1 at 400℃
The polymerization reaction is completed by heat treatment for a period of time. In addition,
The fluorine-containing polyimide oligomer as a starting material has a structural formula as shown in Chemical Formula 1, and the average degree of polymerization is defined by the number of repeats n in [ ] in this formula. The average degree of polymerization n can be manufactured from 1 to 30, and any starting material may be used, or two or more types having different average degrees of polymerization n may be mixed.
【0009】[0009]
【化1】[Chemical formula 1]
【0010】この化1に示す構造式において、フッ素を
導入したのは、疎水性を向上させるためであり、このフ
ッ素導入により吸水率を低く抑えることが可能となる。
次にこの感湿膜3を積層塗着した絶縁性基板1上に例え
ば金を蒸着法もしくはスパッタリング法により付着させ
て膜厚50〜1000Å程度の上部電極4を形成する。
なお、付着金属は金以外にもパラジウム,白金,クロム
などの耐蝕性金属であればいずれの金属を用いても良い
。また、絶縁性基板1上の下部電極2は白金を蒸着法も
しくはスパッタリング法などにより、1000〜100
00Åの厚さで薄膜状に形成することにより得る。また
、前述したジエチレングリコールジメチルエーテルの代
わりにテトラヒドロフラン,エチレングリコールジメチ
ルエーテル,N−メチルピロリドンなどの溶媒およびそ
れらの混合溶媒でも同様の効果が得られる。In the structural formula shown in Chemical Formula 1, fluorine is introduced in order to improve hydrophobicity, and the introduction of fluorine makes it possible to suppress the water absorption rate to a low level. Next, on the insulating substrate 1 on which the moisture-sensitive film 3 is laminated and coated, gold is deposited, for example, by vapor deposition or sputtering to form an upper electrode 4 having a thickness of about 50 to 1000 Å. In addition to gold, any corrosion-resistant metal such as palladium, platinum, or chromium may be used as the deposited metal. Further, the lower electrode 2 on the insulating substrate 1 is formed by depositing platinum at a concentration of 1,000 to 100,000 by vapor deposition or sputtering.
It is obtained by forming a thin film with a thickness of 0.00 Å. Moreover, the same effect can be obtained by using a solvent such as tetrahydrofuran, ethylene glycol dimethyl ether, N-methylpyrrolidone, or a mixed solvent thereof in place of the above-mentioned diethylene glycol dimethyl ether.
【0011】このように構成された感湿素子は、相対湿
度−電気容量特性を測定した結果、図2に示すようなデ
ータが得られた。なお、この測定にはLCZメータを使
用し、周波数100KHzでそれぞれ温度10℃,25
℃,40℃について行った。同図から明らかなように温
度依存性が小さく、良好な感湿特性が得られた。したが
って温度による検出値の変化(温度特性)が小さくなる
ので、回路による温度補正が不要となる。また、同図か
ら明らかなように恒湿槽で安定化させた後、約2分後の
測定ではヒステリシスが1%RH以下であり、極めて良
好であった。[0011] As a result of measuring the relative humidity-capacitance characteristics of the humidity sensing element thus constructed, data as shown in FIG. 2 were obtained. In addition, an LCZ meter was used for this measurement, and the frequency was 100KHz and the temperature was 10℃ and 25℃, respectively.
℃, 40℃. As is clear from the figure, temperature dependence was small and good moisture sensitivity characteristics were obtained. Therefore, changes in detected values due to temperature (temperature characteristics) are reduced, so temperature correction by a circuit is not required. Furthermore, as is clear from the figure, the hysteresis was 1% RH or less when measured approximately 2 minutes after stabilization in the humidity chamber, which was extremely good.
【0012】図3は前述した実施例で製作した感湿素子
を約40℃,90%RHの高温・高湿度雰囲気中に放置
した後の25℃における各10%RH,30%RH,5
0%RH,70%RH,90%RHにおける各出力のド
リフトを示したものである。また、図4は比較例として
従来の線状の高分子量のポリアミド酸を重合したポリイ
ミド感湿材料を感湿膜とした感湿素子の25℃における
20%RH,40%RH,60%RH,80%RHの各
ドリフトを示したものである。これらの図から明らかな
ように本実施例による感湿素子の出力ドリフトは、従来
(図4)と比較して測定の湿度範囲が広いにもかかわら
ず安定した、すなわちドリフトの小さい感湿特性が得ら
れ、良好であった。また、ヒステリシスも恒湿槽安定後
、約2分後の測定で1%RH以下となり、従来と比べて
再現性が良好であるとともに高温・高湿雰囲気中におい
てさらに長期間にわたって同一雰囲気中に放置しても殆
ど容量比が変化せず、安定している。ここで容量比とは
、25℃における90%RHの出力(C90)と10%
RHの出力(C10)の比C90/C10を指している
。また、高温・高湿雰囲気中に放置した後、室内雰囲気
中に戻すと、可逆的に初期特性に回復することができた
。FIG. 3 shows the humidity of 10% RH, 30% RH, and 5 at 25° C. after the humidity sensing element manufactured in the above-mentioned example was left in a high temperature and high humidity atmosphere of approximately 40° C. and 90% RH.
