JPH04234442A - Production of permanently antistatic molding - Google Patents
Production of permanently antistatic moldingInfo
- Publication number
- JPH04234442A JPH04234442A JP2409307A JP40930790A JPH04234442A JP H04234442 A JPH04234442 A JP H04234442A JP 2409307 A JP2409307 A JP 2409307A JP 40930790 A JP40930790 A JP 40930790A JP H04234442 A JPH04234442 A JP H04234442A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- organic material
- surface layer
- compound
- antistatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000000465 moulding Methods 0.000 title abstract 2
- 239000002344 surface layer Substances 0.000 claims abstract description 20
- 230000002378 acidificating effect Effects 0.000 claims abstract description 17
- -1 acryloyloxy Chemical group 0.000 claims abstract description 15
- 239000011368 organic material Substances 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 239000003513 alkali Substances 0.000 claims abstract description 6
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- BMGGRMPPMMGODK-UHFFFAOYSA-N diazanium chloride fluoride Chemical compound [NH4+].[NH4+].[F-].[Cl-] BMGGRMPPMMGODK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000000981 basic dye Substances 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 4
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- JFTBTTPUYRGXDG-UHFFFAOYSA-N methyl violet Chemical compound Cl.C1=CC(=NC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JFTBTTPUYRGXDG-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- RGADKZXRWFOTFV-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCC(C)(CO)CO RGADKZXRWFOTFV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000001384 succinic acid Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ZEMYZPXPNMSHCE-UHFFFAOYSA-N (3-methyl-1-prop-2-enoyloxypentyl) prop-2-enoate Chemical compound CCC(C)CC(OC(=O)C=C)OC(=O)C=C ZEMYZPXPNMSHCE-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- FWTGTVWNYRCZAI-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C FWTGTVWNYRCZAI-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- JDPZLHCKBWMLDH-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOCCOCCOCCOCCOCCOC(=O)C=C JDPZLHCKBWMLDH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- FLFBVXQHGATQKX-UHFFFAOYSA-N 3-(prop-2-enoyloxymethyl)heptyl prop-2-enoate Chemical compound C=CC(=O)OCC(CCCC)CCOC(=O)C=C FLFBVXQHGATQKX-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MKOXAYAONZASSN-UHFFFAOYSA-N C(C=C)(=O)OCCOC(C=C)=O.CCCCCCCCCCCCCC Chemical compound C(C=C)(=O)OCCOC(C=C)=O.CCCCCCCCCCCCCC MKOXAYAONZASSN-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- KUIDSTKCJKFHLZ-UHFFFAOYSA-N [4-(prop-2-enoyloxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCC(COC(=O)C=C)CC1 KUIDSTKCJKFHLZ-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000002070 germicidal effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007974 sodium acetate buffer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、優れた耐久性を有する
恒久帯電防止成形物の製造方法に関する。本発明により
得られる成形物は、建築内装、エレクトロニクス、自動
車、光学等の種々の産業分野において利用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing permanently antistatic molded articles having excellent durability. The molded product obtained by the present invention is used in various industrial fields such as architectural interiors, electronics, automobiles, and optics.
【0002】0002
【従来の技術】高分子化合物は、一般に電気絶縁性が非
常に優れており、従って摩擦したり、重ねあわせたフィ
ルムを剥離すると容易に数万ボルト以上の帯電が起こる
。この帯電しやすい高分子化合物の帯電を防止する方法
は数多く知られている。例えば帯電防止剤を成形物の外
部に塗布し表面層に帯電防止剤の被膜を形成し、表面抵
抗を低下させて電荷の漏洩を大きくする方法、及び帯電
防止剤を練り込み、時間の経過と共に成形物の表面層に
染み出させ、単分子膜を形成し、吸湿によって導電性を
高め帯電防止効果を現わす方法が挙げられる。また、高
分子化合物の表面を化学的に処理し官能基を導入するこ
とにより帯電を防止する方法も挙げられる。BACKGROUND OF THE INVENTION Polymer compounds generally have very good electrical insulation properties, and therefore, when they are rubbed or when stacked films are peeled off, they easily become charged to tens of thousands of volts or more. Many methods are known for preventing charging of polymer compounds that are easily charged. For example, there are two methods: applying an antistatic agent to the outside of the molded product to form a film of the antistatic agent on the surface layer, lowering the surface resistance and increasing charge leakage; One example is a method in which the material is allowed to ooze out onto the surface layer of the molded product, forming a monomolecular film, increasing conductivity through moisture absorption and exhibiting an antistatic effect. Another example is a method of chemically treating the surface of a polymer compound to introduce a functional group to prevent charging.
