JPH04185624A - Method of curing - Google Patents
Method of curingInfo
- Publication number
- JPH04185624A JPH04185624A JP32004690A JP32004690A JPH04185624A JP H04185624 A JPH04185624 A JP H04185624A JP 32004690 A JP32004690 A JP 32004690A JP 32004690 A JP32004690 A JP 32004690A JP H04185624 A JPH04185624 A JP H04185624A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- resin
- phenol resin
- curing
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 11
- 239000005011 phenolic resin Substances 0.000 claims abstract description 66
- 239000000203 mixture Substances 0.000 claims abstract description 35
- 229920003986 novolac Polymers 0.000 claims abstract description 25
- 150000003839 salts Chemical class 0.000 claims abstract description 22
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000001723 curing Methods 0.000 claims description 36
- 150000007522 mineralic acids Chemical class 0.000 claims description 7
- 150000007524 organic acids Chemical class 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 24
- 239000011347 resin Substances 0.000 abstract description 24
- 239000000843 powder Substances 0.000 abstract description 17
- 239000002253 acid Substances 0.000 abstract description 10
- 239000011230 binding agent Substances 0.000 abstract description 8
- 235000013312 flour Nutrition 0.000 abstract description 8
- 239000000835 fiber Substances 0.000 abstract description 7
- 239000002023 wood Substances 0.000 abstract description 5
- 239000000919 ceramic Substances 0.000 abstract description 4
- 150000008442 polyphenolic compounds Chemical class 0.000 abstract description 3
- 235000013824 polyphenols Nutrition 0.000 abstract description 3
- 239000003110 molding sand Substances 0.000 abstract 1
- -1 polypropylene Polymers 0.000 description 28
- 229920001568 phenolic resin Polymers 0.000 description 16
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 13
- 150000001299 aldehydes Chemical class 0.000 description 13
- 239000002585 base Substances 0.000 description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 229960001755 resorcinol Drugs 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 6
- 229930188104 Alkylresorcinol Natural products 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 238000001879 gelation Methods 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- OIPPWFOQEKKFEE-UHFFFAOYSA-N orcinol Chemical compound CC1=CC(O)=CC(O)=C1 OIPPWFOQEKKFEE-UHFFFAOYSA-N 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229960004050 aminobenzoic acid Drugs 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229940079877 pyrogallol Drugs 0.000 description 3
- 239000003079 shale oil Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003739 xylenols Chemical class 0.000 description 3
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- GHVHDYYKJYXFGU-UHFFFAOYSA-N Beta-Orcinol Chemical compound CC1=CC(O)=C(C)C(O)=C1 GHVHDYYKJYXFGU-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- OJGMBLNIHDZDGS-UHFFFAOYSA-N N-Ethylaniline Chemical compound CCNC1=CC=CC=C1 OJGMBLNIHDZDGS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 229920001800 Shellac Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- JSYBAZQQYCNZJE-UHFFFAOYSA-N benzene-1,2,4-triamine Chemical compound NC1=CC=C(N)C(N)=C1 JSYBAZQQYCNZJE-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N cyclohexene-1,2-dicarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 2
- LJOODBDWMQKMFB-UHFFFAOYSA-N cyclohexylacetic acid Chemical compound OC(=O)CC1CCCCC1 LJOODBDWMQKMFB-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JBDSSBMEKXHSJF-UHFFFAOYSA-N cyclopentanecarboxylic acid Chemical compound OC(=O)C1CCCC1 JBDSSBMEKXHSJF-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- FRNQLQRBNSSJBK-UHFFFAOYSA-N divarinol Natural products CCCC1=CC(O)=CC(O)=C1 FRNQLQRBNSSJBK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000004208 shellac Substances 0.000 description 2
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 2
- 229940113147 shellac Drugs 0.000 description 2
- 235000013874 shellac Nutrition 0.000 description 2
- 239000001648 tannin Substances 0.000 description 2
- 235000018553 tannin Nutrition 0.000 description 2
- 229920001864 tannin Polymers 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- OYUWHGGWLCJJNP-UHFFFAOYSA-N 1,2-Dihydrophthalic acid Chemical compound OC(=O)C1C=CC=CC1C(O)=O OYUWHGGWLCJJNP-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- RQEUFEKYXDPUSK-UHFFFAOYSA-N 1-phenylethylamine Chemical compound CC(N)C1=CC=CC=C1 RQEUFEKYXDPUSK-UHFFFAOYSA-N 0.000 description 1
- KRIDOPOPBBSDNT-UHFFFAOYSA-N 2,4,5-trimethylbenzene-1,3-diol Chemical compound CC1=CC(O)=C(C)C(O)=C1C KRIDOPOPBBSDNT-UHFFFAOYSA-N 0.000 description 1
- UFBJCMHMOXMLKC-UHFFFAOYSA-N 2,4-dinitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O UFBJCMHMOXMLKC-UHFFFAOYSA-N 0.000 description 1
- PQZOMNGGAHDSEH-UHFFFAOYSA-N 2,5-diethylbenzene-1,3-diol Chemical compound CCC1=CC(O)=C(CC)C(O)=C1 PQZOMNGGAHDSEH-UHFFFAOYSA-N 0.000 description 1
- DVPKDYJEGWMMAG-UHFFFAOYSA-N 2,5-dipropylbenzene-1,3-diol Chemical compound CCCC1=CC(O)=C(CCC)C(O)=C1 DVPKDYJEGWMMAG-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical compound OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- NDPQQOZDGOFANP-UHFFFAOYSA-N 2-methyl-5-propylbenzene-1,3-diol Chemical compound CCCC1=CC(O)=C(C)C(O)=C1 NDPQQOZDGOFANP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JBIJLHTVPXGSAM-UHFFFAOYSA-N 2-naphthylamine Chemical compound C1=CC=CC2=CC(N)=CC=C21 JBIJLHTVPXGSAM-UHFFFAOYSA-N 0.000 description 1
- IQUPABOKLQSFBK-UHFFFAOYSA-N 2-nitrophenol Chemical compound OC1=CC=CC=C1[N+]([O-])=O IQUPABOKLQSFBK-UHFFFAOYSA-N 0.000 description 1
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- RHJZBSMDVJWBSO-UHFFFAOYSA-N 4,5-diethylbenzene-1,3-diol Chemical compound CCC1=CC(O)=CC(O)=C1CC RHJZBSMDVJWBSO-UHFFFAOYSA-N 0.000 description 1
- RCNCKKACINZDOI-UHFFFAOYSA-N 4,5-dimethylbenzene-1,3-diol Chemical compound CC1=CC(O)=CC(O)=C1C RCNCKKACINZDOI-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- WDFQBORIUYODSI-UHFFFAOYSA-N 4-bromoaniline Chemical compound NC1=CC=C(Br)C=C1 WDFQBORIUYODSI-UHFFFAOYSA-N 0.000 description 1
- TUXYZHVUPGXXQG-UHFFFAOYSA-N 4-bromobenzoic acid Chemical compound OC(=O)C1=CC=C(Br)C=C1 TUXYZHVUPGXXQG-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- HAAZMOAXEMIBAJ-UHFFFAOYSA-N 4-chloro-2-methylquinazoline Chemical compound C1=CC=CC2=NC(C)=NC(Cl)=C21 HAAZMOAXEMIBAJ-UHFFFAOYSA-N 0.000 description 1
- QSNSCYSYFYORTR-UHFFFAOYSA-N 4-chloroaniline Chemical compound NC1=CC=C(Cl)C=C1 QSNSCYSYFYORTR-UHFFFAOYSA-N 0.000 description 1
- XRHGYUZYPHTUJZ-UHFFFAOYSA-N 4-chlorobenzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1 XRHGYUZYPHTUJZ-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- RHMPLDJJXGPMEX-UHFFFAOYSA-N 4-fluorophenol Chemical compound OC1=CC=C(F)C=C1 RHMPLDJJXGPMEX-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- VSMDINRNYYEDRN-UHFFFAOYSA-N 4-iodophenol Chemical compound OC1=CC=C(I)C=C1 VSMDINRNYYEDRN-UHFFFAOYSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 description 1
