JPH04262861A - Reflow device - Google Patents
Reflow deviceInfo
- Publication number
- JPH04262861A JPH04262861A JP2074991A JP2074991A JPH04262861A JP H04262861 A JPH04262861 A JP H04262861A JP 2074991 A JP2074991 A JP 2074991A JP 2074991 A JP2074991 A JP 2074991A JP H04262861 A JPH04262861 A JP H04262861A
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- conveyor
- substrate
- resin
- heating chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000005192 partition Methods 0.000 claims abstract description 12
- 239000000112 cooling gas Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 12
- 230000004907 flux Effects 0.000 abstract description 5
- 239000000779 smoke Substances 0.000 abstract description 5
- 230000000630 rising effect Effects 0.000 abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 229910001873 dinitrogen Inorganic materials 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はリフロー装置に係り、詳
しくは、紫外線（以下ＵＶと略す）ランプを備えたリフ
ロー装置のランプ室の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow apparatus, and more particularly to the structure of a lamp chamber of a reflow apparatus equipped with an ultraviolet (hereinafter abbreviated as UV) lamp.
【０００２】0002
【従来の技術】基板に電子部品を搭載した後、この基板
をリフロー装置の加熱室へ送り、半田を加熱処理して、
電子部品の電極を基板に接着することが行われる。また
この場合、半田が加熱処理されて固化する迄の間、電子
部品が位置ずれしないようにこれをＵＶ樹脂により仮接
着しておくことが行われる。[Prior Art] After electronic components are mounted on a board, the board is sent to a heating chamber of a reflow machine, and the solder is heat-treated.
The electrodes of the electronic component are bonded to the substrate. Further, in this case, until the solder is heat-treated and solidified, the electronic components are temporarily bonded with UV resin to prevent the electronic components from shifting.
【０００３】図３は従来のリフロー装置を示すものであ
って、１は加熱室、２は加熱室１の内部に配設されたフ
ァン、３はヒータ、４は基板搬送用コンベヤ、５は基板
、６は電子部品、１０は加熱室１の入口付近に設けられ
たＵＶランプ、１１は反射ミラー、１２はＵＶランプ１
０付近の冷却及びオゾン除去のためのダクト、Ｐはポン
プである。FIG. 3 shows a conventional reflow apparatus, in which 1 is a heating chamber, 2 is a fan disposed inside the heating chamber 1, 3 is a heater, 4 is a substrate conveyor, and 5 is a substrate. , 6 is an electronic component, 10 is a UV lamp installed near the entrance of heating chamber 1, 11 is a reflection mirror, 12 is UV lamp 1
A duct for cooling near 0 and removing ozone, P is a pump.
【０００４】次にその動作を説明する。加熱室１に搬入
された基板５に、ＵＶ光が照射され、電子部品６を基板
５に仮接着するＵＶ樹脂が硬化する。次いで基板５はコ
ンベヤ４により搬送されながら、ヒータ３により加熱さ
れ、半田は溶融する。次いで基板５は加熱室１外へ搬出
されながら冷却され、半田は固化し、電子部品６は基板
５に固着される。Next, its operation will be explained. The substrate 5 carried into the heating chamber 1 is irradiated with UV light, and the UV resin for temporarily bonding the electronic component 6 to the substrate 5 is cured. Next, the substrate 5 is heated by the heater 3 while being conveyed by the conveyor 4, and the solder is melted. Next, the board 5 is cooled while being carried out of the heating chamber 1, the solder is solidified, and the electronic component 6 is fixed to the board 5.
【０００５】[0005]
【発明が解決しようとする課題】ところが上記従来手段
では、ＵＶ光はきわめて高温度であることから、基板５
はＵＶ光により過度に加熱されて、半田フラックスや基
板５に付着するごみなどが発煙し、ＵＶランプ１０や反
射ミラー１１が煙で汚れて、ＵＶ光が照射不良となり、
ＵＶ樹脂が十分に硬化しにくい問題点があった。[Problems to be Solved by the Invention] However, in the conventional means described above, since UV light has an extremely high temperature, the substrate 5
is heated excessively by the UV light, and the solder flux and dust adhering to the board 5 emit smoke, and the UV lamp 10 and reflective mirror 11 become dirty with smoke, resulting in poor irradiation of the UV light.
There was a problem that the UV resin was difficult to cure sufficiently.
