JPH0421070U - - Google Patents
Info
- Publication number
- JPH0421070U JPH0421070U JP6166690U JP6166690U JPH0421070U JP H0421070 U JPH0421070 U JP H0421070U JP 6166690 U JP6166690 U JP 6166690U JP 6166690 U JP6166690 U JP 6166690U JP H0421070 U JPH0421070 U JP H0421070U
- Authority
- JP
- Japan
- Prior art keywords
- wiring member
- conductive wiring
- electrode
- shrink
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000565 sealant Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6166690U JPH0421070U (forum.php) | 1990-06-11 | 1990-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6166690U JPH0421070U (forum.php) | 1990-06-11 | 1990-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0421070U true JPH0421070U (forum.php) | 1992-02-21 |
Family
ID=31590122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6166690U Pending JPH0421070U (forum.php) | 1990-06-11 | 1990-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421070U (forum.php) |
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1990
- 1990-06-11 JP JP6166690U patent/JPH0421070U/ja active Pending