JPH04264762A - Lead forming mold - Google Patents

Lead forming mold

Info

Publication number
JPH04264762A
JPH04264762A JP2582691A JP2582691A JPH04264762A JP H04264762 A JPH04264762 A JP H04264762A JP 2582691 A JP2582691 A JP 2582691A JP 2582691 A JP2582691 A JP 2582691A JP H04264762 A JPH04264762 A JP H04264762A
Authority
JP
Japan
Prior art keywords
mold
die
lead
hole
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2582691A
Other languages
English (en)
Inventor
Masashi Magota
Original Assignee
Nec Yamaguchi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Yamaguchi Ltd filed Critical Nec Yamaguchi Ltd
Priority to JP2582691A priority Critical patent/JPH04264762A/ja
Publication of JPH04264762A publication Critical patent/JPH04264762A/ja
Pending legal-status Critical Current

Links

JP2582691A 1991-02-20 1991-02-20 Lead forming mold Pending JPH04264762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2582691A JPH04264762A (en) 1991-02-20 1991-02-20 Lead forming mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2582691A JPH04264762A (en) 1991-02-20 1991-02-20 Lead forming mold

Publications (1)

Publication Number Publication Date
JPH04264762A true JPH04264762A (en) 1992-09-21

Family

ID=12176668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2582691A Pending JPH04264762A (en) 1991-02-20 1991-02-20 Lead forming mold

Country Status (1)

Country Link
JP (1) JPH04264762A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press

Similar Documents

Publication Publication Date Title
EP1810812A3 (en) Manifold system having flow control
WO2005067526A3 (en) Flipchip qfn package and method therefore
JPH01106440A (en) Device for positioning wafer
MY117421A (en) Integral design features for heatsink attach for electronic packages
MY126370A (en) Plastic molded type semiconductor device and fabrication process thereof
MY129752A (en) Wafer planarization apparatus and planarization method thereof
EP0854511A3 (en) Resin sealing type semiconductor device
EP1336986A3 (en) Method of separating a thin semicondcutor die from a wafer
JPH02197143A (en) Transfer device
EP1246230A3 (en) Sealing apparatus for semiconductor wafer, mold of sealing apparatus, semiconductor wafer and method for manufacturing semiconductor device by use of sealing apparatus
JPS62188322A (en) Washing apparatus
JPH03227537A (en) Resin sealing device for semiconductor element and manufacture of semiconductor device
JPH03160799A (en) Electronic component mounting device
TW200520032A (en) Method for aligning the bondhead of a die bonder
JPH04284384A (en) Ic contact mechanism of ic socket
EP0688650A4 (en) RESIN WELDING PROCESS OF SEMICONDUCTOR DEVICES
JPH0284240A (en) Molding apparatus
JPH01226160A (en) Terminal device for connecting electronic parts and manufacture thereof
JPH01209221A (en) Paper cup arranging device
EP1100122A3 (en) Die used for resin-sealing and molding an electronic component
JPS6457738A (en) Package for semiconductor device
US5996458A (en) Lead cutting apparatus of electronic component
JPS5847528A (en) Automatic material feeding device
JP3228140B2 (ja) 導電性ボールの搭載方法
JPH02225225A (en) Inserting device for plate glass

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970520