JPH0425338B2 - - Google Patents
Info
- Publication number
- JPH0425338B2 JPH0425338B2 JP62180837A JP18083787A JPH0425338B2 JP H0425338 B2 JPH0425338 B2 JP H0425338B2 JP 62180837 A JP62180837 A JP 62180837A JP 18083787 A JP18083787 A JP 18083787A JP H0425338 B2 JPH0425338 B2 JP H0425338B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- content
- strength
- alloy
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 239000002244 precipitate Substances 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 description 38
- 239000000956 alloy Substances 0.000 description 38
- 238000007747 plating Methods 0.000 description 15
- 230000007797 corrosion Effects 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005336 cracking Methods 0.000 description 9
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 239000010974 bronze Substances 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 5
- 229910020922 Sn-Pb Inorganic materials 0.000 description 5
- 229910008783 Sn—Pb Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 229910052790 beryllium Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000005482 strain hardening Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910008355 Si-Sn Inorganic materials 0.000 description 1
- 229910006453 Si—Sn Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425929A JPS6425929A (en) | 1989-01-27 |
| JPH0425338B2 true JPH0425338B2 (ko) | 1992-04-30 |
Family
ID=16090224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18083787A Granted JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425929A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10704822B2 (en) | 2015-09-11 | 2020-07-07 | The Sure Chill Company Limited | Portable refrigeration apparatus |
| US10767916B2 (en) | 2012-01-27 | 2020-09-08 | The Sure Chill Company Limited | Fluid reservoir refrigeration apparatus |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115538A (ja) * | 1989-09-29 | 1991-05-16 | Tsuneaki Mikawa | 粒子分散強化特殊銅合金 |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| CN1063801C (zh) * | 1998-01-14 | 2001-03-28 | 浙江大学 | 一种高强度高软化温度铜基弹性材料 |
| US6379478B1 (en) * | 1998-08-21 | 2002-04-30 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
| FR2838454B1 (fr) * | 2002-04-10 | 2005-04-15 | Clal Msx | Alliages cuivreux durcissables sans beryllium a hautes caracteristiques mecaniques pour le decolletage |
| CN1327017C (zh) * | 2004-07-22 | 2007-07-18 | 同济大学 | 一种弹性导电合金的制备方法 |
| US20070253858A1 (en) * | 2006-04-28 | 2007-11-01 | Maher Ababneh | Copper multicomponent alloy and its use |
| CN102017175B (zh) * | 2008-04-25 | 2014-06-25 | 三菱综合材料株式会社 | 太阳能电池用连接器用材料及太阳能电池用连接器 |
| CN107858551B (zh) * | 2017-11-06 | 2020-03-31 | 江苏科技大学 | 电阻焊电极用高强高导耐磨无毒铜合金及其制备方法 |
| CN111519061A (zh) * | 2019-02-01 | 2020-08-11 | 内蒙金属材料研究所 | 一种稀土掺杂的Cu-Cr-Zr合金材料及其制备方法和应用 |
| CN110527860B (zh) * | 2019-09-23 | 2021-09-07 | 四川博鑫铜业有限公司 | 一种废紫杂铜精炼剂及其制备方法和应用 |
| CN111471888B (zh) * | 2020-05-09 | 2021-04-23 | 南京工程学院 | 纳米金属间化合物弥散强化铜合金的制造方法和应用 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (ja) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS6369933A (ja) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金とその製造法 |
| JPS6386838A (ja) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPS63274729A (ja) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金 |
-
1987
- 1987-07-20 JP JP18083787A patent/JPS6425929A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (ja) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS6369933A (ja) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金とその製造法 |
| JPS6386838A (ja) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | 半導体リ−ド用銅合金 |
| JPS63130739A (ja) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 |
| JPS63274729A (ja) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | 電子・電気機器用銅合金 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10767916B2 (en) | 2012-01-27 | 2020-09-08 | The Sure Chill Company Limited | Fluid reservoir refrigeration apparatus |
| US10704822B2 (en) | 2015-09-11 | 2020-07-07 | The Sure Chill Company Limited | Portable refrigeration apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6425929A (en) | 1989-01-27 |
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