It shows the drift of each output at 0% RH, 70% RH, and 90% RH. In addition, FIG. 4 shows, as a comparative example, 20%RH, 40%RH, 60%RH, Each drift at 80%RH is shown. As is clear from these figures, the output drift of the humidity sensing element according to this example is stable despite the wider measurement humidity range compared to the conventional one (Fig. 4), that is, the humidity sensing characteristics with small drift are exhibited. It was obtained and was in good condition. In addition, the hysteresis is 1% RH or less when measured approximately 2 minutes after stabilization in the constant humidity chamber, which has better reproducibility than before, and allows the product to be left in the same atmosphere for a longer period of time in a high-temperature, high-humidity atmosphere. However, the capacitance ratio hardly changes and remains stable. Here, the capacity ratio is the output at 90% RH at 25°C (C90) and the 10%
It refers to the ratio C90/C10 of the RH output (C10). In addition, when the material was left in a high-temperature, high-humidity atmosphere and then returned to a room atmosphere, it was able to reversibly recover its initial characteristics.
【0013】なお、前述した実施例においては、サンド
イッチ構造の感湿素子を例にとって説明したが、本発明
はこれに限定されるものではなく、絶縁性基板面上に対
向して一対の櫛形状薄膜電極を形成し、この櫛形状薄膜
電極を覆うように感湿膜を積層形成して得られる櫛形構
造の感湿素子に適用しても同様の効果が得られることは
言うまでもない。[0013] In the above-mentioned embodiments, a sandwich-structured moisture-sensitive element was explained as an example, but the present invention is not limited thereto. It goes without saying that similar effects can be obtained even when applied to a moisture-sensitive element having a comb-shaped structure, which is obtained by forming a thin-film electrode and laminating a moisture-sensitive film to cover the comb-shaped thin-film electrode.
【0014】さらに前述した実施例においては、感湿膜
の相対湿度に対する電気容量値の変化に注目して湿度検
出を行うものとしたが、その相対湿度の対するインピー
ダンンスの変化に注目して湿度検出を行うような方法を
採用しても良い。Furthermore, in the above-mentioned embodiment, humidity was detected by paying attention to the change in the capacitance value with respect to the relative humidity of the moisture-sensitive film. A detection method may also be adopted.
【0015】また、前述した実施例における感湿膜は、
水晶振動子上に形成し、その感湿膜の吸着に伴う共振周
波数のずれから湿度を検出する構成をとる感湿素子の感
湿膜としても好適であり、また、表面弾性波素子上に感
湿膜を形成し、その表面弾性波素子を通過する速度の変
化により、湿度を検出する構成をとる感湿素子の感湿膜
としても好適である。[0015] Furthermore, the moisture-sensitive membrane in the above-mentioned embodiments is
It is suitable as a moisture-sensitive film for a moisture-sensitive element that is formed on a crystal resonator and detects humidity from the shift in resonance frequency caused by adsorption of the moisture-sensitive film. It is also suitable as a moisture-sensitive film for a humidity-sensitive element that forms a wet film and detects humidity based on changes in the speed at which the film passes through the surface acoustic wave element.
【0016】[0016]
【発明の効果】以上、説明したように本発明による感湿
素子によれば、フッ素含有ポリイミドオリゴマーを重合
させたポリマーを用いて感湿膜を構成したしたことによ
り、吸水率が小さくなり、ヒステリシスが小さくなる。
また、温度特性が小さくなり、温度補正が不要となる。
さらに高温・高湿度,有機溶剤雰囲気,結露などの条件
に長期間にわたり晒されても安定した出力値が得られる
などの極めて優れた効果が得られる。また、本発明によ
る感湿素子の製造方法によれば、フッ素含有ポリイミド
オリゴマーを出発材料として窒素雰囲気中で200℃以
上の温度で熱処理することにより、吸水率が低くなり、
ドリフトが少なく、かつ温度依存性のない安定した感湿
特性をヒステリシスが少なく、さらにレスポンス良く得
ることができる。また、吸着水分量が小さく親水性が低
いので、その製造後において定温・定湿雰囲気中でのコ
ンディショニングおよび温湿度サイクルのようなコンデ
ィショニングが不要もしくは容易となるなどの極めて優
れた効果が得られる。Effects of the Invention As explained above, according to the moisture-sensitive element according to the present invention, since the moisture-sensitive film is constructed using a polymer obtained by polymerizing a fluorine-containing polyimide oligomer, the water absorption rate is reduced and hysteresis is reduced. becomes smaller. Furthermore, the temperature characteristics become smaller, and temperature correction becomes unnecessary. Furthermore, it has extremely excellent effects such as stable output values even when exposed to conditions such as high temperature, high humidity, organic solvent atmosphere, and dew condensation for long periods of time. Further, according to the method for manufacturing a moisture-sensitive element according to the present invention, the water absorption rate is reduced by heat-treating the fluorine-containing polyimide oligomer as a starting material at a temperature of 200° C. or higher in a nitrogen atmosphere.
