JPH04142098A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To improve impact resistance by disposing a terminal lead so as to be circulated on the periphery of a columnar member for an outer connection terminal, and providing the member on a circuit board. CONSTITUTION:A land electrode 1' and a wiring pattern are formed on at least one surface of an insulating board 1, a columnar member 2 for an outer connection terminal in which a terminal lead is circulated on the periphery of an insulating member on the electrode, and electronic components 4, 4' are placed on the wiring patterns. Then, the electrode l', the terminal lead of the member 2 are electrically connected to the wiring pattern, the components 4, 4' by solder reflowing to obtain a hybrid integrated circuit device. The device manufactured in this manner is, for example, placed on the wiring pattern of a base circuit board similarly to the components by using a mounting unit, and both are then connected by reflowing. Thus, the board becomes strong against a horizontal impact, and can be handled as one component in the case of mounting the lead and the circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a hybrid integrated circuit device in which external connection terminals can be attached to a circuit board in the same way as electronic components.

[Conventional technology]

A conventional method for connecting external connection terminals to land electrodes of a circuit board will be described with reference to FIG. 11.

In FIG. 11, the circuit board 21 is, for example, a ceramic board or the like, and after printing a thick film of conductive paste on at least one surface of the circuit board 21, it is fired to form a land electrode 25 and a non-illustrated part. A predetermined wiring pattern is formed.

Thereafter, paste solder is applied onto the wiring pattern (not shown), and electronic components 24, 24' are placed thereon. For example, the electronic component 24 is a flat package IC, and the electronic component 24' is a chip-type surface-mounted electronic component.

Next, with the electronic components 24 and 24' placed on the wiring pattern, heat is applied to perform a reflow process. As a result, the electronic components 24, 24' are electrically connected to the wiring pattern on the circuit board 21.

Further, a plurality of terminal leads 23 each including a U-shaped terminal portion 26 and a lead portion 27 are connected by tie bars 22 . The terminal leads 23 connected by the tie bars 22 in this manner are collectively soldered to each land electrode 25 on both ends of the circuit board 21. After that, the terminal lead 23 is connected so that the tie bar 22 part is connected to the terminal lead 23.
from its proximal end so that it is separated. The ends of the terminal leads 23 are bent at right angles so that the circuit board 21 can be easily placed on a mother circuit board (not shown).

A hybrid integrated circuit device is manufactured in the manner described above. 1st
The hybrid integrated circuit device shown in FIG. 1 is shown as an example of a dual in-line type, or may be similarly manufactured in a single in-line type. Moreover, although the case has been described in which the electronic components 24.24' are placed on one principal surface of the circuit board 21, it is also possible to provide the electronic components 24.24 on both surfaces. Furthermore, it is possible to package the circuit board 21 to which the electronic components 24, 24' and the terminal leads 23 are soldered with resin.

[Invention or problem to be solved]

In order to mechanically and electrically connect the terminal leads 23 of the circuit board 21 as described above and the land electrodes of the mother circuit board (not shown), the arrangement of the terminal leads 23 must be aligned individually. No.

However, if the circuit board 21 is touched somewhere during transportation or work, the terminal leads 23 may be bent and the circuit board 21 may be bent.
A defect occurs when the terminal lead 23 of No. 1 is attached to the land electrode of the mother circuit board. That is, even if the terminal leads 23 of the circuit board 21 are moved to the correct positions on the land electrodes of the mother circuit board, if even one terminal lead 23 is not aligned as described above, the installation will be defective.

Furthermore, after connecting the terminal leads 23 of the circuit board 21 and the land electrodes of the mother circuit board, for example, if the device is dropped during work, or for some other reason, a horizontal force is applied to the board surface of the device. When the circuit board 21
The terminal leads 23 are fragile and bend, and the circuit board 21 tilts on the mother circuit board. In such a case, there is a risk that the wiring pattern of the circuit board 21 and the wiring pattern of the mother circuit board will come into contact and cause a short circuit accident.

