JPH04149919A - Manufacture of wafer for switch - Google Patents

Manufacture of wafer for switch

Info

Publication number
JPH04149919A
JPH04149919A JP27319090A JP27319090A JPH04149919A JP H04149919 A JPH04149919 A JP H04149919A JP 27319090 A JP27319090 A JP 27319090A JP 27319090 A JP27319090 A JP 27319090A JP H04149919 A JPH04149919 A JP H04149919A
Authority
JP
Japan
Prior art keywords
contact
wafer
pin
edge portion
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27319090A
Other languages
Japanese (ja)
Other versions
JP2721427B2 (en
Inventor
Masahito Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP27319090A priority Critical patent/JP2721427B2/en
Publication of JPH04149919A publication Critical patent/JPH04149919A/en
Application granted granted Critical
Publication of JP2721427B2 publication Critical patent/JP2721427B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an excellent wafer for a switch by blocking movement of a fixed contact by a butting member and preventing position slippage of the fixed contact.
CONSTITUTION: A die device 22 for molding a wafer 21 is provided with a cavity 23 being formed on the jointing face of a fixed die 27 and a moving die 28, a gate 30 injecting fused resin 24 being fed via a runner 29 into the cavity 23, and a touching member, for instance, a pin 31 touching to a part being apart from a supporting portion 9 in the edge portion of a fixed contact 2c, that is, an upper side portion in the figure in the edge portion of the contact 2c. A recess 25 is formed on an inside bottom face fronting the opening of the wafer 21 by means of the head of this pin 31. Here the pin 31 touches to the edge portion of the contact 2c so as to block movement of the contact 2c, and thereby it is, possible to prevent position slippage of the contact 2c.
COPYRIGHT: (C)1992,JPO&Japio
JP27319090A 1990-10-15 1990-10-15 Switch wafer and manufacturing method thereof Expired - Lifetime JP2721427B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27319090A JP2721427B2 (en) 1990-10-15 1990-10-15 Switch wafer and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27319090A JP2721427B2 (en) 1990-10-15 1990-10-15 Switch wafer and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH04149919A true JPH04149919A (en) 1992-05-22
JP2721427B2 JP2721427B2 (en) 1998-03-04

Family

ID=17524356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27319090A Expired - Lifetime JP2721427B2 (en) 1990-10-15 1990-10-15 Switch wafer and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2721427B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632585B (en) * 2017-12-06 2018-08-11 百容電子股份有限公司 Control switch

Also Published As

Publication number Publication date
JP2721427B2 (en) 1998-03-04

Similar Documents

Publication Publication Date Title
JPH04149919A (en) Manufacture of wafer for switch
JPH02179714A (en) Double injection molding method
JPS6341118A (en) Mold device for molding resin
JPH02107416A (en) Molding method for composite article
JPH02107417A (en) Multigate tip piece device for synthetic resin injection molding machine
JPS63295224A (en) Mold assembly for resin molding
JPS6290213A (en) Molding method of integrated circuit element casing based on injection molding
JPS61121920A (en) Bidirectional undercut processing device
JPS62196114A (en) Plastic molding die
JPS60193622A (en) Mold for two color molding
JPS56136343A (en) Molding method and mold therefor
JPH04308716A (en) Mold for molding of resin
JPS5569421A (en) Modling of frame for electric appliance
JPH0494907A (en) Resin molding die device
JPH02283414A (en) Injection molding die and injection molding method using the same
JPS63111023A (en) Mold for plastic
JPH03189603A (en) Optical reflecting mirror
JPS55139241A (en) Resin molding machine of substrate
KR910000877Y1 (en) Mould opening-closing device
JPS61154816A (en) Manufacture of knife or the like
JPS5682208A (en) Metal mold for molding
KR850000294Y1 (en) The mould for undercut to the sloped boss
JPH01241415A (en) Transfer material for in-mold molding
JPH02206407A (en) Partition plate and manufacture thereof
JPS5920637A (en) Metal mold for injection molding of tape guide