【0003】0003
【発明が解決しようとする課題】従来の帯電防止方法で
は、成形物の表面硬度が優れしかも帯電防止性も優れて
いる製品はほとんど得られなかった。すなわち、成形物
の表面硬度を向上させるため、一般的には硬度の高い化
合物で成形物を被覆する方法が行なわれている。しかし
、この方法において、帯電防止性を付与しようとすると
表面硬度の低下を避けることができず、両者の性能を満
足することは極めて困難であった。[Problems to be Solved by the Invention] Conventional antistatic methods have rarely produced molded products that have excellent surface hardness and antistatic properties. That is, in order to improve the surface hardness of a molded article, a method is generally used in which the molded article is coated with a compound having high hardness. However, in this method, when attempting to impart antistatic properties, a decrease in surface hardness cannot be avoided, and it has been extremely difficult to satisfy both performances.
【0004】0004
【課題を解決するための手段】本発明者等は、従来技術
の問題点を認識し鋭意検討を行った結果、特定組成のモ
ノマーを重合して得られた重合体の表面を特定の条件下
で加水分解処理し、その表層部に多層の酸性基を形成さ
せ、次いで特定の化合物で表面処理することにより極め
て耐久性の優れた帯電防止成形物を製造することに成功
した。[Means for Solving the Problems] The present inventors recognized the problems of the prior art, and as a result of intensive study, the present inventors have developed a method for polymerizing the surface of a polymer obtained by polymerizing monomers of a specific composition under specific conditions. By hydrolyzing it to form a multilayered acidic group on its surface layer, and then surface-treating it with a specific compound, we succeeded in producing an extremely durable antistatic molded product.
【0005】本発明は、1分子中に2個以上の(メタ)
アクリロイルオキシ基を有する多官能性モノマーを主成
分とする重合体を少なくともその表層部に有する有機材
料に対し、 300nm以下の波長を含む紫外線を照射
し、アルカリ処理を行ない該有機材料の表層部に酸性基
を形成し、シリコンアルコキシド−塩化スズ−フッ化ア
ンモニウム及び/又は塩化アンチモン系化合物から成る
溶液を付着させ薄膜を形成し、熱処理することを特徴と
する恒久帯電防止成形物の製造方法に関する。[0005] The present invention provides two or more (meta) molecules in one molecule.
An organic material having at least its surface layer a polymer mainly composed of a polyfunctional monomer having an acryloyloxy group is irradiated with ultraviolet rays containing a wavelength of 300 nm or less and subjected to alkali treatment to coat the surface layer of the organic material. This invention relates to a method for producing a permanently antistatic molded article, which comprises forming an acidic group, depositing a solution consisting of silicon alkoxide, tin chloride, ammonium fluoride, and/or antimony chloride to form a thin film, and heat-treating.
【0006】本発明において、「成形物」とは、一定の
形状を有する物を意味する。また「(メタ)アクリロイ
ル」とは、アクリロイル又はメタアクリロイルを意味す
る。[0006] In the present invention, the term "molded article" means an article having a certain shape. Moreover, "(meth)acryloyl" means acryloyl or methacryloyl.
【0007】本発明において用いられる、1分子中に2
個以上の(メタ)アクリロイルオキシ基を有する多官能
性モノマーとは、例えば1,4ブタンジオールジアクリ
レート、1,6−ヘキサンジオールジアクリレート、ネ
オペンチルグリコールジアクリレート、エチレングリコ
ールジアクリレート、トリエチレングリコールジアクリ
レート、トリプロピレングリコールジアクリレート、ジ
プロピレングリコールジアクリレート、3メチルペンタ
ンジオールジアクリレート、ジエチレングリコールビス
β−アクリロキシプロピオネート、トリメチロールエタ
ンジアクリレート、トリメチロールプロパントリアクリ
レート、ペンタエリスリトールトリアクリレート、ジペ
ンタエリスリトールヘキサアクリレート、トリ(2ヒド
ロキシエチル)イソシアネートジアクリレート、ペンタ
エリスリトールテトラアクリレート、2,3−ビスアク
リロイルオキシエチルオキシメチル〔2,2,1〕ヘプ
タン、ポリ1,2−ブタジエンジアクリレート、1,2
−ビスアクリロイルオキシメチルヘキサン、ノナエチレ
ングリコールジアクリレート、テトラデカンエチレング
リコールジアクリレート、ポリ1,2−ブタジエンジメ
タクリレート、エチレングリコールジメタクリレート、
トリエチレングリコールジメタクリレート、10デカン
ジオールジメタクリレート、3,8ビスアクリロイルオ
キシメチルトリシクロ(5,2,10)デカン水素添加
ビスフェノールAジグリシジルエーテルのジアクリレー
ト、2,2ビス(4−アクリロイルオキシジエトキシフ
ェニル)プロパン、1,4ビス(アクリロイルオキシメ
チル)シクロヘキサン、ヒドロキシピパリン酸エステル
ネオペンチルグリコールジアクリレート、ビスフェノー
ルAジグリシジルエーテルジアクリレート、EO変性ビ
スフェノールAジアクリレート、2−2″ビス(4−メ
タクリロイルオキシジエトキシフェニル)プロパン等を
挙げることができる。なお、多官能性モノマーの代りに
、単官能性モノマー、例えばメチルメタアクリレート等
を単独で用いた場合、即ちポリメチルメタアクリレート