- JOZMGUQZTOWLAS-UHFFFAOYSA-N 5-butylbenzene-1,3-diol Chemical compound CCCCC1=CC(O)=CC(O)=C1 JOZMGUQZTOWLAS-UHFFFAOYSA-N 0.000 description 1
- CUEMVIJZQVZJRC-UHFFFAOYSA-N 5-ethyl-2-methylbenzene-1,3-diol Chemical compound CCC1=CC(O)=C(C)C(O)=C1 CUEMVIJZQVZJRC-UHFFFAOYSA-N 0.000 description 1
- GSMQBBTWVGEFGD-UHFFFAOYSA-N 5-ethyl-4-methylbenzene-1,3-diol Chemical compound CCC1=CC(O)=CC(O)=C1C GSMQBBTWVGEFGD-UHFFFAOYSA-N 0.000 description 1
- MSFGJICDOLGZQK-UHFFFAOYSA-N 5-ethylbenzene-1,3-diol Chemical compound CCC1=CC(O)=CC(O)=C1 MSFGJICDOLGZQK-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 240000000972 Agathis dammara Species 0.000 description 1
- MOMBAXHNIPLMSI-UHFFFAOYSA-N Aleprolic acid Chemical compound OC(=O)C1CCC=C1 MOMBAXHNIPLMSI-UHFFFAOYSA-N 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 235000019492 Cashew oil Nutrition 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- NMEZJSDUZQOPFE-UHFFFAOYSA-N Cyclohex-1-enecarboxylic acid Chemical compound OC(=O)C1=CCCCC1 NMEZJSDUZQOPFE-UHFFFAOYSA-N 0.000 description 1
- 239000004805 Cyclohexane-1,2-dicarboxylic acid Substances 0.000 description 1
- 229920002871 Dammar gum Polymers 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229920000881 Modified starch Polymers 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 244000098338 Triticum aestivum Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- AYVGBNGTBQLJBG-UHFFFAOYSA-N [3-(hydroxymethyl)cyclopentyl]methanol Chemical compound OCC1CCC(CO)C1 AYVGBNGTBQLJBG-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- YAQDPZIUXFPKJQ-UHFFFAOYSA-N benzylazanium;benzoate Chemical compound [NH3+]CC1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YAQDPZIUXFPKJQ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000010467 cashew oil Chemical class 0.000 description 1
- 229940059459 cashew oil Drugs 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- KZZKOVLJUKWSKX-UHFFFAOYSA-N cyclobutanamine Chemical compound NC1CCC1 KZZKOVLJUKWSKX-UHFFFAOYSA-N 0.000 description 1
- SUSAGCZZQKACKE-UHFFFAOYSA-N cyclobutane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC1C(O)=O SUSAGCZZQKACKE-UHFFFAOYSA-N 0.000 description 1
- WYHYNUWZLKTEEY-UHFFFAOYSA-N cyclobutane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C1 WYHYNUWZLKTEEY-UHFFFAOYSA-N 0.000 description 1
- TXWOGHSRPAYOML-UHFFFAOYSA-N cyclobutanecarboxylic acid Chemical compound OC(=O)C1CCC1 TXWOGHSRPAYOML-UHFFFAOYSA-N 0.000 description 1
- QDKOFCUUXIAICD-UHFFFAOYSA-N cyclohex-2-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCC=C1C(O)=O QDKOFCUUXIAICD-UHFFFAOYSA-N 0.000 description 1
- IHLIVAHFDOAPFC-UHFFFAOYSA-N cyclohex-2-ene-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C=C1 IHLIVAHFDOAPFC-UHFFFAOYSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- GWFATZSREPOCHH-UHFFFAOYSA-N cyclohex-3-ene-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC=C(C(O)=O)C1 GWFATZSREPOCHH-UHFFFAOYSA-N 0.000 description 1
- ILUAAIDVFMVTAU-UHFFFAOYSA-N cyclohex-4-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CCC1C(O)=O ILUAAIDVFMVTAU-UHFFFAOYSA-N 0.000 description 1
- BZDAUORPMAWHLY-UHFFFAOYSA-N cyclohex-4-ene-1,3-dicarboxylic acid Chemical compound OC(=O)C1CC=CC(C(O)=O)C1 BZDAUORPMAWHLY-UHFFFAOYSA-N 0.000 description 1
- MJZUVTBSHJXHRG-UHFFFAOYSA-N cyclohexa-1,3-diene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CCC1 MJZUVTBSHJXHRG-UHFFFAOYSA-N 0.000 description 1
- BQYOGZXCESFTRX-UHFFFAOYSA-N cyclohexa-1,3-diene-1,4-dicarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)CC1 BQYOGZXCESFTRX-UHFFFAOYSA-N 0.000 description 1
- APGFPQCBDNWQSB-UHFFFAOYSA-N cyclohexa-1,3-diene-1-carboxylic acid Chemical compound OC(=O)C1=CC=CCC1 APGFPQCBDNWQSB-UHFFFAOYSA-N 0.000 description 1
- QZXFDVKEMLWZNW-UHFFFAOYSA-N cyclohexa-1,4-diene-1,4-dicarboxylic acid Chemical compound OC(=O)C1=CCC(C(O)=O)=CC1 QZXFDVKEMLWZNW-UHFFFAOYSA-N 0.000 description 1
- ACPRBIUWOJNRAM-UHFFFAOYSA-N cyclohexa-1,5-diene-1,4-dicarboxylic acid Chemical compound OC(=O)C1CC=C(C(O)=O)C=C1 ACPRBIUWOJNRAM-UHFFFAOYSA-N 0.000 description 1
- GZTKOENTHJPEQG-UHFFFAOYSA-N cyclohexa-2,4-diene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CC=C1C(O)=O GZTKOENTHJPEQG-UHFFFAOYSA-N 0.000 description 1
- XRCLQGMSELDJDX-UHFFFAOYSA-N cyclohexa-2,5-diene-1,2-dicarboxylic acid Chemical compound OC(=O)C1C=CCC=C1C(O)=O XRCLQGMSELDJDX-UHFFFAOYSA-N 0.000 description 1
- YPLMJTLWRYWKFO-UHFFFAOYSA-N cyclohexa-2,6-diene-1,2-dicarboxylic acid Chemical compound OC(=O)C1=CCCC=C1C(O)=O YPLMJTLWRYWKFO-UHFFFAOYSA-N 0.000 description 1
- WLWKIJKUDWYINL-UHFFFAOYSA-N cyclohexane-1,1,2,2,3,3-hexacarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC(C(O)=O)(C(O)=O)C1(C(O)=O)C(O)=O WLWKIJKUDWYINL-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- FCTPXMGHGVCNMD-UHFFFAOYSA-N cyclohexene-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)=C1 FCTPXMGHGVCNMD-UHFFFAOYSA-N 0.000 description 1
- KAAQPMPUQHKLLE-UHFFFAOYSA-N cyclohexene-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)=CC1 KAAQPMPUQHKLLE-UHFFFAOYSA-N 0.000 description 1
- NISGSNTVMOOSJQ-UHFFFAOYSA-N cyclopentanamine Chemical compound NC1CCCC1 NISGSNTVMOOSJQ-UHFFFAOYSA-N 0.000 description 1
- YZFOGXKZTWZVFN-UHFFFAOYSA-N cyclopentane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1 YZFOGXKZTWZVFN-UHFFFAOYSA-N 0.000 description 1
- ASJCSAKCMTWGAH-UHFFFAOYSA-N cyclopentane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCC1C(O)=O ASJCSAKCMTWGAH-UHFFFAOYSA-N 0.000 description 1
- FDKLLWKMYAMLIF-UHFFFAOYSA-N cyclopropane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CC1 FDKLLWKMYAMLIF-UHFFFAOYSA-N 0.000 description 1
- RLWFMZKPPHHHCB-UHFFFAOYSA-N cyclopropane-1,2-dicarboxylate;hydron Chemical compound OC(=O)C1CC1C(O)=O RLWFMZKPPHHHCB-UHFFFAOYSA-N 0.000 description 1
- YMGUBTXCNDTFJI-UHFFFAOYSA-N cyclopropanecarboxylic acid Chemical compound OC(=O)C1CC1 YMGUBTXCNDTFJI-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FPIQZBQZKBKLEI-UHFFFAOYSA-N ethyl 1-[[2-chloroethyl(nitroso)carbamoyl]amino]cyclohexane-1-carboxylate Chemical compound ClCCN(N=O)C(=O)NC1(C(=O)OCC)CCCCC1 FPIQZBQZKBKLEI-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 229940071826 hydroxyethyl cellulose Drugs 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- 230000000968 intestinal effect Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- FXLOVSHXALFLKQ-UHFFFAOYSA-N p-tolualdehyde Chemical compound CC1=CC=C(C=O)C=C1 FXLOVSHXALFLKQ-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 1
- 229940067157 phenylhydrazine Drugs 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 229940032147 starch Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフェノール樹脂混合物を低温短時間で硬化させ
る方法、特に繊維、木粉、セラミック、鋳物砂等のバイ
ンダーとして使用されるフェノール樹脂混合物を低温、
短時間で硬化させる方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a method for curing phenolic resin mixtures at low temperatures and in a short time, particularly for curing phenolic resin mixtures used as binders for fibers, wood flour, ceramics, foundry sand, etc. low temperature,
This relates to a method of curing in a short time.