Furthermore, in order to attach the electronic component 2'4, 24' and the terminal lead 23 to the circuit board 21 as in the conventional example described above, separate steps had to be performed.

The present invention is intended to solve the above problems.
It is an object of the present invention to provide a method for manufacturing a hybrid integrated circuit device that is strong against impacts in the horizontal direction of a circuit board and that can be handled as one component when attaching terminal leads and a circuit board.

Another object of the present invention is to provide a method for manufacturing a hybrid integrated circuit device in which electronic components and terminal leads can be mounted on a circuit board in the same process.

[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing a hybrid integrated circuit device of the present invention includes a first step of forming a wiring pattern and a land electrode at predetermined positions on the surface of a circuit board. and mounting columnar members for external connection terminals on the land electrodes, each forming at least two planes on which electronic components can be placed on the wiring pattern and on which terminal leads can be placed around the surface of the heat-resistant insulating member. and a third step of electrically connecting the wiring pattern, the electronic component, the land electrode, and the terminal lead of the columnar member for external connection terminal by soldering using reflow processing.

Further, the method for manufacturing a hybrid integrated circuit device of the present invention includes a first step in which wiring patterns and land electrodes are formed at predetermined positions on the surface of a large circuit board consisting of a plurality of regions on the surface divided by dividing grooves. The electronic component is placed on the wiring pattern, and the external connection terminal columnar member having at least two planes on which terminal leads can be placed around the circumferential surface of the heat-resistant insulating member is placed on the land electrode. a third step of electrically connecting the wiring pattern, the electronic component, the land electrode, and the terminal lead of the columnar member for external connection terminal by soldering by reflow process; and a fourth step of dividing the circuit boards according to the dividing grooves to obtain individual circuit boards.

[For production]

A land electrode and a wiring pattern are formed on at least one surface of the insulating substrate. Then, a columnar member for an external connection terminal, in which a terminal lead is wound around the surface of the insulating member, is placed on the land electrode, and an electronic component is placed on the wiring pattern. Thereafter, the land electrode, the terminal lead of the external connection terminal columnar member, the wiring pattern, and the electronic component are electrically connected by solder reflow processing to form a hybrid integrated circuit device. Note that the electronic component and the external connection terminal columnar member are mounted on the circuit board using, for example, a mounter device.

The hybrid integrated circuit device manufactured as described above is mounted on the wiring pattern of the mother circuit board using a mounter, for example, in the same way as electronic components, and then the two are connected by reflow processing.

For large circuit boards with dividing grooves, regardless of whether they are dual-in-line or single-in-line,
The electronic component and the external connection terminal columnar member can be attached using the same method as described above. Finally, by dividing along the dividing grooves, individual hybrid integrated circuit devices are obtained.

As described above, the columnar member for external connection terminal, in which the terminal lead is wound around the circumferential surface of the insulating member, is treated in the same way as an electronic component. The process of attaching it to the pattern can be the same.

In addition, the external connection terminal columnar member does not bend from the terminal lead even when subjected to impact, so it is highly reliable against impact during manufacturing of the hybrid integrated circuit device and after completion of the product.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 3. In FIG. 1, the hybrid integrated circuit device is composed of a circuit board 1, a columnar member 2 for external connection terminals around which terminal leads 3 are wound, and electronic components 4, 4'.

The circuit board 1 is obtained by, for example, forming land electrodes 1' and a wiring pattern (not shown) on a ceramic insulating member by thick-film printing of a conductive paste, and then firing it. In addition, the columnar member 2 for external connection terminal
As shown in FIGS. 2 and 3, a terminal lead 3 is wound around the circumferential surface of the terminal lead 3 by a method described later. The electronic component 4.4' is, for example, a flat package IC or a surface-mounted chip type electronic component.