【０００６】また電極、半田、回路パターンなどの金属
部分が酸化しないように、加熱室にチッソガスを供給し
、チッソガス雰囲気中において半田の加熱処理を行うも
のにあっては、ダクト１２からチッソガスが流亡するた
め、チッソガスの消費量が多くなり、ランニングコスト
が高くなる問題点があった。[0006] Furthermore, in order to prevent metal parts such as electrodes, solder, and circuit patterns from oxidizing, nitrogen gas is supplied to the heating chamber and the solder is heated in the nitrogen gas atmosphere, so that the nitrogen gas flows out from the duct 12. Therefore, there was a problem that the amount of nitrogen gas consumed increased and running costs increased.
【０００７】[0007]
【課題を解決するための手段】本発明は、加熱室と、こ
の加熱室の内部に配設されたヒータ及び基板搬送用コン
ベヤとを備え、この加熱室の内部に、上記コンベヤによ
り搬送される基板にＵＶ光を照射するＵＶランプが収納
されたランプ室を形成し、このランプ室のＵＶ光照射面
にＵＶ透過材から成る仕切り壁を設けるとともに、上記
ランプ室に、冷却気体の循環手段を設けたものである。[Means for Solving the Problems] The present invention includes a heating chamber, a heater disposed inside the heating chamber, and a conveyor for transporting substrates, and the substrates are transported into the heating chamber by the conveyor. A lamp chamber containing a UV lamp for irradiating the substrate with UV light is formed, a partition wall made of a UV transmitting material is provided on the UV light irradiation surface of the lamp chamber, and cooling gas circulation means is provided in the lamp chamber. It was established.
【０００８】[0008]
【作用】上記構成において、ランプ室に冷却気体を循環
させることにより、ＵＶランプによる温度の異常上昇を
防止し、半田フラックスなどからの発煙により、ＵＶラ
ンプや反射ミラーが汚れないようにする。またチッソガ
スを使用する場合は、ランプ室は仕切壁により仕切られ
ているので、加熱室内のチッソガスが冷却気体の循環手
段から不要に流亡することはない。[Function] In the above structure, by circulating cooling gas in the lamp chamber, an abnormal rise in temperature due to the UV lamp is prevented, and the UV lamp and reflecting mirror are prevented from becoming dirty due to smoke emitted from solder flux and the like. Furthermore, when nitrogen gas is used, the lamp chamber is partitioned by a partition wall, so that the nitrogen gas in the heating chamber will not flow away unnecessarily from the cooling gas circulation means.
【０００９】[0009]
【実施例】（実施例１）次に図面を参照しながら、本発
明の実施例を説明する。Embodiments (Embodiment 1) Next, embodiments of the present invention will be described with reference to the drawings.
【００１０】図１はリフロー装置の側面図である。１は
加熱室であり、その内部には、ファン２、ヒータ３、基
板搬送用コンベヤ４が配設されている。５は基板、６は
基板５に搭載された電子部品、７は搬入用コンベヤ、８
は搬出用コンベヤである。FIG. 1 is a side view of the reflow apparatus. Reference numeral 1 denotes a heating chamber, in which a fan 2, a heater 3, and a conveyor 4 for conveying substrates are arranged. 5 is a board, 6 is an electronic component mounted on the board 5, 7 is a carrying conveyor, 8
is an unloading conveyor.
【００１１】１３は加熱室１の入口側に形成されたラン
プ室であって、ＵＶランプ１０、反射ミラー１１が収納
されている。１４、１５はランプ室１３の仕切壁であっ
て、ＵＶ光照射面側の仕切壁１４は、ＵＶ透過材として
の石英ガラスにて形成されている。石英ガラスは、ＵＶ
光を透過する性質を有している。Reference numeral 13 denotes a lamp chamber formed on the entrance side of the heating chamber 1, in which a UV lamp 10 and a reflecting mirror 11 are housed. 14 and 15 are partition walls of the lamp chamber 13, and the partition wall 14 on the UV light irradiation surface side is made of quartz glass as a UV transmitting material. Quartz glass is UV-resistant
It has the property of transmitting light.
【００１２】ランプ室１３の上壁には、冷却気体の循環
手段としての吸入ダクト１６と排気ダクト１７が設けら
れており、排気ダクト１７にはポンプＰが設けられてい
る。ポンプＰが駆動すると、エアなどの冷却気体が循環
し、ランプ室１３の内部を冷却するとともに、ＵＶ光に
より生じたランプ室１３内のオゾンを除去する。An intake duct 16 and an exhaust duct 17 are provided on the upper wall of the lamp chamber 13 as cooling gas circulation means, and the exhaust duct 17 is provided with a pump P. When the pump P is driven, cooling gas such as air circulates, cooling the inside of the lamp chamber 13 and removing ozone inside the lamp chamber 13 generated by UV light.
【００１３】このリフロー装置は上記のような構成より
成り、次に動作を説明する。搬入用コンベヤ７からコン
ベヤ４へ転送された基板５に、ＵＶ光が照射され、電子
部品６を基板５に仮接着するＵＶ樹脂は硬化する。次い
で基板５はコンベヤ４により搬送されながら加熱され、
半田は溶融する。次いで基板４はコンベヤ４及び搬出用
コンベヤ８により搬送されながら、半田は冷却固化し、
電子部品６は基板５に固着される。This reflow apparatus has the above-mentioned structure, and its operation will be explained next. The substrate 5 transferred from the carry-in conveyor 7 to the conveyor 4 is irradiated with UV light, and the UV resin for temporarily bonding the electronic component 6 to the substrate 5 is cured. Next, the substrate 5 is heated while being conveyed by the conveyor 4,
The solder will melt. Next, while the board 4 is conveyed by the conveyor 4 and the conveyor 8 for carrying out, the solder is cooled and solidified.
Electronic component 6 is fixed to substrate 5.
【００１４】ランプ室１３において、ＵＶランプ１０は
高温発熱するが、ポンプＰが駆動して冷却気体がランプ
室１３内を循環することにより、ランプ室１３内の温度
の異常上昇は防止される。したがって半田フラックスな
どが発煙して、反射ミラー１１が煙で汚れることはなく
、ＵＶランプ１０から照射されたＵＶ光は、仕切壁１４
を透過してＵＶ樹脂に十分に照射され、ＵＶ樹脂は速や
かに硬化する。図中、矢印は冷却気体の流れを示してい
る。In the lamp chamber 13, the UV lamp 10 generates heat at a high temperature, but by driving the pump P and circulating cooling gas within the lamp chamber 13, an abnormal rise in temperature within the lamp chamber 13 is prevented. Therefore, the reflection mirror 11 will not be contaminated with smoke due to solder flux etc., and the UV light irradiated from the UV lamp 10 will not pass through the partition wall 14.
The UV resin is sufficiently irradiated through the UV resin, and the UV resin quickly hardens. In the figure, arrows indicate the flow of cooling gas.
【００１５】（実施例２）図２は他の実施例を示してい
る。仕切壁２０は、石英ガラス等の仕切板２１の間に、
ＵＶ透過材としての水２２を収納して構成されている。
この水２２は、加熱されて気化しないように、ポンプＰ
により循環される。２３は加熱室１の上壁に設けられた
ダクトであり、加熱室１にチッソガスを供給する。(Embodiment 2) FIG. 2 shows another embodiment. The partition wall 20 has between partition plates 21 such as quartz glass,
It is configured to house water 22 as a UV transmitting material. This water 22 is pumped by the pump P to prevent it from being heated and vaporized.
It is circulated by A duct 23 is provided on the upper wall of the heating chamber 1, and supplies nitrogen gas to the heating chamber 1.
【００１６】水２２は石英ガラスと同様に、ＵＶ光を透
過する性質を有しており、このものも、上記実施例１と
同様の作用効果が得られる。またランプ室１３は仕切壁
２０により仕切られているので、加熱室１内のチッソガ
スが、ダクト１７から流亡することもない。[0016] Like quartz glass, water 22 has the property of transmitting UV light, and the same effects as in Example 1 can be obtained with this water. Further, since the lamp chamber 13 is partitioned by the partition wall 20, the nitrogen gas in the heating chamber 1 will not flow out from the duct 17.