従来、この種のバインダーとしてはレゾール型フェノー
ル樹脂粉末またはノボラック型フェノールmlとへキサ
メチレンテトラミンのようなアルデヒド供与体との混合
粉末が使用されていた。しかしながらこのようなフェノ
ール樹脂は硬化温度が約200℃と高く、フェルトのバ
インダーとして用いる場合は繊維が熱により変質脆化す
るし、ポリプロピレン繊維のような低融点繊維の場合に
はバインダーとして全く使用出来ない。セラミックや鋳
物砂のバインダーとして用いる場合でもこのような高温
で硬化させるには加熱装置の規模が大きくなるし、また
熱エネルギーが浪費される。Conventionally, as this type of binder, a mixed powder of resol type phenolic resin powder or novolac type phenol ml and an aldehyde donor such as hexamethylenetetramine has been used. However, such phenolic resins have a high curing temperature of approximately 200°C, and when used as a binder for felt, the fibers deteriorate and become brittle due to heat, and in the case of low-melting fibers such as polypropylene fibers, they cannot be used as a binder at all. do not have. Even when used as a binder for ceramics or foundry sand, curing at such high temperatures requires a large heating device and wastes thermal energy.
このためハイオルソ型の速硬化性フェノール樹脂が用い
られる場合があるが、このものは低温短時間で硬化させ
た場合、見掛けの硬化は速いが硬化後の樹脂の強度は通
常のフェノール樹脂に比べて著しく弱くなると云う欠点
があった。For this reason, high-ortho type fast-curing phenolic resins are sometimes used, but when cured at low temperatures and in a short time, the apparent curing is fast, but the strength of the resin after curing is lower than that of ordinary phenolic resins. The drawback was that it became significantly weaker.
本発明は上記従来の課題を解決するための手段として、
フェノール樹脂と、ノボラック型多価フェノール樹脂と
の混合物を、有機酸または無機酸と窒素含有塩基との塩
である硬化触媒によって硬化させる硬化方法、およびノ
ボラック型フェノール樹脂とノボラック型多価フェノー
ル樹脂との混合物に硬化剤としてアルデヒド供与体を加
えた混合物を、有機酸または無機酸と窒素含有塩基との
塩である硬化触媒によって硬化させる硬化方法を提供す
るものである。The present invention, as a means for solving the above-mentioned conventional problems,
A curing method in which a mixture of a phenolic resin and a novolak type polyphenol resin is cured using a curing catalyst that is a salt of an organic acid or an inorganic acid and a nitrogen-containing base; The present invention provides a curing method in which a mixture of the above and an aldehyde donor added as a curing agent is cured using a curing catalyst that is a salt of an organic or inorganic acid and a nitrogen-containing base.
以下に本発明の詳細な説明する。The present invention will be explained in detail below.
[フェノール樹脂コ
フェノール樹脂は云うまでもなくフェノール、クレゾー
ル、キシレノール等のフェノール類の一種または二種以
上の混合物とホルムアルデヒドとの反応により得られる
ものであり1例えばフェノールおよび0−クレゾール、
■−クレゾール、P−クレゾール、エチルフェノール、
1so−プロピルフェノール、キシレノール、3,5−
キシレノール、ブチルフェノール、ノニルフェノール等
のアルキルフェノール、0−フルオロフェノール、に〜
フルオロフェノール、P−フルオロフェノール、Ω−ク
ロロフェノール、腸−クロロフェノール、P−クロロフ
ェノール、0−ブロモフェノール、I−ブロモフェノー
ル、P−ブロモフェノール、0−ヨードフェノール、■
−ヨードフェノール、P−ヨードフェノール、0−アミ
ノフェノール、鵬−アミノフェノール、P−アミノフェ
ノール、0−ニトロフェノール、節−ニトロフェノール
、P−ニトロフェノール、2,4−ジニトロフェノール
、2.4.6−ドリニトロフエノール等の一価フエノー
ル置換体、ナフトール等の一価フエノール類の一種また
は二種以上の混合物とホルムアルデヒド等のアルデヒド
供与体との反応により得られるものであり、反応触媒と
してアンモニア、カセイソーダ等のアルカリ触媒を用い
たレゾール型フェノール樹脂、硫酸、塩酸等の酸触媒等
を用いたノボラック型フェノール樹脂のどちらでも本発
明のフェノール樹脂として用いられる。[Phenol resin cophenol resin is obtained by reacting one or a mixture of two or more phenols such as phenol, cresol, and xylenol with formaldehyde.1 For example, phenol and 0-cresol,
■-Cresol, P-cresol, ethylphenol,
1so-propylphenol, xylenol, 3,5-
Alkylphenol such as xylenol, butylphenol, nonylphenol, 0-fluorophenol, etc.
Fluorophenol, P-fluorophenol, Ω-chlorophenol, intestinal chlorophenol, P-chlorophenol, 0-bromophenol, I-bromophenol, P-bromophenol, 0-iodophenol, ■
-iodophenol, P-iodophenol, 0-aminophenol, Peng-aminophenol, P-aminophenol, 0-nitrophenol, Section-nitrophenol, P-nitrophenol, 2,4-dinitrophenol, 2.4. It is obtained by the reaction of one or a mixture of two or more monovalent phenols such as substituted monovalent phenols such as 6-dolinitrophenol and naphthol with an aldehyde donor such as formaldehyde, and ammonia, Either a resol type phenol resin using an alkali catalyst such as caustic soda or a novolac type phenol resin using an acid catalyst such as sulfuric acid or hydrochloric acid can be used as the phenol resin of the present invention.
また本発明においてはフェノール樹脂に所望なれば、レ
ゾルシン、アルキルレゾルシン、カテコール、アルキル
カテコール、ハイドロキノン、アルキルハイドロキノン
、ピロガロール、フロログリシン、尿素、メラミン、チ
オ尿素、ベンゾグアナミン、トルエン、キシレン、クマ
ロン、シクロヘキサノン、カシューオイル、タンニン類
、ダンマー、セラック、ロジンまたはロジン誘導体、石
油樹脂、メタノール、エタノール、イソプロパツール、
ブタノール、エチレングリコール、グリセリン、フルフ
リルアルコール、アマニ油、桐油、ひまし油等の一種ま
たは二種以上を用いて変性したものであってもよい。In the present invention, if desired, the phenolic resin may include resorcinol, alkylresorcinol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, pyrogallol, phloroglycine, urea, melamine, thiourea, benzoguanamine, toluene, xylene, coumaron, cyclohexanone, cashew. Oils, tannins, dammar, shellac, rosin or rosin derivatives, petroleum resins, methanol, ethanol, isopropanol,
It may be modified using one or more of butanol, ethylene glycol, glycerin, furfuryl alcohol, linseed oil, tung oil, castor oil, and the like.