の場合には、酸性基の形成は極少量であり本発明の範囲
に含まれない。[0007] In the present invention, 2
Examples of polyfunctional monomers having at least 2 (meth)acryloyloxy groups include 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, ethylene glycol diacrylate, and triethylene glycol. Diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, 3-methylpentanediol diacrylate, diethylene glycol bisβ-acryloxypropionate, trimethylolethane diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, Pentaerythritol hexaacrylate, tri(2hydroxyethyl)isocyanate diacrylate, pentaerythritol tetraacrylate, 2,3-bisacryloyloxyethyloxymethyl [2,2,1]heptane, poly 1,2-butadiene diacrylate, 1, 2
-bisacryloyloxymethylhexane, nonaethylene glycol diacrylate, tetradecane ethylene glycol diacrylate, poly 1,2-butadiene dimethacrylate, ethylene glycol dimethacrylate,
Triethylene glycol dimethacrylate, 10 decane diol dimethacrylate, 3,8 bisacryloyloxymethyl tricyclo(5,2,10) decane hydrogenated bisphenol A diglycidyl ether diacrylate, 2,2 bis(4-acryloyloxy dimethacrylate) ethoxyphenyl)propane, 1,4 bis(acryloyloxymethyl)cyclohexane, hydroxypiparic acid ester neopentyl glycol diacrylate, bisphenol A diglycidyl ether diacrylate, EO modified bisphenol A diacrylate, 2-2″ bis(4- (methacryloyloxydiethoxyphenyl)propane, etc.In addition, when a monofunctional monomer such as methyl methacrylate is used alone instead of a polyfunctional monomer, that is, in the case of polymethyl methacrylate, , the formation of acidic groups is minimal and is not within the scope of the present invention.
【0008】これら多官能モノマーは、単独または混合
物として用いて重合体とするが場合によっては上記以外
の単官能モノマーとの共重合体であってもよい。本発明
に係る有機材料は、前記重合体単独の成形物及び前記重
合体を各種有機材料基材表面上へ重合積層した成形物を
含む。[0008] These polyfunctional monomers may be used alone or as a mixture to form a polymer, but depending on the case, they may be used as a copolymer with monofunctional monomers other than those mentioned above. The organic material according to the present invention includes a molded product made of the above polymer alone and a molded product obtained by polymerizing and laminating the above polymer onto the surface of various organic material substrates.
【0009】本発明の表面処理では、単独の成形物を使
用してもよいが、より望ましくは各種有機材料基材表面
上へ重合積層した場合が、基材の特徴に加えて表面の特
徴が付加されるため本技術の利用範囲も拡大できる点で
望ましい。[0009] In the surface treatment of the present invention, a single molded product may be used, but it is more preferable to polymerize and laminate it onto the surface of various organic material base materials, so that the surface characteristics in addition to the base material characteristics are improved. This is desirable in that the scope of use of this technology can be expanded because it is added.
【0010】ここにおいて各種有機材料基材とは例えば
アクリル樹脂、ポリカーボネート樹脂、ポリエステル樹
脂、ポリスチレン樹脂、塩化ビニル樹脂その他公知の樹
脂である。[0010] Here, the various organic material base materials include, for example, acrylic resin, polycarbonate resin, polyester resin, polystyrene resin, vinyl chloride resin, and other known resins.
【0011】これらの成形物に対して次の表面処理を行
うことによって表層部の酸性基量を0.02μmol
/cm2 以上にする。まず1分子中に2個以上の(メ
タ)アクリロイルオキシ基を有する成形物に対して紫外
線を含む光を照射する。紫外線による照射は、表層部を
構成する重合体の分子鎖の一部を切断させることにある
。このため例えば分子鎖結合を切断するに必要なエネル
ギー(約4eV以上)を有する紫外線域が望ましい。具
体的な紫外線波長域としては例えば 300nm以下の
短波長紫外線を含む波長にて照射することが必要である
。より具体的な例をあげれば殺菌ランプのように 20
0〜260nm 付近の波長の紫外線を多く含む光源を
用いることが好ましい。照射量は、使用する重合体の組
成が異なると分子間の結合エネルギーが異なるため本発
明の範囲を満足する条件を設定すればよい。By performing the following surface treatment on these molded products, the amount of acidic groups in the surface layer was reduced to 0.02 μmol.