Next, solder paste is applied by printing onto the land electrodes 1' of the circuit board 1 and the wiring patterns (not shown). And the above-mentioned columnar member 2 for external connection terminal.
The electronic component 4.4' is placed on the predetermined land electrode 1' or on the wiring pattern using a mounter, for example. Thereafter, the circuit board 1 on which the external connection terminal columnar member 2 and the electronic components 4 and 4' are placed is placed in a reflow oven (not shown) and subjected to a reflow process. As a result, the terminal leads 3 and land electrodes 1', which are wrapped around the circumferential surface of the columnar member 2 for external connection terminals, and the wiring patterns and electronic components 4.4
' are electrically connected. Note that the external connection terminal columnar member 2 is made of an insulating member that can withstand the temperature of the reflow oven.

The case where the external connection terminal columnar member 2 and the electronic components 4 and 4' are respectively attached to the wiring pattern and the land electrode 1' formed on one surface of the circuit board 1 has been described above. When a land electrode 1' and a wiring pattern are formed on the two-sided surface of the l, and an external connection terminal columnar member 2 and an electronic component 4,4' are respectively attached on the two land electrodes and the wiring pattern, Solder reflow may be performed in two steps.

However, if semi-dry solder paste is used, the external connection terminals placed on the bottom surface of the circuit board l can be removed from the external connection terminal columnar members 2 and electronic components 4 and 4' placed on both sides of the circuit board l. The terminal columnar member 2 and the electronic component 4.4' are
Since it does not fall, only one glue flow process is required.

After this flow process, the circuit board 1
The exterior is formed by applying resin on top.

As an embodiment of the present invention, a dual and in-line type hybrid integrated circuit device as shown in FIG. 1 has been described, but a single in-line type hybrid integrated circuit device can be manufactured in the same manner.

Next, another embodiment of the present invention will be described with reference to FIGS. 4 and 5.

In FIG. 4, a dividing groove 5 is formed in a large circuit board 6 to a size constituting one hybrid integrated circuit device. Then, the columnar members 2 for external connection terminals are placed in the same manner as described above at positions corresponding to both ends of one hybrid integrated circuit device, and are connected to the land electrodes 1' formed on the large circuit board 6 and for external connection terminals. The terminal lead 3 of the columnar member 2 is electrically connected. In Fig. 4, the columnar member 2 for external connection terminal is shown.
Although only shown, electronic components 4.4' are also installed at the same time.

Thereafter, it is divided according to the dividing groove 5 to produce individual hybrid integrated circuit devices.

In FIG. 5, the external connection terminal columnar member 2 is attached to a position corresponding to one edge of the circuit board 1 in the same manner as described above, thereby producing a single in-line type hybrid integrated circuit device.

Next, the method for manufacturing the columnar member 2 for external connection terminals will be described in the sixth step.
This will be explained according to figures (A) to (E).

The external connection terminal columnar member 2 is an insulating member and can have any cross-sectional shape such as square, rectangular, hexagonal, or round. However, the external connection terminal columnar member 2 needs to have flat surfaces on which it can be placed on at least two surfaces, one on the circuit board 1 side and the other on the mother circuit board (not shown).

By selecting the external shape of the columnar member 2 for external connection terminals, it is possible to change the height of the hybrid integrated circuit device or the effective area on which electronic circuit components, land electrodes, wiring patterns, etc. are provided on the hybrid integrated circuit board.

The terminal lead 3 is made of, for example, a tin-plated copper wire member, and is attached so as to go around the circumferential surface of the external connection terminal columnar member 2 as described above.

Further, for example, the terminal lead 3 is formed into a shape with an open portion 8 provided at the lower end, as shown in FIG. 6(a). The cross section of the terminal lead 3 is in the shape of a square 1. Alternatively, it can be a rectangular conductor.

Next, the upper part of the terminal lead 3 having the shape shown in FIG. 6(a) is bent into a bent portion 8', and both ends are opened in the direction of the arrow shown in FIG. 6(b).

