JPH04199725A - Inner lead bonding equipment - Google Patents

Inner lead bonding equipment

Info

Publication number
JPH04199725A
JPH04199725A JP33391890A JP33391890A JPH04199725A JP H04199725 A JPH04199725 A JP H04199725A JP 33391890 A JP33391890 A JP 33391890A JP 33391890 A JP33391890 A JP 33391890A JP H04199725 A JPH04199725 A JP H04199725A
Authority
JP
Japan
Prior art keywords
chip
film carrier
bump
lead bonding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33391890A
Other languages
Japanese (ja)
Other versions
JP2785484B2 (en
Inventor
Hiroshi Haji
Kiyoshi Arita
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP33391890A priority Critical patent/JP2785484B2/en
Priority claimed from US07/795,218 external-priority patent/US5207369A/en
Publication of JPH04199725A publication Critical patent/JPH04199725A/en
Application granted granted Critical
Publication of JP2785484B2 publication Critical patent/JP2785484B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE: To make it possible to perform the operation to form a bump on a chip and the inner lead bonding operation to bond a lead of a film carrier on that bump with the same equipment, by replacing a capillary tool with a pressing tool.
CONSTITUTION: When a bump is formed on a chip, a film carrier 4 is removed, a capillary tool is supported by a horn 35, a chip stage 16 is moved to just under the capillary tool, then, the capillary tool is moved in the direction of X-Y to form a bump on the surface of the chip while wire is fed. Moreover. for inner lead bonding, a pressing tool 52 is supported by a horn 35, the film carrier is set to pitch-feed the film carrier. Then, an X-Y table 11 is driven to move the chip to just under the film carrier 4 so that the bumper of this chip is bonded to the lead of the film carrier 4, thereby making it possible to perform the bump forming and the inner lead bonding with one equipment.
COPYRIGHT: (C)1992,JPO&Japio
JP33391890A 1990-11-29 1990-11-29 Inner lead bonding apparatus and inner lead bonding method Expired - Lifetime JP2785484B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33391890A JP2785484B2 (en) 1990-11-29 1990-11-29 Inner lead bonding apparatus and inner lead bonding method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33391890A JP2785484B2 (en) 1990-11-29 1990-11-29 Inner lead bonding apparatus and inner lead bonding method
US07/795,218 US5207369A (en) 1990-11-29 1991-11-20 Inner lead bonding apparatus
US07/983,026 US5288008A (en) 1990-11-29 1992-11-30 Method of forming inner lead bonding on a microchip

Publications (2)

Publication Number Publication Date
JPH04199725A true JPH04199725A (en) 1992-07-20
JP2785484B2 JP2785484B2 (en) 1998-08-13

Family

ID=18271424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33391890A Expired - Lifetime JP2785484B2 (en) 1990-11-29 1990-11-29 Inner lead bonding apparatus and inner lead bonding method

Country Status (1)

Country Link
JP (1) JP2785484B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522263A (en) * 1994-04-25 1996-06-04 Matsushita Electric Industrial Co., Ltd. Apparatus and method for inspecting soldering condition of electronic component by using ultrasonic oscillation
KR100715453B1 (en) * 2000-12-30 2007-05-09 현대엘씨디주식회사 Movable Type Bonding Apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5522263A (en) * 1994-04-25 1996-06-04 Matsushita Electric Industrial Co., Ltd. Apparatus and method for inspecting soldering condition of electronic component by using ultrasonic oscillation
KR100715453B1 (en) * 2000-12-30 2007-05-09 현대엘씨디주식회사 Movable Type Bonding Apparatus

Also Published As

Publication number Publication date
JP2785484B2 (en) 1998-08-13

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