/cm2 or more. First, a molded product having two or more (meth)acryloyloxy groups in one molecule is irradiated with light containing ultraviolet light. The purpose of irradiation with ultraviolet light is to cleave a portion of the molecular chains of the polymer that constitutes the surface layer. For this reason, for example, it is desirable to use an ultraviolet light having the energy (approximately 4 eV or more) necessary to break molecular chain bonds. As a specific ultraviolet wavelength range, it is necessary to irradiate in a wavelength including short wavelength ultraviolet rays of 300 nm or less, for example. A more specific example would be a germicidal lamp.20
It is preferable to use a light source that contains a large amount of ultraviolet light with a wavelength around 0 to 260 nm. The irradiation amount may be set to a condition that satisfies the scope of the present invention, since the intermolecular bond energy differs depending on the composition of the polymer used.
【0012】以上の紫外線照射を行なった処理だけでは
塩基状染料に対する親和性はほとんど向上しないためひ
きつづいてアルカリ処理を行なう。ここでいうアルカリ
処理とは、アルカリ水溶液による処理をいう。具体的に
は例えば水酸化ナトリウム、水酸化カリウムなどの水溶
液、さらには各種溶剤を加えたアルカリ水溶液などがあ
げられる。アルカリ処理の条件は被処理物の組成や形態
及び目的とする性能や紫外線照射量等によって異なるの
で一概には規定できないが例えば水酸化ナトリウムの場
合には濃度0.1〜50重量%、好ましくは1〜30%
、温度0〜100 ℃、好ましくは20〜80℃、時間
0.01〜100 時間、好ましくは0.1〜10時間
である。[0012] Since the affinity for basic dyes is hardly improved by the above-mentioned ultraviolet irradiation treatment alone, an alkali treatment is subsequently performed. The alkali treatment here refers to treatment with an alkaline aqueous solution. Specifically, examples thereof include aqueous solutions of sodium hydroxide, potassium hydroxide, etc., and alkaline aqueous solutions containing various solvents. The conditions for alkaline treatment cannot be unconditionally defined because they vary depending on the composition and form of the object to be treated, the desired performance, the amount of ultraviolet irradiation, etc., but for example, in the case of sodium hydroxide, the concentration is 0.1 to 50% by weight, preferably 1-30%
The temperature is 0 to 100°C, preferably 20 to 80°C, and the time is 0.01 to 100 hours, preferably 0.1 to 10 hours.
【0013】アルカリ処理を行った有機材料をついで水
洗し場合によってはさらに無機酸や有機酸で中和洗浄し
てもよい。かくして得られた有機材料は表層部に0.0
2μmol /cm2 以上の酸性基が生成する。ここ
において酸性基量は、塩基性染料が本発明でいう重合体
の表面の単位面積当りに吸着しうるモル数(μmol
/cm2)を表わし次の測定法により求めた値である。The organic material subjected to the alkali treatment may then be washed with water and, if necessary, further neutralized and washed with an inorganic acid or an organic acid. The organic material thus obtained has a surface layer of 0.0
2 μmol/cm2 or more of acidic groups are generated. Here, the amount of acidic groups refers to the number of moles (μmol) that the basic dye can adsorb per unit area of the surface of the polymer referred to in the present invention.
/cm2) and is a value determined by the following measurement method.
【0014】(1)0.1規定の酢酸ナトリウム緩衝液
(pH4.5)を作成する。
(2)メチルバイオレットの濃度が1.0g/lである
溶液を(1)の緩衝液を用いて調整する。
(3)この溶液中に50×50mm2 のプラスチック
成形物を48〜72時間浸漬する。
(4)プラスチック成形物を水洗する。
(5)水分を拭き去る。
(6)n−ジメチルホルムアミド液中に浸漬し、染料を
抽出溶解する。
(7)染料抽出液を 589nmの光を用いて吸光度を
測定する。
(8)別途n−ジメチルホルムアミド液に溶解した染料
溶液より染料濃度の検量線を求め、プラスチック成形物
の単位面積当りの塩基性染料濃度を算出する。(1) Prepare a 0.1N sodium acetate buffer (pH 4.5). (2) A solution with a methyl violet concentration of 1.0 g/l is prepared using the buffer solution of (1). (3) A 50 x 50 mm2 plastic molded article is immersed in this solution for 48 to 72 hours. (4) Wash the plastic molded product with water. (5) Wipe off moisture. (6) Immerse in n-dimethylformamide solution to extract and dissolve the dye. (7) Measure the absorbance of the dye extract using 589 nm light. (8) Separately, a calibration curve of dye concentration is obtained from a dye solution dissolved in n-dimethylformamide solution, and the basic dye concentration per unit area of the plastic molded article is calculated.