On the other hand, adhesive is applied in advance to the position of the external connection terminal columnar member 2 where the terminal lead 3 is to be arranged. Therefore, the terminal lead 3 whose lower end has been expanded by an automatic machine is automatically placed at the position of the external connection terminal columnar member 2 where the adhesive is applied.

Thereafter, in FIG. 6(c), the pressing members 9 to 11 simultaneously press the periphery of the terminal lead 3 from both ends and the upper end shown in the arrow direction. Alternatively, after the pressing member 9 presses the upper part of the terminal lead 3, the pressing members 10 and 11 similarly press the side portions from both sides.

By such pressing, the terminal lead 3 is attached so as to go around the circumferential surface of the external connection terminal columnar member 2, as shown in FIG. 6(d).

In addition, when placing the terminal lead 3 on the columnar member 2 for external connection terminal, the columnar member 2 for external connection terminal may be attached with adhesive in advance or without adhesive and pressed by pressing members 9 to 11 or the like. It can be made to bite into the member 2. Alternatively, a groove 7 indicated by a dotted line may be formed in advance in the external connection terminal columnar member 2 as shown in FIG. 6(e), and the terminal lead 3 may be pushed into the groove 7. When the grooves 7 are provided in this way, the terminal leads 3 are not easily misaligned, and excess solder does not enter the gap between the grooves 7 due to its surface tension and short-circuit adjacent terminal leads 3.

Further, another embodiment of a method for attaching a terminal lead to the external connection terminal columnar member 2 will be described with reference to FIGS. 7 to 10 (a) and (b).

In FIG. 7, a lead frame 14 is formed by press working from a metal strip member so as to be composed of a desired number of terminal leads 3 and a frame portion 16 to which both ends of the lead frame portion 16 are connected. Note that the opening 15 is a pilot hole in the above-mentioned press working or the like. As shown in FIG. 8, the lead frame 14 molded in this manner is placed between pressing blocks 17 and 17' corresponding to press molds. The pressing blocks 17, 17' are arranged slightly narrower than the spacing between one side of the external connection terminal columnar member 2.

Next, the external connection terminal columnar member 2 is pushed between the pressing blocks 17 and 17' by a pressing member (not shown) as shown in FIG. 9 (A) and FIG. 1θ (A). . By pressing the columnar member 2 for external connection terminal, the terminal leads 3 of the lead frame 14 are made to run along three sides of the columnar member 2 for external connection terminal. and,
Both ends of the terminal lead 3 and the connected frame portion 16 are led out from between the pressing block 17, 17' and the columnar member 2 for external connection terminal.

After that, in the lead frame 14, the frame portion 16 connecting the terminal leads 3 is cut by a press or the like. Then, both ends of the terminal lead 3 are bent by pressing members 18 and 18' so as to go around one side of the external connection terminal columnar member 2, as shown in FIG. 9(a). (b) Molded as shown. In addition, when press-molding the terminal board 3 into a U-shape,
As shown in the figure, one side of the lead frame 14 can be fixed with a pin 19 so that it does not move, and only the other side can be bent as shown in FIG. 10 (b).

The terminal lead 3 is attached to the external connection terminal columnar member 2 by pressing with the pressing members 18 and 18'. Alternatively, a double-sided adhesive film can be attached. In this way, even if an excessive external force is applied to the external connection terminal columnar member 2 and the terminal lead 3, the positional relationship between the two will not shift.

When the terminal leads 3 are attached to the external connection terminal columnar member 2 using the lead frame 14 as described above, there is no deviation in the positional relationship between the two, so it is possible to further narrow the distance between the terminal leads 3.

The external connection terminal columnar member 2 provided with such a terminal lead 3 is treated like one electronic circuit component and attached to the circuit board 1 to create a hybrid integrated circuit device. At the same time, since the hybrid integrated circuit device does not have long terminal leads unlike the conventional example, it is handled as one electronic circuit component and attached to the mother circuit board.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.

For example, the shape of the terminal lead 3 may be a U-shape, an L-shape, a frame, or the like in addition to the above embodiments.