It is possible to obtain stable moisture sensitivity characteristics with less drift and no temperature dependence, less hysteresis, and better response. In addition, since the amount of adsorbed water is small and the hydrophilicity is low, extremely excellent effects such as conditioning in a constant temperature and constant humidity atmosphere and conditioning such as temperature and humidity cycles are unnecessary or easy after production can be obtained.
【図1】(a)は本発明による感湿素子の一実施例によ
る構成を説明する斜視図、(b)は(a)の平面図であ
る。FIG. 1(a) is a perspective view illustrating the structure of an embodiment of a moisture-sensitive element according to the present invention, and FIG. 1(b) is a plan view of FIG.
【図2】本発明による感湿素子の相対湿度−電気容量特
性を示す図である。FIG. 2 is a diagram showing relative humidity-capacitance characteristics of a humidity-sensitive element according to the present invention.
【図3】本発明による感湿素子の高温・高湿度雰囲気中
に放置した後の25℃における各10%RH,30%R
H,50%RH,70%RH,90%RHにおける各出
力のドリフトを示す図である。[Fig. 3] 10% RH and 30% R at 25°C after being left in a high temperature and high humidity atmosphere of the humidity sensing element according to the present invention.
FIG. 4 is a diagram showing the drift of each output at H, 50% RH, 70% RH, and 90% RH.
【図4】従来の感湿素子の高温・高湿度雰囲気中に放置
した後の25℃における各20%RH,40%RH,6
0%RH,80%RHにおける各出力のドリフトを示す
図である。[Figure 4] 20% RH, 40% RH, 6 at 25°C after being left in a high temperature and high humidity atmosphere of a conventional humidity sensing element
It is a figure which shows the drift of each output at 0%RH and 80%RH.
1 絶縁性基板 2 下部電極 3 感湿膜 4 上部電極 1 Insulating substrate 2 Lower electrode 3 Moisture sensitive membrane 4 Upper electrode
Claims (3)
合させたポリマーを感湿膜として備えたことを特徴とす
る感湿素子。1. A moisture-sensitive element comprising, as a moisture-sensitive film, a polymer obtained by polymerizing a fluorine-containing polyimide oligomer.
発材料として薄膜形成後、窒素雰囲気中で200℃以上
の温度で熱処理することを特徴とする感湿素子の製造方
法。2. A method for producing a moisture-sensitive element, which comprises forming a thin film using a fluorine-containing polyimide oligomer as a starting material, and then heat-treating the film at a temperature of 200° C. or higher in a nitrogen atmosphere.
ミドオリゴマーの平均重合度nがn=1からn=30ま
での値をとる単体もしくは複数種の混合体よりなるオリ
ゴマーを出発材料とすることを特徴とする感湿素子の製
造方法。3. In claim 2, the starting material is an oligomer consisting of a single fluorine-containing polyimide oligomer or a mixture of a plurality of fluorine-containing polyimide oligomers having an average degree of polymerization n ranging from n=1 to n=30. A method for manufacturing a moisture-sensitive element.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3047452A JP2529136B2 (en) | 1991-02-21 | 1991-02-21 | Moisture-sensitive element and manufacturing method thereof |
US07/837,059 US5161085A (en) | 1991-02-21 | 1992-02-18 | Moisture sensitive element and method of manufacturing the same |
KR92002581A KR960012333B1 (en) | 1991-02-21 | 1992-02-20 | Moisture sensitive element and method of manufacturing the same |
FI920762A FI111034B (en) | 1991-02-21 | 1992-02-21 | Moisture sensitive element and process for its preparation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3047452A JP2529136B2 (en) | 1991-02-21 | 1991-02-21 | Moisture-sensitive element and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04265849A true JPH04265849A (en) | 1992-09-22 |
JP2529136B2 JP2529136B2 (en) | 1996-08-28 |
Family
ID=12775549
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JP3047452A Expired - Fee Related JP2529136B2 (en) | 1991-02-21 | 1991-02-21 | Moisture-sensitive element and manufacturing method thereof |
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JP (1) | JP2529136B2 (en) |
Cited By (1)
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JP2019174464A (en) * | 2018-03-29 | 2019-10-10 | 住友化学株式会社 | Moisture-sensitive film and sensor using the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005003543A (en) | 2003-06-12 | 2005-01-06 | Nippon Soken Inc | Hygrometric sensing element for humidity sensor |
FR2991456B1 (en) * | 2012-06-04 | 2023-02-10 | Commissariat Energie Atomique | CAPACITIVE HUMIDITY SENSOR WITH GRAPHENE ELECTRODE |
-
1991
- 1991-02-21 JP JP3047452A patent/JP2529136B2/en not_active Expired - Fee Related
Cited By (1)
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JP2019174464A (en) * | 2018-03-29 | 2019-10-10 | 住友化学株式会社 | Moisture-sensitive film and sensor using the same |
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