【0015】かくして得られた成形物の表層部には多量
の酸性基が形成され、しかも酸性基の形成層が表層部に
限られるため、多官能性(メタ)アクリレートモノマー
を多く含む層の硬度は、処理前とほとんど変らない。[0015] A large amount of acidic groups are formed on the surface layer of the molded product thus obtained, and since the layer in which acidic groups are formed is limited to the surface layer, the hardness of the layer containing a large amount of polyfunctional (meth)acrylate monomer is is almost unchanged from before treatment.
【0016】得られた成形物を、ついでシリコンアルコ
キシド−塩化スズ−フッ化アンモニウム及び/又は塩化
アンチモン系の化合物で処理する。前記化合物において
シリコンアルコキシドは、一般式Si(OR)n で表
わされるものである。ここでRはアルキル基、nは金属
元素の酸化数である。本発明において好ましいシリコン
アルコキシドとは、例えばテトラエトキシシランSi(
OC2H5)4、テトラメトキシシランSi(OCH3
)4 、等である。一般的には前記化合物を溶媒に溶解
して使用する。The obtained molded product is then treated with a silicon alkoxide-tin chloride-ammonium fluoride and/or antimony chloride compound. In the above compound, the silicon alkoxide is represented by the general formula Si(OR)n. Here, R is an alkyl group, and n is the oxidation number of the metal element. Preferred silicon alkoxides in the present invention include, for example, tetraethoxysilane Si (
OC2H5)4, tetramethoxysilane Si (OCH3
)4, etc. Generally, the above compound is used after being dissolved in a solvent.
【0017】成形物に付着させる方法は特に限定しない
が、例えばスプレー、浸漬、ローラコーティング、スピ
ンコーティング等の公知の方法で付着させ、成形物の表
面に薄膜を形成させついで熱処理を行なう。これら一連
の工程を経過させることにより、成形物の表層部に生成
した酸性基とそれに配位した化合物が薄膜形成するため
恒久性のある帯電防止成形物が得られる。[0017] The method of adhering to the molded product is not particularly limited, but it may be applied by a known method such as spraying, dipping, roller coating, spin coating, etc., to form a thin film on the surface of the molded product, and then heat-treated. By going through these series of steps, the acidic groups generated on the surface layer of the molded product and the compound coordinated therewith form a thin film, so that a permanent antistatic molded product can be obtained.
【0018】本発明でいう帯電防止性とは、成形物の表
面抵抗値が1011Ωよりも低い値を示すものであり、
化合物の構成比を適宜選定することによって 105Ω
以下にすることも可能である。なお表面抵抗値とは、2
0℃×65%RHの雰囲気において、通常の四探針法(
JIS−H0602に準拠)により測定した値である。[0018] Antistatic property as used in the present invention means that the surface resistance value of the molded product is lower than 1011Ω.
105Ω by appropriately selecting the composition ratio of the compound
It is also possible to do the following. The surface resistance value is 2
In an atmosphere of 0°C x 65% RH, the normal four-point probe method (
This is a value measured in accordance with JIS-H0602).
【0019】前記化合物はシリコンアルコキシド60.
0〜95.0重量%、塩化スズ25.0〜4.8重量%
、フッ化アンモニウム及び/又は塩化アンチモン10〜
0.2重量%の構成範囲内での化合物として用いるのが
好ましい。また溶媒として、エチルアルコール、メチル
アルコール、イソプロピルアルコール、ブチルアルコー
ル等のアルコール類、ジメチルフォルムアミド、メチル
エチルケトン、アセトン、酢酸エチル、酢酸ブチル、水
、並びに少量の塩酸、硫酸、酢酸、アンモニア等の重縮
合促進剤を添加してもよい。これら溶媒中に前記化合物
を0.5〜70重量%混合させることが好ましい。The above compound is silicon alkoxide 60.
0-95.0% by weight, tin chloride 25.0-4.8% by weight
, ammonium fluoride and/or antimony chloride 10~
Preferably, the compound is used within a composition range of 0.2% by weight. In addition, as a solvent, alcohols such as ethyl alcohol, methyl alcohol, isopropyl alcohol, butyl alcohol, dimethyl formamide, methyl ethyl ketone, acetone, ethyl acetate, butyl acetate, water, and small amounts of polycondensation of hydrochloric acid, sulfuric acid, acetic acid, ammonia, etc. Accelerators may also be added. It is preferable to mix 0.5 to 70% by weight of the above compound in these solvents.
