JPH04178507A - Appearance inspection method for solder - Google Patents

Appearance inspection method for solder

Info

Publication number
JPH04178507A
JPH04178507A JP30742490A JP30742490A JPH04178507A JP H04178507 A JPH04178507 A JP H04178507A JP 30742490 A JP30742490 A JP 30742490A JP 30742490 A JP30742490 A JP 30742490A JP H04178507 A JPH04178507 A JP H04178507A
Authority
JP
Japan
Prior art keywords
solder
chip
leads
central
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30742490A
Other languages
Japanese (ja)
Other versions
JP2867687B2 (en
Inventor
Hirofumi Matsuzaki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP30742490A priority Critical patent/JP2867687B2/en
Publication of JPH04178507A publication Critical patent/JPH04178507A/en
Application granted granted Critical
Publication of JP2867687B2 publication Critical patent/JP2867687B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To perform reliable decision of adhesion by detecting the presence of spread of light and darkness from the sides of an inspection area toward a central part by means of a camera located above as irradiation with light is effected when appearance of solder in a semicylindrical shape is inspected after a chip with leads is adhered to a substrate by using solder.
CONSTITUTION: A chip 2 with leads is placed on a substrate 1 and a plurality of leads 4 extended outwardly of the chip are connected to a circuit pattern 6 by using solder 5. In this case, to inspect whether the solder 5 is formed in a desired semicylindrical shape, a camera 7 is arranged above the chip 2 through the medium of an annular light source 8. Since so adhered semicylindrical solder 5a has a bright area (a) at a central part and dark areas (b) on both sides, photo scanning is effected from the both sides toward the central part of an inspection area A. In which case, the direction of scanning may be reversed. When a spread of the dark area (b) is inspected as a result of scanning, it is decided that adhesion is formed in a semicylindrical shape.
COPYRIGHT: (C)1992,JPO&Japio
JP30742490A 1990-11-13 1990-11-13 Solder appearance inspection method Expired - Fee Related JP2867687B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30742490A JP2867687B2 (en) 1990-11-13 1990-11-13 Solder appearance inspection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30742490A JP2867687B2 (en) 1990-11-13 1990-11-13 Solder appearance inspection method

Publications (2)

Publication Number Publication Date
JPH04178507A true JPH04178507A (en) 1992-06-25
JP2867687B2 JP2867687B2 (en) 1999-03-08

Family

ID=17968894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30742490A Expired - Fee Related JP2867687B2 (en) 1990-11-13 1990-11-13 Solder appearance inspection method

Country Status (1)

Country Link
JP (1) JP2867687B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122016A (en) * 2008-11-18 2010-06-03 Yamaha Motor Co Ltd Device and method for inspecting mounting state of component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015109431A1 (en) * 2015-06-12 2016-12-15 Witrins S.R.O. Inspection system and method for error analysis of wire connections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010122016A (en) * 2008-11-18 2010-06-03 Yamaha Motor Co Ltd Device and method for inspecting mounting state of component

Also Published As

Publication number Publication date
JP2867687B2 (en) 1999-03-08

Similar Documents

Publication Publication Date Title
JPS59186324A (en) Foreign substance inspecting apparatus
JPH02275346A (en) Inspection for vessel finished part
JPH04177111A (en) Apparatus for inspecting phase shift mask
JPS641940A (en) Through hole void inspection
JPS63304146A (en) Inspecting device for drum part of bottle
JPH04178507A (en) Appearance inspection method for solder
JPS6242039A (en) Surface inspecting device
JPH04166711A (en) Surface-state observing apparatus
JPH04166709A (en) Surface-state observing apparatus
JPH03122556A (en) Method and apparatus of checking translucent sheet-like material
JPH04178545A (en) Method and apparatus for inspecting transparent band-like body
JPH04166710A (en) Surface-state observing apparatus
JPH03165534A (en) Defect inspecting device
JPH02247513A (en) Inspecting device for hole charging state
JPH03167406A (en) Apparatus for detecting width of lug part of sheet-shaped body
JPH04231853A (en) Apparatus for inspecting surface flaw
JPS63106508A (en) Method and apparatus for inspecting mounting state
JPS6215442A (en) Pattern inspecting method and its device
JPS6361104A (en) Apparatus for inspecting positional shift
JPS60235281A (en) Pattern checking device
JPH01260586A (en) Substrate inspecting device
JPH01227006A (en) Inspecting apparatus for mounting of component parts
JPH02236406A (en) Method for inspecting mask pattern
JPS58139427A (en) Unevenness detecting mask and unevenness detector making use thereof
JPS63154948A (en) Dust detection

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees