JPH0418453U - - Google Patents
Info
- Publication number
- JPH0418453U JPH0418453U JP1990059926U JP5992690U JPH0418453U JP H0418453 U JPH0418453 U JP H0418453U JP 1990059926 U JP1990059926 U JP 1990059926U JP 5992690 U JP5992690 U JP 5992690U JP H0418453 U JPH0418453 U JP H0418453U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- heat sink
- ceramic substrate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990059926U JPH0418453U (US07223432-20070529-C00017.png) | 1990-06-05 | 1990-06-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990059926U JPH0418453U (US07223432-20070529-C00017.png) | 1990-06-05 | 1990-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0418453U true JPH0418453U (US07223432-20070529-C00017.png) | 1992-02-17 |
Family
ID=31586858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990059926U Pending JPH0418453U (US07223432-20070529-C00017.png) | 1990-06-05 | 1990-06-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0418453U (US07223432-20070529-C00017.png) |
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1990
- 1990-06-05 JP JP1990059926U patent/JPH0418453U/ja active Pending