【００１７】[0017]
【発明の効果】以上説明したように本発明は、加熱室と
、この加熱室の内部に配設されたヒータ及び基板搬送用
コンベヤとを備え、この加熱室の内部に、上記コンベヤ
により搬送される基板にＵＶ光を照射するＵＶランプが
収納されたランプ室を形成し、このランプ室のＵＶ光照
射面にＵＶ透過材から成る仕切り壁を設けるとともに、
上記ランプ室に、冷却気体の循環手段を設けているので
、ＵＶ光による温度の異常上昇による半田フラックスな
どの発煙を防止し、ＵＶ光を十分に照射してＵＶ樹脂を
良好に硬化させることができる。また加熱室にチッソガ
スを供給して、チッソガス雰囲気中においてリフローを
行うものにあっては、チッソガスの不要な流亡を防止し
、ランニングコストを低減することができる。Effects of the Invention As described above, the present invention includes a heating chamber, a heater disposed inside the heating chamber, and a conveyor for conveying substrates, and a substrate conveyed by the conveyor into the heating chamber. A lamp chamber is formed in which a UV lamp for irradiating UV light is housed on the substrate, and a partition wall made of a UV transmitting material is provided on the UV light irradiation surface of this lamp chamber.
The lamp chamber is equipped with cooling gas circulation means to prevent solder flux from emitting fumes due to abnormal temperature rises caused by UV light, and to properly cure UV resin by irradiating sufficient UV light. can. Further, in the case where nitrogen gas is supplied to the heating chamber and reflow is performed in a nitrogen gas atmosphere, unnecessary runoff of nitrogen gas can be prevented and running costs can be reduced.
【図１】本発明のリフロー装置の側面図[Fig. 1] Side view of the reflow apparatus of the present invention
【図２】他の実
施例の側面図[Fig. 2] Side view of another embodiment
【図３】従来のリフロー装置の側面図[Figure 3] Side view of conventional reflow equipment
１ 加熱室 ３ ヒータ ４ 基板搬送用コンベヤ ５ 基板 １０ ＵＶランプ １３ ランプ室 １４、２０ 仕切壁 １６、１７ 循環手段 1 Heating chamber 3 Heater 4 Conveyor for board transport 5 Substrate 10 UV lamp 13 Lamp room 14, 20 Partition wall 16, 17 Circulation means
Claims (1)
れたヒータ及び基板搬送用コンベヤとを備え、この加熱
室の内部に、上記コンベヤにより搬送される基板に紫外
線光を照射する紫外線ランプが収納されたランプ室を形
成し、このランプ室の紫外線光照射面に紫外線透過材か
ら成る仕切り壁を設けるとともに、上記ランプ室に、冷
却気体の循環手段を設けたことを特徴とするリフロー装
置。1. A heating chamber, a heater disposed inside the heating chamber, and a conveyor for conveying a substrate, and an ultraviolet ray that irradiates the substrate conveyed by the conveyor inside the heating chamber. A reflow method characterized in that a lamp chamber is formed in which a lamp is housed, a partition wall made of an ultraviolet transmitting material is provided on the ultraviolet light irradiation surface of the lamp chamber, and a cooling gas circulation means is provided in the lamp chamber. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074991A JPH04262861A (en) | 1991-02-14 | 1991-02-14 | Reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2074991A JPH04262861A (en) | 1991-02-14 | 1991-02-14 | Reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04262861A true JPH04262861A (en) | 1992-09-18 |
Family
ID=12035842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2074991A Pending JPH04262861A (en) | 1991-02-14 | 1991-02-14 | Reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04262861A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000073748A (en) * | 1999-05-13 | 2000-12-05 | 이광열 | Heating conveyer |
| US6495800B2 (en) * | 1999-08-23 | 2002-12-17 | Carson T. Richert | Continuous-conduction wafer bump reflow system |
| US6501051B1 (en) * | 1999-08-23 | 2002-12-31 | Radient Technology Corp. | Continuous-conduction wafer bump reflow system |
-
1991
- 1991-02-14 JP JP2074991A patent/JPH04262861A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000073748A (en) * | 1999-05-13 | 2000-12-05 | 이광열 | Heating conveyer |
| US6495800B2 (en) * | 1999-08-23 | 2002-12-17 | Carson T. Richert | Continuous-conduction wafer bump reflow system |
| US6501051B1 (en) * | 1999-08-23 | 2002-12-31 | Radient Technology Corp. | Continuous-conduction wafer bump reflow system |
| US7094993B2 (en) | 1999-08-23 | 2006-08-22 | Radiant Technology Corp. | Apparatus and method for heating and cooling an article |
| US7170036B2 (en) | 1999-08-23 | 2007-01-30 | Radiant Technology Corporation | Apparatus and method for heating and cooling an article |
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