[ノボラック型多価フェノール樹脂コ
ノボラック型多価フェノール樹脂とはレゾルシン、アル
キルレゾルシン、ピロガロール、カテコール、アルキル
カテコール、ハイドロキノン、アルキルハイドロキノン
、フロログリシン、ビスフェノール、ジヒドロキシナフ
タリン等の多価フェノール類の一種または二種以上の混
合物とアルデヒド供与体との反応により得られるもので
あり、反応触媒として硫酸、塩酸、蟻酸、酢酸、蓚酸等
の酸触媒等が用いられる。[Novolak-type polyhydric phenol resin What is conovolac-type polyhydric phenol resin? One or two types of polyhydric phenols such as resorcinol, alkylresorcinol, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglycine, bisphenol, and dihydroxynaphthalene. It is obtained by reacting the above mixture with an aldehyde donor, and an acid catalyst such as sulfuric acid, hydrochloric acid, formic acid, acetic acid, or oxalic acid is used as a reaction catalyst.
上記多価フェノールのうち特に望ましいものとしてはア
ルキルレゾルシンがある。上記アルキルレゾルシンを用
いた多価フェノール樹脂は貯蔵安定性に優れかつアルデ
ヒド供与体を用いて加熱反応させれば、低温短時間で硬
化し、また硬化物は耐水、耐熱、耐候性に優れかつ優れ
た可撓性を有する。Particularly desirable among the above polyhydric phenols are alkylresorcinols. The polyhydric phenol resin using the above alkylresorcinol has excellent storage stability, and when heated and reacted with an aldehyde donor, it cures at low temperature and in a short time, and the cured product has excellent water resistance, heat resistance, and weather resistance. It has flexibility.
上記アルキルレゾルシンとしては例えば5−メチルレゾ
ルシン、5−エチルレゾルシン、5−プロピルレゾルシ
ン、5−n−ブチルレゾルシン、4,5−ジメチルレゾ
ルシン、2,5−ジメチルレゾルシン、4,5−ジエチ
ルレゾルシン、2,5−ジエチルレゾルシン、4゜5−
ジプロピルレゾルシン、2,5−ジプロピルレゾルシン
、4−メチル−5−エチルレゾルシン、2−メチル−5
−エチルレゾルシン、2−メチル−5−プロピルレゾル
シン、 2,4.5−トリメチルレゾルシン、 2,4
.5−トリエチルレゾルシン等があるが、なかんずく5
−メチルレゾルシンは特に低温硬化性が良好でかつ耐水
、耐熱、耐候性、可撓性に優れた硬化物を与えるから本
発明の多価フェノール樹脂の原料として望ましいもので
ある。また更にエストニア産油母頁岩の乾溜によって得
られる混合アルキルレゾルシン(シェールオイルレゾル
シン)は更に安価に得られ、低温硬化性、耐炎性、耐水
、耐熱、耐候性等に一段と優れ特に望ましいものである
。Examples of the alkylresorcins mentioned above include 5-methylresorcin, 5-ethylresorcin, 5-propylresorcin, 5-n-butylresorcin, 4,5-dimethylresorcin, 2,5-dimethylresorcin, 4,5-diethylresorcin, 2 ,5-diethylresorcin, 4゜5-
Dipropylresorcin, 2,5-dipropylresorcin, 4-methyl-5-ethylresorcin, 2-methyl-5
-Ethylresorcin, 2-methyl-5-propylresorcin, 2,4.5-trimethylresorcin, 2,4
.. There are 5-triethylresorcin, etc., but especially 5
- Methylresorcin is particularly desirable as a raw material for the polyhydric phenol resin of the present invention because it has good low-temperature curability and provides a cured product with excellent water resistance, heat resistance, weather resistance, and flexibility. Furthermore, mixed alkyl resorcinol (shale oil resorcinol) obtained by dry distillation of oil mother shale produced in Estonia is particularly desirable because it can be obtained at a lower cost and has further excellent low-temperature curing properties, flame resistance, water resistance, heat resistance, weather resistance, etc.
また本発明においてはノボラック型多価フェノール樹脂
に所望なれば、尿素、メラミン、チオ尿素、フェノール
、アルキルフェノール、カテコール、アルキルカテコー
ル、ハイドロキノン、アルキルハイドロキノン、ピロガ
ロール、フロログリシン、ベンゾグアナミン、トルエン
、キシレン。In the present invention, if desired, the novolac type polyhydric phenol resin may include urea, melamine, thiourea, phenol, alkylphenol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, pyrogallol, phloroglycine, benzoguanamine, toluene, and xylene.
クマロン、シクロヘキサノン、カシューオイル、タンニ
ン類、ダンマー、セラック、ロジンまたはロジン誘導体
、石油樹脂、メタノール、エタノール、イソプロパツー
ル、ブタノール、エチレングリコール、グリセリン、フ
ルフリルアルコール。Coumarone, cyclohexanone, cashew oil, tannins, dummer, shellac, rosin or rosin derivatives, petroleum resins, methanol, ethanol, isopropanol, butanol, ethylene glycol, glycerin, furfuryl alcohol.
アマニ油、桐油、ひまし油等の一種または二種以上を用
いて変性したものであってもよい。It may be modified using one or more of linseed oil, tung oil, castor oil, etc.
[硬化触媒]
本発明においては硬化触媒として、有機酸または無機酸
と窒素含有塩基との塩が用いられる。上記有機酸として
は側1酢酸、プロピオン酸、酪酸、吉草酸、蓚酸、コハ
ク酸、マレイン酸、酒石酸、カプロン酸、カプリル酸、
カプリン酸、ラウリン酸、ミリスチン酸、パルミチン酸
、ステアリン酸、オレイン酸、リノール酸、リルン酸等
の脂肪酸、ピクリン酸、フェニル酢酸、安息香酸。[Curing Catalyst] In the present invention, a salt of an organic acid or an inorganic acid and a nitrogen-containing base is used as a curing catalyst. Examples of the above organic acids include side 1 acetic acid, propionic acid, butyric acid, valeric acid, oxalic acid, succinic acid, maleic acid, tartaric acid, caproic acid, caprylic acid,
Fatty acids such as capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, linuric acid, picric acid, phenylacetic acid, benzoic acid.