【0020】しかしながら、溶媒中に混合した化合物の
重縮合の反応状態によって粘度が変化し、成形物表面へ
付着する膜厚が異なってくる。このため適宜、化合物の
構成、溶媒の選定等によって条件設定を行ってよく、本
発明に限定されるものでない。成形物表面へ付着させる
好ましい膜厚は、50Å〜3μm である。50Å以下
であると表面抵抗値が大きくなり、3μm の膜厚を越
えると、硬度の高い膜であるために有機材料である成形
物と化合物との熱膨張率差及び機械的な強度の差異によ
ってクラックが生じるなどの欠陥が発生する。However, the viscosity changes depending on the reaction state of the polycondensation of the compound mixed in the solvent, and the thickness of the film adhered to the surface of the molded article differs. For this reason, conditions may be set as appropriate by selecting the composition of the compound, the selection of the solvent, etc., and the conditions are not limited to the present invention. The preferred thickness of the film to be adhered to the surface of the molded product is 50 Å to 3 μm. If the thickness is less than 50 Å, the surface resistance value will increase, and if the film thickness exceeds 3 μm, the film will have a high hardness due to the difference in thermal expansion coefficient and mechanical strength between the molded organic material and the compound. Defects such as cracks occur.
【0021】本発明の熱処理は、前記化合物と成形物表
層部に生成した酸性基の間の配位を向上させるための温
度であり、50℃〜 130℃の範囲が望ましい。上限
の温度は、使用する成形物の変形温度以下であればよく
何ら限定されるものでない。[0021] The heat treatment of the present invention is carried out at a temperature in order to improve the coordination between the compound and the acidic groups formed on the surface layer of the molded article, and is preferably in the range of 50°C to 130°C. The upper limit temperature is not particularly limited as long as it is below the deformation temperature of the molded product used.
【0022】[0022]
【実施例】例1
モノマー混合物としてジペンタエリスリトールヘキサア
クリレート10重量%、コハク酸/トリメチロールエタ
ン/アクリル酸の等モル縮合物20重量%、テトラヒド
ロフルフリルアクリレート5重量%、光開始剤「ダロキ
ュア1173」(メルク社製)1.2重量%、イソプロ
パノール34重量%、トルエン30重量%からなる、溶
液中に厚さ3mmのポリメチルメタクリレート樹脂板を
浸漬した後、0.2cm/sec の速度でゆっくりと
引き上げ樹脂板の表面に該組成物の塗布被膜を積層形成
せしめた。これを35℃の温度に保ち、そのままの状態
で該樹脂板の両面から15cmの距離で、中心波長域3
65nm を有する高圧水銀灯を用い 840mJ/c
m2 の照射量にて、厚さ3.5μm の硬化被膜を形
成させた。得られた樹脂板の表層部は、 JIS K5
400に定められた鉛筆硬度5Hであった。次いで中心
波長域254nm を有する低圧水銀灯を用いて130
0mJ/cm2 の照射量にて照射した。得られた樹脂
板の表層部は、鉛筆硬度5Hを維持しており塩基性染料
メチルバイオレットによって測定した酸性基量は、 0
.012μmol /cm2 であり本発明を満足して
いなかった。そこで該照射した樹脂板を20重量%の水
酸化ナトリウム水溶液中に室温で3時間浸漬後水洗乾燥
し、0.05重量%の硫酸水溶液に室温で1分間浸漬し
水洗乾燥した。Examples Example 1 Monomer mixture: 10% by weight of dipentaerythritol hexaacrylate, 20% by weight of equimolar condensate of succinic acid/trimethylolethane/acrylic acid, 5% by weight of tetrahydrofurfuryl acrylate, photoinitiator "Darocur 1173" A polymethyl methacrylate resin plate with a thickness of 3 mm was immersed in a solution containing 1.2% by weight of ``Merck &Co.'' (manufactured by Merck & Co., Ltd.), 34% by weight of isopropanol, and 30% by weight of toluene, and then slowly immersed at a speed of 0.2 cm/sec. A coating film of the composition was laminated on the surface of the pulled resin plate. This was maintained at a temperature of 35°C, and in that state, at a distance of 15 cm from both sides of the resin plate,
840mJ/c using a high pressure mercury lamp with 65nm
A cured film with a thickness of 3.5 μm was formed at an irradiation dose of m2. The surface layer of the obtained resin plate is JIS K5
The pencil hardness was 5H, defined as 400. Then, using a low-pressure mercury lamp with a central wavelength range of 254 nm,
Irradiation was performed at an irradiation dose of 0 mJ/cm2. The surface layer of the obtained resin plate maintains a pencil hardness of 5H, and the amount of acidic groups measured with the basic dye methyl violet is 0.
.. 012 μmol/cm2, which did not satisfy the present invention. Therefore, the irradiated resin plate was immersed in a 20% by weight aqueous sodium hydroxide solution at room temperature for 3 hours, washed and dried, and then immersed in a 0.05% by weight sulfuric acid aqueous solution at room temperature for 1 minute, washed and dried.
【0023】得られた樹脂は低圧水銀灯による照射面に
のみ酸性基量として0.05μmol /cm2 の値
を有しており塩基性染料による染色性に優れかつ鉛筆硬
度も5Hを維持していた。The obtained resin had an acidic group content of 0.05 μmol/cm 2 only on the surface irradiated by the low-pressure mercury lamp, had excellent stainability with basic dyes, and maintained a pencil hardness of 5H.
