JPH0423323Y2 - - Google Patents
Info
- Publication number
- JPH0423323Y2 JPH0423323Y2 JP1986005325U JP532586U JPH0423323Y2 JP H0423323 Y2 JPH0423323 Y2 JP H0423323Y2 JP 1986005325 U JP1986005325 U JP 1986005325U JP 532586 U JP532586 U JP 532586U JP H0423323 Y2 JPH0423323 Y2 JP H0423323Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductive path
- substrates
- resin
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986005325U JPH0423323Y2 (en:Method) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986005325U JPH0423323Y2 (en:Method) | 1986-01-17 | 1986-01-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118440U JPS62118440U (en:Method) | 1987-07-28 |
| JPH0423323Y2 true JPH0423323Y2 (en:Method) | 1992-05-29 |
Family
ID=30786803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986005325U Expired JPH0423323Y2 (en:Method) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423323Y2 (en:Method) |
-
1986
- 1986-01-17 JP JP1986005325U patent/JPH0423323Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118440U (en:Method) | 1987-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5828848A (ja) | 集積回路、半導体デバイスおよびコンポ−ネントの取付方法 | |
| JPS6011809B2 (ja) | 混成集積回路 | |
| JPH10149901A (ja) | 電気抵抗器および電気抵抗器の製造方法 | |
| JPH0423323Y2 (en:Method) | ||
| JPH0412680Y2 (en:Method) | ||
| JPH0442937Y2 (en:Method) | ||
| JPH0442938Y2 (en:Method) | ||
| JPH0423322Y2 (en:Method) | ||
| JPH08330356A (ja) | 導体層付異方性導電シートおよびこれを用いた配線基板 | |
| JPH043500Y2 (en:Method) | ||
| JPH0159755B2 (en:Method) | ||
| JPH0220860Y2 (en:Method) | ||
| JPH0423321Y2 (en:Method) | ||
| JP2954559B2 (ja) | 配線基板の電極構造 | |
| JPH0735413Y2 (ja) | 混成集積回路におけるチツプ電子部品の取付構造 | |
| JPS62149144A (ja) | 混成集積回路 | |
| JPH0445253Y2 (en:Method) | ||
| JPS62149147A (ja) | 混成集積回路 | |
| JPS62149145A (ja) | 混成集積回路 | |
| JPH0719858B2 (ja) | 混成集積回路装置の製造方法 | |
| JPS62149146A (ja) | 混成集積回路 | |
| JPH0359591B2 (en:Method) | ||
| JPH0631723Y2 (ja) | 半導体装置 | |
| JPH056714Y2 (en:Method) | ||
| JPS6331367Y2 (en:Method) |