JPH04196263A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPH04196263A
JPH04196263A JP2326896A JP32689690A JPH04196263A JP H04196263 A JPH04196263 A JP H04196263A JP 2326896 A JP2326896 A JP 2326896A JP 32689690 A JP32689690 A JP 32689690A JP H04196263 A JPH04196263 A JP H04196263A
Authority
JP
Japan
Prior art keywords
chip
pads
circuit
memory
memory circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2326896A
Inventor
Hiroyuki Hamano
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2326896A priority Critical patent/JPH04196263A/en
Publication of JPH04196263A publication Critical patent/JPH04196263A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16135Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

Abstract

PURPOSE: To make possible the realization of a chip size, which does not depend on a memory capacity, and to make it possible to obtain a large-scale semiconductor integrated circuit by a method wherein a memory circuit and a peripheral circuit for memory circuit use or a memory circuit and one part of a peripheral circuit for memory circuit use are respectively formed into the constitution of a separate chip.
CONSTITUTION: The mutual chips of a parent chip 1 and a memory function chip 2 are respectively connected to the upper part of the chip 1 and the upper part of the chip 2 and pads 4 for bonding use are provided for feeding necessary signal or power supply from the chip 1 to the chip 2. A material 5 for ohmic contact use and a metal bonding material 6 are placed on these pads, the pads are made to face each other and the chips 1 and 2 are bonded together in a such a way that the signals or power pads of chips 1 and 2 are made to oppose to each other. Thereby, a memory circuit constituted on one chip constituted as a separate chip and a large-scale semiconductor integrated circuit can be obtained.
COPYRIGHT: (C)1992,JPO&Japio
JP2326896A 1990-11-27 1990-11-27 Semiconductor integrated circuit Pending JPH04196263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2326896A JPH04196263A (en) 1990-11-27 1990-11-27 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2326896A JPH04196263A (en) 1990-11-27 1990-11-27 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH04196263A true JPH04196263A (en) 1992-07-16

Family

ID=18192959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2326896A Pending JPH04196263A (en) 1990-11-27 1990-11-27 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH04196263A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1233444A3 (en) * 1992-04-08 2002-12-11 LEEDY, Glenn J. Membrane dielectric isolation ic fabrication
DE10142119A1 (en) * 2001-08-30 2003-03-27 Infineon Technologies Ag Electronic component and method for its preparation
JP2006012358A (en) * 2004-06-29 2006-01-12 Elpida Memory Inc Stacked semiconductor memory device
US7221614B2 (en) 2004-06-28 2007-05-22 Nec Corporation Stacked semiconductor memory device
US7330368B2 (en) 2004-06-29 2008-02-12 Nec Corporation Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections
US7352067B2 (en) 2004-06-30 2008-04-01 Nec Corporation Stacked semiconductor device
US7764564B2 (en) 2006-12-04 2010-07-27 Nec Corporation Semiconductor device
US8315331B2 (en) 2008-02-28 2012-11-20 Nec Corporation Transmission method, transmission circuit and transmission system
US8477855B2 (en) 2006-01-30 2013-07-02 Nec Corporation Signal transmission system and semiconductor integrated circuit device
US8588681B2 (en) 2007-02-23 2013-11-19 Nec Corporation Semiconductor device performing signal transmission by using inductor coupling
US8928119B2 (en) 1997-04-04 2015-01-06 Glenn J. Leedy Three dimensional structure memory

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1233444A3 (en) * 1992-04-08 2002-12-11 LEEDY, Glenn J. Membrane dielectric isolation ic fabrication
US6682981B2 (en) 1992-04-08 2004-01-27 Elm Technology Corporation Stress controlled dielectric integrated circuit fabrication
US6713327B2 (en) 1992-04-08 2004-03-30 Elm Technology Corporation Stress controlled dielectric integrated circuit fabrication
US6765279B2 (en) 1992-04-08 2004-07-20 Elm Technology Corporation Membrane 3D IC fabrication
US8933570B2 (en) 1997-04-04 2015-01-13 Elm Technology Corp. Three dimensional structure memory
US8928119B2 (en) 1997-04-04 2015-01-06 Glenn J. Leedy Three dimensional structure memory
US9401183B2 (en) 1997-04-04 2016-07-26 Glenn J. Leedy Stacked integrated memory device
DE10142119B4 (en) * 2001-08-30 2007-07-26 Infineon Technologies Ag Electronic component and method for its production
DE10142119A1 (en) * 2001-08-30 2003-03-27 Infineon Technologies Ag Electronic component and method for its preparation
US6683374B2 (en) 2001-08-30 2004-01-27 Infineon Technologies Ag Electronic component and process for producing the electronic component
US7221614B2 (en) 2004-06-28 2007-05-22 Nec Corporation Stacked semiconductor memory device
JP4534132B2 (en) * 2004-06-29 2010-09-01 エルピーダメモリ株式会社 Stacked semiconductor memory device
JP2006012358A (en) * 2004-06-29 2006-01-12 Elpida Memory Inc Stacked semiconductor memory device
US7209376B2 (en) 2004-06-29 2007-04-24 Nec Corporation Stacked semiconductor memory device
US7330368B2 (en) 2004-06-29 2008-02-12 Nec Corporation Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections
US7352067B2 (en) 2004-06-30 2008-04-01 Nec Corporation Stacked semiconductor device
US8477855B2 (en) 2006-01-30 2013-07-02 Nec Corporation Signal transmission system and semiconductor integrated circuit device
US7764564B2 (en) 2006-12-04 2010-07-27 Nec Corporation Semiconductor device
US8588681B2 (en) 2007-02-23 2013-11-19 Nec Corporation Semiconductor device performing signal transmission by using inductor coupling
US8315331B2 (en) 2008-02-28 2012-11-20 Nec Corporation Transmission method, transmission circuit and transmission system

Similar Documents

Publication Publication Date Title
JPH02306656A (en) Resin-sealed semiconductor device
EP0683517A3 (en) Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof.
JPS57117264A (en) Capsule device for semiconductor integrated circuit chip
JPS5731166A (en) Semiconductor device
EP0058049A3 (en) Defect-remediable semiconductor integrated circuit memory and spare substitution method in the same
EP0473796A4 (en) Semiconductor device having a plurality of chips
JPH01205541A (en) Plastic sealed semiconductor device
JPH0482279A (en) Semiconductor device
JPH03169062A (en) Semiconductor device
JPH01157561A (en) Multi-plane chip assembly
JPS6027145A (en) Semiconductor integrated circuit device
IE49684B1 (en) Systems for bonding pellets,for example semiconductor chips,to supports
JPH0247866A (en) Layout method for potential feed lines and signal lines on memory chip
JPH03176897A (en) Integrated semiconductor circuit
TW344092B (en) Semiconductor device provided with low melting point metal bumps and process for producing same
JPH03131043A (en) Integrated device equipped with improved connection
JPH02177466A (en) Method and mechanism for three-dimensional package
JPS63108733A (en) Semiconductor integrated circuit
JPH03173173A (en) Semiconductor memory
JPH04116859A (en) Semiconductor device
TW571404B (en) Flip-chip bonded semiconductor device
JPH0476946A (en) Wafer integrated circuit device
JPS58124263A (en) Semiconductor device
JPH03255657A (en) Hybrid integrated circuit device
JPH02278740A (en) Packaging of semiconductor device