【0024】
該成形物を以下の方法に従って帯電防止処理を行った。
(イ)化合物溶液の調製
テトラエトキシシラン 4.0g塩化第2ス
ズ 5.0gフッ化アンモ
ニウム 0.5gイソプロピルアルコー
ル 1000g水
10g塩 酸
1gの混合溶液
として室温にて1時間攪拌し化合物を調製する。[0024]The molded product was subjected to antistatic treatment according to the following method. (a) Preparation of compound solution Tetraethoxysilane 4.0g Stannic chloride 5.0g Ammonium fluoride 0.5g Isopropyl alcohol 1000g Water
10g hydrochloric acid
A compound is prepared by stirring 1 g of a mixed solution at room temperature for 1 hour.
【0025】(ロ)上記調製溶液中に成形物を5分間浸
漬し、10cm/sec の速度で引き上げた後、80
℃の温度で30分間乾燥処理を行なう。得られた成形物
の表面電気抵抗値は5×106 Ωを示し、さらに20
℃,45%RHの雰囲気においても、5×106 Ωを
示し、湿度の変化に対して安定な帯電防止能を有してい
た。(b) The molded product was immersed in the above prepared solution for 5 minutes, pulled up at a speed of 10 cm/sec, and then
A drying process is carried out for 30 minutes at a temperature of .degree. The surface electrical resistance value of the obtained molded product was 5×106 Ω, and further 20
Even in an atmosphere of 45% RH and 45% RH, it exhibited a resistance of 5 x 106 Ω, and had stable antistatic ability against changes in humidity.
【0026】なお、洗剤及び流水洗等による洗浄に対し
ても、表面電気抵抗値の変化はなく、帯電防止性の優れ
た成形物が得られ満足するものであった。[0026] Even after washing with detergent and running water, there was no change in the surface electrical resistance value, and a molded product with excellent antistatic properties was obtained, which was satisfactory.
【0027】例2
モノマー混合物として、トリメチロールエタンジアクリ
レート8.5重量%、1,6−ヘキサンジオールジアク
リレート60重量%、琥珀酸/トリメチロールエタン/
アクリル酸の等モル縮合物20重量%、光開始剤ベンゾ
インエチルエーテル1.5重量%からなる混合液を厚さ
3mmのポリカーボネート板の片面にロールコーターで
塗布し、表面に該組成物の塗布被膜を積層形成せしめた
。これを40℃の温度に保ち窒素ガスを流通した石英管
内に入れ、3分間保持した後、そのままの状態で該樹脂
板の塗布面から30cmの距離で中心波長365nm
を有する高圧水銀灯を用い800mJ/cm2 の照射
量にて照射し、厚さ18μm の硬化被膜を形成させた
。得られた樹脂板の表層部は、 JIS K5400鉛
筆硬度Hであった。次いで中心波長254nm を有す
る低圧水銀灯を用いて4000mJ/cm2 の照射量
にて照射した。得られた樹脂板の表層部は鉛筆硬度Hを
維持しており塩基性染料メチルバイオレットにより染色
し測定した酸性基量は、 0.015μmol /cm
2であり本発明を満足していなかった。そこで該照射し
た樹脂板を水酸化ナトリウム10重量%水溶液中に室温
で10時間浸漬後水洗、乾燥しそして0.1重量%の塩
酸水溶液に室温で5分間浸漬し水洗乾燥した。Example 2 Monomer mixture: 8.5% by weight of trimethylolethane diacrylate, 60% by weight of 1,6-hexanediol diacrylate, succinic acid/trimethylolethane/
A mixed solution consisting of 20% by weight of an equimolar condensate of acrylic acid and 1.5% by weight of the photoinitiator benzoin ethyl ether is applied to one side of a 3 mm thick polycarbonate plate using a roll coater to form a coated film of the composition on the surface. were laminated. This was placed in a quartz tube kept at a temperature of 40°C and nitrogen gas was passed through it, and held for 3 minutes.
Using a high-pressure mercury lamp with a high-pressure mercury lamp, irradiation was performed at a dose of 800 mJ/cm 2 to form a cured film with a thickness of 18 μm. The surface layer portion of the obtained resin plate had a JIS K5400 pencil hardness of H. Next, irradiation was performed using a low-pressure mercury lamp having a center wavelength of 254 nm at an irradiation dose of 4000 mJ/cm2. The surface layer of the obtained resin plate maintains a pencil hardness of H, and the amount of acidic groups measured by dyeing with basic dye methyl violet is 0.015 μmol / cm.