o−トルイル酸、−一トルイル酸、P−トルイル酸、
o−クロロ安息香酸1m−クロロ安息香酸、P−クロロ
安息香酸、0−ブロモ安息香酸、■−ブロモ安息香酸、
P−ブロモ安息香酸、0−ニトロ安息香酸、−二トロ安
息香酸、P−ニトロ安息香酸、フタル酸、イソフタル酸
、テレフタル酸、サリチル酸、P−ヒドロキシ安息香酸
、アントラニル酸、0−アミノ安息香酸、聰−アミノ安
息香酸、P−アミノ安息香酸、0−メトキシ安息香酸、
−一メトキシ安息香酸、P−メトキシ安息香酸等の芳香
族カルボン酸、およびシクロブタンカルボン酸、シクロ
ブタン−1,2−ジカルボン酸、シクロブタン−1,3
−ジカルボン酸、シクロプロパンカルボン酸、シクロプ
ロパン−1,1−ジカルボン酸、シクロプロパン−1,
2−ジカルボン酸、シクロプロパン−1,1,2−)−
ジカルボン酸、シクロプロパン−1,2,3−)−ジカ
ルボン酸、1,3−シクロへキサジエン−1−カルボン
酸、1.3−シクロへキサジエン−1゜2−ジカルボン
酸、1.3−シクロへキサジエン−1,3−ジカルボン
酸、1,3−シクロへキサジエン−1,4−ジカルボン
酸、1,3−シクロへキサジエン−1,6−ジカルボン
酸、1,3−シクロへキサジエン−2,3−ジカルボン
酸、1,3−シクロヘキサジエン−2,5−ジカルボン
酸、】、3−シクロへキサジエン−3,5−ジカルボン
酸、1,3−シクロへキサジエン−5,6−ジカルボン
酸、1.4−シクロへキサジエン−1,2−ジカルボン
酸、1,4−シクロへキサジエン−1,4−ジカルボン
酸、 1.4−シクロへキサジエン−1,6−ジカルボ
ン酸、1,4−シクロへキサジエン−3,6−ジカルボ
ン酸、シクロへキサノール−2−カルボン酸、シクロヘ
キサノンカルボン酸、シクロヘキサンカルボン酸、シク
ロヘキサン−1,2−ジカルボン酸、シクロヘキサン−
1,3−ジカルボン酸、シクロヘキサン−1,4−ジカ
ルボン酸。o-toluic acid, -monotoluic acid, p-toluic acid,
o-chlorobenzoic acid 1m-chlorobenzoic acid, P-chlorobenzoic acid, 0-bromobenzoic acid, ■-bromobenzoic acid,
P-bromobenzoic acid, 0-nitrobenzoic acid, -nitrobenzoic acid, P-nitrobenzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid, P-hydroxybenzoic acid, anthranilic acid, 0-aminobenzoic acid, So-aminobenzoic acid, P-aminobenzoic acid, 0-methoxybenzoic acid,
- Aromatic carboxylic acids such as monomethoxybenzoic acid and P-methoxybenzoic acid, and cyclobutanecarboxylic acid, cyclobutane-1,2-dicarboxylic acid, and cyclobutane-1,3
-dicarboxylic acid, cyclopropanecarboxylic acid, cyclopropane-1,1-dicarboxylic acid, cyclopropane-1,
2-dicarboxylic acid, cyclopropane-1,1,2-)-
Dicarboxylic acid, cyclopropane-1,2,3-)-dicarboxylic acid, 1,3-cyclohexadiene-1-carboxylic acid, 1,3-cyclohexadiene-1°2-dicarboxylic acid, 1,3-cyclo Hexadiene-1,3-dicarboxylic acid, 1,3-cyclohexadiene-1,4-dicarboxylic acid, 1,3-cyclohexadiene-1,6-dicarboxylic acid, 1,3-cyclohexadiene-2, 3-dicarboxylic acid, 1,3-cyclohexadiene-2,5-dicarboxylic acid, ], 3-cyclohexadiene-3,5-dicarboxylic acid, 1,3-cyclohexadiene-5,6-dicarboxylic acid, 1 .4-cyclohexadiene-1,2-dicarboxylic acid, 1,4-cyclohexadiene-1,4-dicarboxylic acid, 1,4-cyclohexadiene-1,6-dicarboxylic acid, 1,4-cyclo Xadiene-3,6-dicarboxylic acid, cyclohexanol-2-carboxylic acid, cyclohexanonecarboxylic acid, cyclohexanecarboxylic acid, cyclohexane-1,2-dicarboxylic acid, cyclohexane-
1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid.
シクロヘキサンヘキサカルボン酸、シクロヘキシル酢酸
、シクロヘキセンカルボン酸、シクロヘキセン−1,2
−ジカルボン酸、シクロヘキセン−1,3−ジカルボン
酸、シクロヘキセン−1,4−ジカルボン酸。Cyclohexanehexacarboxylic acid, cyclohexyl acetic acid, cyclohexenecarboxylic acid, cyclohexene-1,2
-dicarboxylic acid, cyclohexene-1,3-dicarboxylic acid, cyclohexene-1,4-dicarboxylic acid.
シクロヘキセン−1,5−ジカルボン酸、シクロヘキセ
ン−1,6−ジカルボン酸、シクロヘキセン−3,4−
ジカルボン酸、シクロヘキセン−3,5−ジカルボン酸
、シクロヘキセン−3,6−ジカルボン酸、シクロヘキ
セン−4,5−ジカルボン酸、シクロペンタンカルボン
酸、シクロペンタン−1,1−ジカルボン酸、シクロペ
ンタン−1,2−ジカルボン酸、シクロペンタン−1,
3−ジカルボン酸、シクロペンテン−3−カルボン酸等
の脂環式カルボン酸等が例示され、上記無機酸としては
硫酸、塩酸、硝酸、燐酸等が例示される。窒素含有塩基
としてはアンモニアおよびヒドロキシルアミン、フェニ
ルヒドラジン、セミカルバジド、ヒドラジン等のアンモ
ニア誘導体、メチルアミン、ジメチルアミン、トリメチ
ルアミン。Cyclohexene-1,5-dicarboxylic acid, cyclohexene-1,6-dicarboxylic acid, cyclohexene-3,4-
dicarboxylic acid, cyclohexene-3,5-dicarboxylic acid, cyclohexene-3,6-dicarboxylic acid, cyclohexene-4,5-dicarboxylic acid, cyclopentanecarboxylic acid, cyclopentane-1,1-dicarboxylic acid, cyclopentane-1, 2-dicarboxylic acid, cyclopentane-1,
Examples include alicyclic carboxylic acids such as 3-dicarboxylic acid and cyclopentene-3-carboxylic acid, and examples of the inorganic acids include sulfuric acid, hydrochloric acid, nitric acid, and phosphoric acid. Nitrogen-containing bases include ammonia and ammonia derivatives such as hydroxylamine, phenylhydrazine, semicarbazide, hydrazine, methylamine, dimethylamine, trimethylamine.
エチルアミン、ジエチルアミン、トリエチルアミン、n
−プロピルアミン、ジ−n−プロピルアミン。Ethylamine, diethylamine, triethylamine, n
-Propylamine, di-n-propylamine.
トリーn−プロピルアミン、1so−プロピルアミン。tri-n-propylamine, 1so-propylamine.
ジー1so−プロピルアミン、n−ブチルアミン、 1
so−ブチルアミン、5ec−ブチルアミン、ter−
ブチルアミン、ベンジルアミン、α−フェニルエチルア
ミン、β−フェニルエチルアミン、エチレンジアミン、
テトラメチレンジアミン、テトラエチレンジアミン、ヘ
キサメチレンジアミン、水酸化テトラメチルアンモニウ
ム等の脂肪族アミン、アニリン、メチルアニリン、エチ
ルアニリン、ジメチルアニリン、ジエチルアニリン、ジ
フェニルアミン、トリフェニルアミン、0−トルイジン
、謄−トルイジン、P−トルイジン、0−アニシジン、
■−アニシジン、P−アニシジン、O−クロロアニリン
、厘−クロロアニリン、P−クロロアニリン、0−ブロ
モアニリン、■−ブロモアニリン、P−ブロモアニリン
、0−ニトロアニリン、0−フェニレンジアミン、−一
フ二二しンジアミン、P−フェニレンジアミン、1,2
.3−トリアミノベンゼン、1,2.4−トリアミノベ
ンゼン、1,2.5−トリアミノベンゼン、1−ナフチ
ルアミン、2−ナフチルアミンおよびそれらの誘導体等
の芳香族アミン、シクロブチルアミン、シクロヘキシル
アミン、シクロプロピルアミン、シクロへブチルアミン
、シクロペンチルアミン等の脂環式アミン、ピペリジン
、ピリジン、キノリン、イミダゾール等の複素環化合物
等の塩基が例示される。di-1so-propylamine, n-butylamine, 1
so-butylamine, 5ec-butylamine, ter-
Butylamine, benzylamine, α-phenylethylamine, β-phenylethylamine, ethylenediamine,
Aliphatic amines such as tetramethylenediamine, tetraethylenediamine, hexamethylenediamine, tetramethylammonium hydroxide, aniline, methylaniline, ethylaniline, dimethylaniline, diethylaniline, diphenylamine, triphenylamine, 0-toluidine, toluidine, P-toluidine, 0-anisidine,
■-Anisidine, P-anisidine, O-chloroaniline, 厘-chloroaniline, P-chloroaniline, 0-bromoaniline, ■-bromoaniline, P-bromoaniline, 0-nitroaniline, 0-phenylenediamine, -1 Phenyl diamine, P-phenylene diamine, 1,2
.. Aromatic amines such as 3-triaminobenzene, 1,2.4-triaminobenzene, 1,2.5-triaminobenzene, 1-naphthylamine, 2-naphthylamine and their derivatives, cyclobutylamine, cyclohexylamine, cyclo Examples include bases such as alicyclic amines such as propylamine, cyclohebutylamine, and cyclopentylamine, and heterocyclic compounds such as piperidine, pyridine, quinoline, and imidazole.
[アルデヒド供与体コ
フェノール樹脂としてノボラック型を用いた場合には硬
化剤としてアルデヒド供与体が添加される。上記アルデ
ヒド供与体としてはホルマリン。[Aldehyde donor When a novolak type cophenol resin is used, an aldehyde donor is added as a curing agent. The aldehyde donor is formalin.
