JPH04225261A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPH04225261A
JPH04225261A JP40762190A JP40762190A JPH04225261A JP H04225261 A JPH04225261 A JP H04225261A JP 40762190 A JP40762190 A JP 40762190A JP 40762190 A JP40762190 A JP 40762190A JP H04225261 A JPH04225261 A JP H04225261A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
tape
adhesive
chips
wafer
pasted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP40762190A
Other versions
JP2575950B2 (en )
Inventor
Yutaka Yamada
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers

Abstract

PURPOSE: To offer the manufacturing method, of a semiconductor device, which cuts a wafer pasted on an adhesive tape or the like into chips, by which the wafer is fixed surely to the adhesive tape or the like when it is cut and by which the cut chips can be stripped off easily without being damaged when the chips are taken up.
CONSTITUTION: A wafer 10 is diced from the surface of the wafer 10 on which a first adhesive tape 9 has been pasted on the rear; chips are formed; after that, said first adhesive tape 9 is treated so as to weaken its adhesive power; after that, a holding tape 13 is pasted on the surface; after that, said first adhesive tape 9 is stripped off from the rear; after that, a nonadhesive tape 14 or a second adhesive tape is pasted on the rear; after that, said holding tape 13 is stripped off from the surface.
COPYRIGHT: (C)1992,JPO&Japio
JP40762190A 1990-12-27 1990-12-27 A method of manufacturing a semiconductor device Expired - Fee Related JP2575950B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40762190A JP2575950B2 (en) 1990-12-27 1990-12-27 A method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40762190A JP2575950B2 (en) 1990-12-27 1990-12-27 A method of manufacturing a semiconductor device

Publications (2)

Publication Number Publication Date
JPH04225261A true true JPH04225261A (en) 1992-08-14
JP2575950B2 JP2575950B2 (en) 1997-01-29

Family

ID=18517188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40762190A Expired - Fee Related JP2575950B2 (en) 1990-12-27 1990-12-27 A method of manufacturing a semiconductor device

Country Status (1)

Country Link
JP (1) JP2575950B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001043169A2 (en) * 1999-12-08 2001-06-14 Analog Devices, Inc. Methods for separating microcircuit dies from wafers
US6303471B1 (en) * 1998-10-14 2001-10-16 Nippon Telegraph And Telephone Corporation Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device
US6727163B2 (en) 2002-02-25 2004-04-27 Samsung Electronics Co., Ltd. Method for sawing wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303471B1 (en) * 1998-10-14 2001-10-16 Nippon Telegraph And Telephone Corporation Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device
WO2001043169A2 (en) * 1999-12-08 2001-06-14 Analog Devices, Inc. Methods for separating microcircuit dies from wafers
WO2001043169A3 (en) * 1999-12-08 2001-12-13 Analog Devices Inc Methods for separating microcircuit dies from wafers
US6727163B2 (en) 2002-02-25 2004-04-27 Samsung Electronics Co., Ltd. Method for sawing wafer

Also Published As

Publication number Publication date Type
JP2575950B2 (en) 1997-01-29 grant

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19960730

LAPS Cancellation because of no payment of annual fees