In addition, in the case of the above-mentioned U-shape, attachment to the columnar member for external connection terminals can be done by simply placing it on the adhesive portion of the columnar member for external connection terminals from above. Further, in the case of a frame, the open portion in this embodiment is made into a notch, and the frame is attached by widening that portion.

Further, the lead frame can be formed by etching in addition to pressing.

〔Effect of the invention〕

According to the present invention, the external connection terminal columnar member provided with the terminal lead and the hybrid integrated circuit device to which it is attached are treated as one component, so that the attachment of the terminal lead to the circuit board and the hybrid integrated circuit device are handled as one component. Attachment to the mother circuit board can be done quickly and accurately.

According to the present invention, the terminal lead is arranged so as to go around the circumferential surface of the columnar member for external connection terminal, and the columnar member for external connection terminal is provided on the circuit board, so there is no long terminal lead as in the conventional case. Therefore, it is resistant to external shocks. A hybrid integrated circuit device consisting of a circuit board provided with columnar members for external connection terminals as in the present invention may be displaced from the mother circuit board or may be prone to slipping from the mother circuit board if it is dropped or a horizontal force is applied to the hybrid integrated circuit board. Only the wiring pattern is shorted.

According to the present invention, since the terminal leads are attached to the columnar member for external connection terminals using a lead frame, the terminal leads can be placed accurately without any misalignment. The terminal lead spacing can be made narrower than in the conventional example.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for assembling a hybrid integrated circuit device according to the present invention;
2 is a perspective view of an external connection terminal according to the present invention, FIG. 3 is a sectional view of an external connection terminal according to the present invention, FIG. The figure is an explanatory diagram for assembling a columnar member for an external connection terminal in a single in-line hybrid integrated circuit device, and FIGS. Figure 7 is an explanatory diagram of the lead frame in the present invention, Figure 8 is an explanatory diagram of terminal lead forming in the present invention, and Figure 9 (
A) and (B) are explanatory diagrams of how the terminal lead in the present invention goes around the columnar member for external connection terminals, and Figures 1O (A) and (B) show how the terminal lead in the present invention goes around the columnar member for external connection terminals. FIG. 11 is an explanatory diagram of terminal lead attachment in a conventional example. l...Circuit board 1'...Land electrode 2...Column member for external connection terminal 3...Terminal lead 4...Electronic component 4'...Electronic component 5...Dividing groove 6... Large circuit board 7...groove 8...opening part 8'...bending part 9 to 11...pressing member 4...lead frame 5...opening 6...frame part 7. 17'... Pressing block 8. 18'... Pressing member 19... Bin Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 6 71 Heaven 1 Figure 10

Claims (2)

[Claims] (1) A first step of forming a wiring pattern and a land electrode 1' at a predetermined position on the surface of the circuit board 1, and placing the electronic components 4, 4' on the wiring pattern and surrounding the heat-resistant insulating member. a second step of placing external connection terminal columnar members 2 having at least two planes on which the terminal leads 3 can be placed on the land electrodes 1'; the wiring pattern and the electronic component 4; 4' and a third step of electrically connecting the land electrode 1' and the terminal lead 3 of the external connection terminal columnar member 2 by soldering by reflow treatment. Production method. (2) a first step of forming wiring patterns and land electrodes 1' at predetermined positions on the surface of the large circuit board 6, which consists of a plurality of regions on the surface divided by the dividing grooves 5, and the electronic component 4; 4' on the wiring pattern, and a columnar member 2 for an external connection terminal having at least two planes on which the terminal lead 3 can be placed around the circumferential surface of the heat-resistant insulating member on the land electrode 1'. a second step of placing the wiring pattern and the electronic components 4, 4', and the land electrode 1' and the terminal lead 3 of the external connection terminal columnar member 2 by soldering through a reflow process; 3 steps, and a fourth step of dividing the large circuit board 6 according to the dividing grooves 5 to obtain individual circuit boards 1.