ホルムアルデヒド、パラホルムアルデヒド、トリオキサ
ン、アセトアルデヒド、プロピオンアルデヒド、ポリオ
キシメチレン、クロラール、ヘキサメチレンテトラミン
、フルフラール、グリオキザール、n−ブチルアルデヒ
ド、カプロアルデヒド、ベンズアルデヒド、アクロレイ
ン、テトラオキシメチレン、フェニルアセトアルデヒド
、o−トルアルデヒド、■−トルアルデヒド、p−トル
アルデヒド、サリチルアルデヒド等の一種あるいはこれ
らの二種以上の混合物等が例示される。Formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, caproaldehyde, benzaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde , -tolualdehyde, p-tolualdehyde, salicylaldehyde, or a mixture of two or more thereof.
[配合コ
本発明の硬化方法は上記フェノール樹脂Aと上記ノボラ
ック型多価フェノール樹脂Bとの混合物を、有機酸また
は無機酸と窒素含有塩基との塩Cを硬化触媒として硬化
させるものであるが、上記多価フェノール樹脂Bは上記
フェノール樹脂Aに対して重量比で1重量部以上添加さ
れるが好ましくは上記フェノール樹脂Aと上記多価フェ
ノール樹脂Bと配合比率は重量比で99:1〜40:6
0程度とされる。上記塩Cは上記フェノール樹脂Aと上
記多価フェノール樹脂Bとの混合物100重量部に対し
て0.05〜30重量部程度とされる。上記フェノール
樹脂Aと上記多価フェノール樹DBはあらかじめ共縮合
されたものであってもよい。[Formulation] The curing method of the present invention is to cure a mixture of the above phenolic resin A and the novolac type polyhydric phenol resin B using a salt C of an organic acid or an inorganic acid and a nitrogen-containing base as a curing catalyst. The polyhydric phenol resin B is added in a weight ratio of 1 part or more to the phenol resin A, but preferably the blending ratio of the phenol resin A and the polyhydric phenol resin B is 99:1 to 99:1 by weight. 40:6
It is considered to be about 0. The amount of the salt C is about 0.05 to 30 parts by weight based on 100 parts by weight of the mixture of the phenol resin A and the polyhydric phenol resin B. The above-mentioned phenol resin A and the above-mentioned polyhydric phenol tree DB may be co-condensed in advance.
上記フェノール樹脂Aと上記多価フェノール樹脂Bとの
混合物に上記塩Cを配合する方法としては、(1)上記
フェノール樹脂A、多価フェノール樹脂B、塩Cを共に
粉末状態で混合する方法、(2)フェノール樹脂Aを製
造し固体粉末にする前の溶液状態において塩Cを添加し
てから固体粉末とし、これに多価フェノール樹脂B粉末
を混合する方法。The method of blending the salt C into the mixture of the phenol resin A and the polyhydric phenol resin B includes (1) a method of mixing the phenol resin A, the polyhydric phenol resin B, and the salt C together in a powder state; (2) A method in which phenol resin A is produced, salt C is added to the solution state before it is made into a solid powder, and then the solid powder is made, and polyhydric phenol resin B powder is mixed therein.
(3)多価フェノール樹脂Bを製造し固体粉末にする前
の溶液状態において塩Cを添加してから固体粉末とし、
これにフェノール樹脂A粉末を混合する方法、(4)上
記フェノール樹脂Aと上記多価フェノール樹脂Bとの混
合溶液に塩Cを混合溶解させる方法等が採用される。上
記方法(1)〜(3)では粉末状の組成物が得られ、方
法(4)では溶液状の組成物が得られる。(3) Adding salt C in a solution state before producing polyhydric phenol resin B and making it into a solid powder, and then making it into a solid powder,
A method of mixing phenol resin A powder with this, (4) a method of mixing and dissolving salt C in a mixed solution of the above-mentioned phenol resin A and the above-mentioned polyhydric phenol resin B, etc. are adopted. The above methods (1) to (3) yield a powder composition, and the method (4) yields a solution composition.
上記フェノール樹脂Aがノボラック型である場合には硬
化剤としてアルデヒド供与体を添加する。When the phenolic resin A is a novolac type, an aldehyde donor is added as a curing agent.
上記アルデヒド供与体は、通常上記フェノール樹脂Aと
上記多価フェノール樹脂Bとの混合物100重量部に対
して0.5〜30重量部重量部台される。The aldehyde donor is usually used in an amount of 0.5 to 30 parts by weight per 100 parts by weight of the mixture of the phenolic resin A and the polyhydric phenol resin B.
またフェノール樹脂Aがレゾール型フェノール樹脂の場
合でも、ノボラック型多価フェノール樹脂B100重量
部に対してアルデヒド供与体を0゜5〜30重量部重量
部加することが望ましい。Even when the phenol resin A is a resol type phenol resin, it is desirable to add 0.5 to 30 parts by weight of an aldehyde donor to 100 parts by weight of the novolac type polyhydric phenol resin B.
[第三物質〕
本発明においては上記配合物に更に必要ならば第三物質
を配合することも出来る。第三物質としては例えば、天
然ゴムおよびその誘導体、5BR−NBR,CR,EP
T等の合成ゴム、酢酸ビニル樹脂、エチレン−酢酸ビニ
ル共重合樹脂、アクリル樹脂、メタクリル樹脂、塩化ビ
ニル樹脂、塩化ビニリデン樹脂、ポリスチレン、ポリエ
チレン、ポリプロピレン、塩素化ポリエチレン、塩素化
ポリプロピレン、ポリエステル樹脂、ウレタン樹脂。[Third Substance] In the present invention, a third substance may be further added to the above-mentioned formulation if necessary. Examples of the third substance include natural rubber and its derivatives, 5BR-NBR, CR, EP
Synthetic rubber such as T, vinyl acetate resin, ethylene-vinyl acetate copolymer resin, acrylic resin, methacrylic resin, vinyl chloride resin, vinylidene chloride resin, polystyrene, polyethylene, polypropylene, chlorinated polyethylene, chlorinated polypropylene, polyester resin, urethane resin.
ポリアミド樹脂、エポキシ樹脂、ブチラール樹脂、ポリ
アクリル酸、ポリアクリルアミド、ポリビニルアルコー
ル、メチルセルローズ、カルボキシメチルセルローズ、
ヒドロキシメチルセルローズ、ヒドロキシエチルセルロ
ーズ等のセルローズ誘導体、アルギン酸ソーダ、でんぷ
ん、でんぷん誘導体、ゼラチン、膠、血粉等の蛋白質、
炭酸カルシウム、タルク、カーボンブラック、シリカ、
木粉、クルミ粉、椰子穀粉、小麦粉等の充填剤、顔料、
染料、防腐剤、防虫剤、老化防止剤、紫外線吸収剤、酸
化防止剤、三酸化アンチモン、水酸化アルミニウム、ブ
ロム化合物等の防炎剤、ワックス。Polyamide resin, epoxy resin, butyral resin, polyacrylic acid, polyacrylamide, polyvinyl alcohol, methyl cellulose, carboxymethyl cellulose,
Cellulose derivatives such as hydroxymethyl cellulose and hydroxyethyl cellulose, sodium alginate, starch, starch derivatives, gelatin, glue, protein such as blood powder,
Calcium carbonate, talc, carbon black, silica,
Fillers such as wood flour, walnut flour, coconut flour, wheat flour, pigments,
Dyes, preservatives, insect repellents, anti-aging agents, ultraviolet absorbers, antioxidants, flame retardants such as antimony trioxide, aluminum hydroxide, bromine compounds, and waxes.
シリコン樹脂等の離型剤、撥水剤等であり、これらの一
種または二種以上の混合物を配合してもよい。These include mold release agents such as silicone resins, water repellents, etc., and one or a mixture of two or more of these may be blended.