2, which did not satisfy the present invention. Therefore, the irradiated resin plate was immersed in a 10% by weight aqueous sodium hydroxide solution at room temperature for 10 hours, washed with water, dried, and then immersed in a 0.1% by weight hydrochloric acid aqueous solution at room temperature for 5 minutes, washed with water, and dried.
【0028】得られた樹脂は、低圧水銀灯による照射面
にのみ酸性基量として0.12μmol /cm2 の
値を有しており鉛筆硬度Hを維持していた。The obtained resin had an acidic group content of 0.12 μmol/cm2 only on the surface irradiated by the low-pressure mercury lamp, and maintained a pencil hardness of H.
【0029】該成形物を以下の方法にしたがって、帯電
防止処理を行なった。
(イ)化合物溶液の調製
テトラエトキシシラン 150gエチルア
ルコール 150g水
20g塩
化第2スズ 5g三
塩化アンチモン 1g塩
酸 1
gの混合溶液として室温にて1時間攪拌し化合物を調製
する。The molded product was subjected to antistatic treatment according to the following method. (a) Preparation of compound solution Tetraethoxysilane 150g Ethyl alcohol 150g Water
20g stannic chloride 5g antimony trichloride 1g salt
acid 1
A mixed solution of g is stirred at room temperature for 1 hour to prepare a compound.
【0030】(ロ)上記調製溶液中に成形物を5分間浸
漬し、10cm/sec の速度で引き上げた後、70
℃の温度で30分間乾燥処理を行なう。得られた成形物
の表面電気抵抗値は2×107 Ωを示し、さらに20
℃,45%RHの雰囲気においても2×107 Ωを示
し、湿度の変化に対して安定な帯電防止能を有していた
。(b) After immersing the molded product in the above prepared solution for 5 minutes and pulling it up at a speed of 10 cm/sec,
A drying process is carried out for 30 minutes at a temperature of .degree. The surface electrical resistance value of the obtained molded product was 2×107 Ω, and further 20
It exhibited a resistance of 2×10 7 Ω even in an atmosphere of 45% RH and had stable antistatic ability against changes in humidity.
【0031】なお洗剤や流水洗等による洗浄に対しても
、表面電気抵抗値の変化はなく、帯電防止性の優れた成
形物が得られ満足するものであった。Even after washing with detergent or running water, there was no change in the surface electrical resistance value, and a molded product with excellent antistatic properties was obtained, which was satisfactory.
【0032】[0032]
【発明の効果】本発明の方法によって得られた成形物は
その表層部に多量の酸性基とそれに配位した化合物が付
着して存在するため極めて耐久性の優れた帯電防止性を
示し水洗、摩擦溶剤処理等による帯電防止効果の低下が
極めて少ない。Effects of the Invention The molded product obtained by the method of the present invention has a large amount of acidic groups and compounds coordinated thereon attached to the surface layer, so it exhibits extremely durable antistatic properties and is easily washed with water. There is very little reduction in antistatic effect due to friction solvent treatment, etc.
Claims (1)
て、1分子中に2個以上のアクリロイルオキシ基又はメ
タアクリロイルオキシ基を有する多官能性モノマーを主
成分とする重合体を少なくともその表層部に有する有機
材料に対し、 300nm以下の波長を含む紫外線を照
射し、アルカリ処理を行ない該有機材料の表層部に酸性
基を形成し、シリコンアルコキシド−塩化スズ−フッ化
アンモニウム及び/又は塩化アンチモン系化合物から成
る溶液を付着させ薄膜を形成し、熱処理することを特徴
とする方法。1. A method for producing a permanently antistatic molded product, comprising: a polymer mainly composed of a polyfunctional monomer having two or more acryloyloxy groups or methacryloyloxy groups in one molecule; The organic material contained in the organic material is irradiated with ultraviolet rays having a wavelength of 300 nm or less and subjected to alkali treatment to form acidic groups on the surface layer of the organic material. A method characterized by depositing a solution consisting of a system compound to form a thin film, and then heat-treating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2409307A JPH04234442A (en) | 1990-12-28 | 1990-12-28 | Production of permanently antistatic molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2409307A JPH04234442A (en) | 1990-12-28 | 1990-12-28 | Production of permanently antistatic molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04234442A true JPH04234442A (en) | 1992-08-24 |
Family
ID=18518651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2409307A Pending JPH04234442A (en) | 1990-12-28 | 1990-12-28 | Production of permanently antistatic molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04234442A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5470616A (en) * | 1992-12-23 | 1995-11-28 | Mitsubishi Rayon Co., Ltd. | Coated shaped articles and method of making same |
-
1990
- 1990-12-28 JP JP2409307A patent/JPH04234442A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5470616A (en) * | 1992-12-23 | 1995-11-28 | Mitsubishi Rayon Co., Ltd. | Coated shaped articles and method of making same |
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