JPH0412689Y2 - - Google Patents
Info
- Publication number
- JPH0412689Y2 JPH0412689Y2 JP1987019078U JP1907887U JPH0412689Y2 JP H0412689 Y2 JPH0412689 Y2 JP H0412689Y2 JP 1987019078 U JP1987019078 U JP 1987019078U JP 1907887 U JP1907887 U JP 1907887U JP H0412689 Y2 JPH0412689 Y2 JP H0412689Y2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- center line
- leads
- external leads
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019078U JPH0412689Y2 (enrdf_load_stackoverflow) | 1987-02-12 | 1987-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019078U JPH0412689Y2 (enrdf_load_stackoverflow) | 1987-02-12 | 1987-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127141U JPS63127141U (enrdf_load_stackoverflow) | 1988-08-19 |
| JPH0412689Y2 true JPH0412689Y2 (enrdf_load_stackoverflow) | 1992-03-26 |
Family
ID=30813349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987019078U Expired JPH0412689Y2 (enrdf_load_stackoverflow) | 1987-02-12 | 1987-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412689Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-02-12 JP JP1987019078U patent/JPH0412689Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63127141U (enrdf_load_stackoverflow) | 1988-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7227198B2 (en) | Half-bridge package | |
| US6710463B2 (en) | Electrically isolated power semiconductor package | |
| EP0554742B1 (en) | Lead-on-chip semiconductor device | |
| US5920119A (en) | Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability | |
| US7250672B2 (en) | Dual semiconductor die package with reverse lead form | |
| US7884455B2 (en) | Semiconductor device | |
| EP1028520A1 (en) | Semiconductor device | |
| US5825082A (en) | Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package | |
| US20150194373A1 (en) | Semiconductor Packaging Arrangement | |
| US11309276B2 (en) | Semiconductor module | |
| JPH0878723A (ja) | 光結合器用パッケージ・リードフレームおよびその方法 | |
| EP0987762B1 (en) | Semiconductor module | |
| US20230352453A1 (en) | Semiconductor module | |
| JP2003017658A (ja) | 電力用半導体装置 | |
| US10964642B2 (en) | Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane | |
| US9373566B2 (en) | High power electronic component with multiple leadframes | |
| JP2801810B2 (ja) | 樹脂封止型半導体装置 | |
| JPH0412689Y2 (enrdf_load_stackoverflow) | ||
| US20230335460A1 (en) | Semiconductor module | |
| US7573107B2 (en) | Power module | |
| US20220406690A1 (en) | Semiconductor device | |
| JPH0451489Y2 (enrdf_load_stackoverflow) | ||
| JPH0622997Y2 (ja) | 絶縁物封止型半導体装置 | |
| US20240170454A1 (en) | Semiconductor device | |
| US12300562B2 (en) | Semiconductor module and semiconductor apparatus |