本発明においてはフェノール樹脂A、またはフェノール
樹脂Aがノボラック型である場合は更にアルデヒド供与
体を加えた混合物と、塩Cとの混合状態では常温では殆
んど硬化しないが、加熱すると上記塩Cが触媒的に作用
し、フェノール樹脂Aとノボラック型多価フェノール樹
脂Bとの混合物を急激に硬化させ、低温短時間で硬化が
完了し、また生成した樹脂は市販ハイオルソ型フェノー
ル樹脂の場合のような強度低下を起さない。In the present invention, when the phenol resin A or a mixture of the phenol resin A and the salt C is mixed with an aldehyde donor when the phenol resin A is a novolac type, the salt C is hardly cured at room temperature, but when heated, the salt C is hardly cured. acts catalytically, rapidly curing the mixture of phenolic resin A and novolac type polyhydric phenol resin B, and curing is completed in a short time at low temperature, and the resulting resin is similar to the case of commercially available high ortho type phenolic resins. No significant decrease in strength will occur.
実施例1〜5.比較例1
ノボラック型フェノール樹脂粉末(以下樹脂NB−Aと
云う)とノボラック型レゾルシン樹脂(以下樹脂NR−
Bと云う)との表1に示した混合比率の混合物に、酸と
窒素含有塩基との塩の硬化触媒として塩酸シクロヘキシ
ルアミンを用い、またアルデヒド供与体としてヘキサメ
チレンテトラミンを用いて表1に示す硬化性組成物とし
、ゲル化時間を測定した。Examples 1-5. Comparative Example 1 Novolac type phenolic resin powder (hereinafter referred to as resin NB-A) and novolac type resorcinol resin (hereinafter referred to as resin NR-
Cyclohexylamine hydrochloride was used as a curing catalyst for the salt of an acid and a nitrogen-containing base, and hexamethylenetetramine was used as an aldehyde donor in the mixture ratio shown in Table 1. A curable composition was prepared, and the gelation time was measured.
その結果を表1に示した。The results are shown in Table 1.
する。do.
実施例6〜10.比較例2
上記実施例と同様の樹脂NB−Aと樹脂NR−Bを用い
、酸と窒素含有塩基との塩の硬化触媒として塩酸シクロ
ヘキシルアミンを用いて表2に示す配合比率の硬化性組
成物とし、ゲル化試験を行った・
その結果は表2のようであった。Examples 6-10. Comparative Example 2 A curable composition was prepared using the same resins NB-A and NR-B as in the above example, and using cyclohexylamine hydrochloride as a curing catalyst for the salt of an acid and a nitrogen-containing base, with the blending ratio shown in Table 2. A gelation test was conducted using the following methods.The results are shown in Table 2.
表2
実施例11〜15
ノボラック型多価フェノール樹脂としてノボラック型5
−メチルレゾルシン樹脂(NR−B2)粉末を用いた他
は実施例6〜10と同様の成分で表3に示す配合比率の
硬化性組成物としてゲル化試験を行った。Table 2 Examples 11 to 15 Novolac type 5 as novolac type polyhydric phenol resin
- A gelation test was conducted using a curable composition having the same components as in Examples 6 to 10 and the blending ratio shown in Table 3, except that methyl resorcin resin (NR-B2) powder was used.
その結果を表3に示した。The results are shown in Table 3.
表3
実施例16〜17.比較例3〜5
ノボラック型多価フェノール樹脂にノボラック型シェー
ルオイルレゾルシン樹脂粉末(NR−83)を用い、酸
と窒素含有塩基との塩の硬化触媒と、酸と窒素非含有塩
基との塩を用い表4に示す配合比率の硬化性組成物とし
、ゲル化試験と成形性試験を行った。Table 3 Examples 16-17. Comparative Examples 3 to 5 Novolak type shale oil resorcin resin powder (NR-83) was used as a novolac type polyhydric phenol resin, and a curing catalyst of a salt of an acid and a nitrogen-containing base and a salt of an acid and a non-nitrogen-containing base were added. A curable composition having the blending ratio shown in Table 4 was used, and a gelation test and a moldability test were conducted.
その結果を表4に示した。The results are shown in Table 4.
(以下余白)
一、 :JIS−に−6909粉末フ工ノール樹脂ゲル
化時間測定法に準する。(Left below) 1. According to JIS-6909 powder phenolic resin gelation time measurement method.
珍2二上記フェノール樹脂配合物をフェルトに対して2
0%の塗布量になるように均一に混合し、熱プレスによ
り厚さ5閣、密度0.09g/fflになるように所定
の温度、時間の条件で成形後、室温で10分間放置した
後の成形フェルトの厚さを測定する。Chin 22 The above phenolic resin mixture was applied to felt.
The mixture was mixed uniformly to a coating amount of 0%, molded by heat press at the specified temperature and time to a thickness of 5 cm and a density of 0.09 g/ffl, and then left at room temperature for 10 minutes. Measure the thickness of the molded felt.
実施例18〜21.比較例6〜7
フェノール樹脂に実施例1〜5で用いたノボラック型フ
ェノール樹脂(NB−A)およびノボラック型ハイオル
ソフェノール樹脂(NB−A2)を、ノボラック型多価
フェノール樹脂にノボラック型シェールオイルレゾルシ
ン樹脂粉末(NR−B3)を用い、酸と窒素含有塩基と
の塩の硬化触媒として安息香酸ベンジルアミンを添加し
て表5の配合比率の硬化性組成物とし、ゲル化試験、成
形性試験、柔軟性およびキュラストメーターによる応力
の試験を行った。Examples 18-21. Comparative Examples 6 to 7 The novolac type phenol resin (NB-A) and novolac type high orthophenol resin (NB-A2) used in Examples 1 to 5 were used as the phenol resin, and the novolac type shale oil was used as the novolac type polyhydric phenol resin. Using resorcinol resin powder (NR-B3) and adding benzylamine benzoate as a curing catalyst for a salt of an acid and a nitrogen-containing base, a curable composition with the blending ratio shown in Table 5 was prepared, and gelling test and moldability test were performed. , flexibility and stress tests were conducted using a culastometer.
その結果を表5に示した。The results are shown in Table 5.
(以下余白) 表5 する。(Margin below) Table 5 do.
−2:上記フェノール樹脂配合物をフェルトに対して1
5%の塗布量になるように均一に混合し、熱プレスによ
り厚さ20腸、密度0.09g/−になるように所定の
温度1時間の条件で成形後、室温に所定時間放置した後
の成形フェルトの厚さを測定する6
−3二上記フエノール樹脂配合物を木粉に対して2止の
塗布量になるように均一に混合し、熱プレスにより20
0℃×2分厚さ5m+、密度0.2g/cdになるよう
にで成形後、室温で24時間放置した後に90°折曲げ
た時の状態を観察した。-2: The above phenolic resin compound was applied to felt at 1
Mix uniformly to a coating amount of 5%, mold by heat press at a specified temperature for 1 hour to a thickness of 20 g/-, and a density of 0.09 g/-, then leave at room temperature for a specified period of time. Measure the thickness of the molded felt 6-3 2. Mix the above phenolic resin mixture evenly with the wood flour so that the coating amount is 200% by heat press.
After molding at 0° C. x 2 minutes to a thickness of 5 m+ and a density of 0.2 g/cd, it was left at room temperature for 24 hours and then bent at 90° and the state was observed.
X:折れて割れる Oニ一部ヒビは入るが割れないO
:柔軟性あり割れない
寧4: JSR型キュラストメーターによる硬化試験(
測定条件:温度150℃、振巾±1/4°)実施例22
.比較例8
レゾール型フェノール樹脂(R5−A)の50%メタノ
ール溶液90重量部にノボラック型レゾルシン樹脂(N
R−B)の50%メタノール溶液10重量部および窒素
含有塩基との塩の硬化触媒として塩!lp−トルイジン
5部を加え、フェルトに固形分として20%の塗布量に
なるように均一に含浸させ、室温で乾燥してメタノール
を除去後、熱プレスにより厚さ5m、密度0.25g#
jになるように表6に示す所定の温度、時間の条件で成
形した。またノボラック型レゾルシン樹脂(NR−B)
を用いないものを比較例として同様に成形した。成形後
10分間放置した後の成形フェルトの厚さを測定した。X: It breaks and cracks. There are some cracks, but it doesn't break.
