JPH0420269B2 - - Google Patents
Info
- Publication number
- JPH0420269B2 JPH0420269B2 JP13426683A JP13426683A JPH0420269B2 JP H0420269 B2 JPH0420269 B2 JP H0420269B2 JP 13426683 A JP13426683 A JP 13426683A JP 13426683 A JP13426683 A JP 13426683A JP H0420269 B2 JPH0420269 B2 JP H0420269B2
- Authority
- JP
- Japan
- Prior art keywords
- strip
- present
- layer
- alloy
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000011162 core material Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13426683A JPS6027151A (ja) | 1983-07-25 | 1983-07-25 | 半導体素子搭載用複合金属条 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13426683A JPS6027151A (ja) | 1983-07-25 | 1983-07-25 | 半導体素子搭載用複合金属条 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027151A JPS6027151A (ja) | 1985-02-12 |
| JPH0420269B2 true JPH0420269B2 (zh) | 1992-04-02 |
Family
ID=15124277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13426683A Granted JPS6027151A (ja) | 1983-07-25 | 1983-07-25 | 半導体素子搭載用複合金属条 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027151A (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4894293A (en) * | 1988-03-10 | 1990-01-16 | Texas Instruments Incorporated | Circuit system, a composite metal material for use therein, and a method for making the material |
| JPH0247054U (zh) * | 1988-09-26 | 1990-03-30 | ||
| US5151777A (en) * | 1989-03-03 | 1992-09-29 | Delco Electronics Corporation | Interface device for thermally coupling an integrated circuit to a heat sink |
| DE69028378T2 (de) * | 1989-12-12 | 1997-03-06 | Sumitomo Spec Metals | Verfahren zur Herstellung eines wärmeleitenden Mischmaterial |
| JPH06188324A (ja) * | 1992-12-16 | 1994-07-08 | Kyocera Corp | 半導体装置 |
-
1983
- 1983-07-25 JP JP13426683A patent/JPS6027151A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6027151A (ja) | 1985-02-12 |
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