: Flexible and unbreakable 4: Hardening test using JSR type Curastometer (
Measurement conditions: temperature 150°C, amplitude ±1/4°) Example 22
.. Comparative Example 8 Novolac type resorcinol resin (N
10 parts by weight of a 50% methanol solution of R-B) and a salt as a curing catalyst with a nitrogen-containing base! Add 5 parts of lp-toluidine and uniformly impregnate the felt to a coating amount of 20% as a solid content. After drying at room temperature to remove methanol, heat press to a thickness of 5 m and a density of 0.25 g #
It was molded under the predetermined temperature and time conditions shown in Table 6 so that Also, novolac type resorcinol resin (NR-B)
As a comparative example, a molded product without using . The thickness of the molded felt after being left for 10 minutes after molding was measured.
その結果を表6に示した。The results are shown in Table 6.
表 6
〔発明の効果〕
したがって本発明においてはフェノール樹脂の硬化温度
が低くなるから、耐熱性の低い繊維のバインダーとして
もフェノール樹脂を用いることが可能となり、また硬化
の際の熱エネルギーが大巾に節減される。そして本発明
においてはフェノール樹脂の硬化後の強度は通常のフェ
ノール樹脂と同等またはそれ以上である。Table 6 [Effects of the Invention] Therefore, in the present invention, since the curing temperature of the phenol resin is lowered, it is possible to use the phenol resin as a binder for fibers with low heat resistance, and the thermal energy during curing is greatly reduced. will be saved. In the present invention, the strength of the phenol resin after curing is equal to or higher than that of a normal phenol resin.
特許出願人 名古屋油化株式会社Patent applicant: Nagoya Yuka Co., Ltd.
Claims (1)
脂との混合物を、有機酸または無機酸と窒素含有塩基と
の塩である硬化触媒によって硬化させることを特徴とす
る硬化方法2、ノボラック型フェノール樹脂とノボラッ
ク型多価フェノール樹脂との混合物に硬化剤としてアル
デヒド供与体を加えた混合物を、有機酸または無機酸と
窒素含有塩基との塩である硬化触媒によって硬化させる
ことを特徴とする硬化方法1. A curing method characterized by curing a mixture of a phenol resin and a novolak type polyhydric phenol resin with a curing catalyst that is a salt of an organic acid or an inorganic acid and a nitrogen-containing base.2. A curing method characterized by curing a mixture of a novolac type polyhydric phenol resin and an aldehyde donor as a curing agent using a curing catalyst that is a salt of an organic acid or an inorganic acid and a nitrogen-containing base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32004690A JP3237841B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32004690A JP3237841B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04185624A true JPH04185624A (en) | 1992-07-02 |
JP3237841B2 JP3237841B2 (en) | 2001-12-10 |
Family
ID=18117132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32004690A Expired - Fee Related JP3237841B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3237841B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0680939A1 (en) * | 1994-04-27 | 1995-11-08 | Industrias Quimicas Del Urumea, S.A. | Process to obtain green compacts for later sintering |
JP2006518004A (en) * | 2003-02-18 | 2006-08-03 | インドスペク ケミカル コーポレーション | Modified resorcinol resin and use thereof |
WO2013022012A1 (en) * | 2011-08-09 | 2013-02-14 | 東レ株式会社 | Carrier for adsorption and method for producing same |
CN105980475A (en) * | 2014-02-07 | 2016-09-28 | 住友电木株式会社 | Phenolic resin composition for friction material, friction material, and brake |
CN106459557A (en) * | 2014-05-30 | 2017-02-22 | 住友电木株式会社 | Phenolic resin composition, and phenolic resin cured product |
WO2018008413A1 (en) * | 2016-07-08 | 2018-01-11 | Dicグラフィックス株式会社 | Polyester-modified phenolic resin and printing ink |
-
1990
- 1990-11-21 JP JP32004690A patent/JP3237841B2/en not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0680939A1 (en) * | 1994-04-27 | 1995-11-08 | Industrias Quimicas Del Urumea, S.A. | Process to obtain green compacts for later sintering |
JP2006518004A (en) * | 2003-02-18 | 2006-08-03 | インドスペク ケミカル コーポレーション | Modified resorcinol resin and use thereof |
WO2013022012A1 (en) * | 2011-08-09 | 2013-02-14 | 東レ株式会社 | Carrier for adsorption and method for producing same |
JPWO2013022012A1 (en) * | 2011-08-09 | 2015-03-05 | 東レ株式会社 | Adsorption carrier and method for producing the same |
US9023947B2 (en) | 2011-08-09 | 2015-05-05 | Toray Industries, Inc. | Carrier for adsorption and method for producing same |
AU2012293188B2 (en) * | 2011-08-09 | 2015-07-02 | Toray Industries, Inc. | Carrier for adsorption and method for producing same |
CN105980475A (en) * | 2014-02-07 | 2016-09-28 | 住友电木株式会社 | Phenolic resin composition for friction material, friction material, and brake |
JPWO2015118996A1 (en) * | 2014-02-07 | 2017-03-23 | 住友ベークライト株式会社 | Phenolic resin composition for friction material, friction material and brake |
CN105980475B (en) * | 2014-02-07 | 2018-07-17 | 住友电木株式会社 | Friction material phenol resin composition, friction material and brake |
CN106459557A (en) * | 2014-05-30 | 2017-02-22 | 住友电木株式会社 | Phenolic resin composition, and phenolic resin cured product |
JPWO2015182640A1 (en) * | 2014-05-30 | 2017-04-20 | 住友ベークライト株式会社 | Phenolic resin composition and cured phenolic resin |
EP3150667A4 (en) * | 2014-05-30 | 2018-01-10 | Sumitomo Bakelite Co.,Ltd. | Phenolic resin composition, and phenolic resin cured product |
US10144823B2 (en) * | 2014-05-30 | 2018-12-04 | Sumitomo Bakelite Co., Ltd. | Phenolic resin composition and phenolic resin cured product |
WO2018008413A1 (en) * | 2016-07-08 | 2018-01-11 | Dicグラフィックス株式会社 | Polyester-modified phenolic resin and printing ink |
JP6316520B1 (en) * | 2016-07-08 | 2018-04-25 | Dicグラフィックス株式会社 | Polyester-modified phenolic resin and printing ink |
Also Published As
Publication number | Publication date |
---|---|
JP3237841B2 (en) | 2001-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4451577A (en) | Catalyst composition and method for curing furan-based foundry binders | |
CN101824295B (en) | Adhesive for automobile disc brake pad and preparation method thereof | |
CN1074922A (en) | The aqueous adhesive compositions that contains stabilized phenolic resins | |
CA1116341A (en) | Adhesion of rubber to reinforcing materials | |
JPS63291945A (en) | Low shrinkage phenol resin forming material | |
JP3576433B2 (en) | Method for producing spherical phenolic resin | |
JPH04185624A (en) | Method of curing | |
CN104448818A (en) | High-performance benzoxazine resin composition applied to automobile brake pad and preparation method of high-performance benzoxazine resin composition | |
US4200706A (en) | Curing of phenol-formaldehyde resins | |
GB2140017A (en) | Phenolic resin binder compositions exhibiting low fume evolution in use | |
JP3128235B2 (en) | Curing method | |
US3043804A (en) | Curing promoter for furane resins | |
JP2000273135A (en) | Manufacture of phenol-based resin | |
JPS58500568A (en) | Heat-stable phenolic resin moldings | |
GB2177408A (en) | Foundry binder compositions | |
CN112300350B (en) | Urea-formaldehyde resin adhesive modifier and application thereof, modified urea-formaldehyde resin adhesive and application thereof | |
JP4426176B2 (en) | Phenolic resin adhesive composition | |
JP3729469B2 (en) | Method for producing curable resin composition | |
JP2001254065A (en) | Wood adhesive composition | |
US2576735A (en) | Nitrogenous resins from ketonealdehyde-nitrogenous base and phenol-aldehyde | |
JP2001279214A (en) | Phenolic resin based adhesive composition | |
JP3856344B2 (en) | Curing method for urea-aldehyde resin | |
JPH06184405A (en) | Phenol resin composition | |
JP3025351B2 (en) | Liquid curing agent | |
CN115850627A (en) | Environment-friendly furan resin and curing agent composition thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071005 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101005 Year of fee payment: 9 |
|
LAPS | Cancellation because of no payment of annual fees |