JPH0411347B2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a pressure sensor, and more specifically, it is attached to the palm or foot of a robot in order to improve its object grasping function and walking function. sense, pressure sense,
The present invention relates to a pressure sensor capable of recognizing a sensation corresponding to a sensation of slippage and a sensation of hardness.

[Prior art and its problems] A conventional pressure sensor of this type is configured as shown in FIG. A sweep/amplification unit includes a multiplexer 4, decoders 5 and 6, an amplifier 7, etc. and their circuits in order to sequentially take out and amplify the output signals from these sensor modules 2, and 8 is an A/D conversion unit. This is a signal processing section that has the functions of a microprocessor and has memory devices RAM and ROM, and performs calculations for correcting the above output signals and generates sweep signals.

Further, as shown in FIG. 3B, each sensor module 2 generally includes a plurality of pressure detection elements _G
G _Y and G _Z and output switches S _X1 , S _X2 , respectively
It further comprises S _Y1 , S _Y2 , S _Z1 , S _Z2 and a row switch S _M and a stage switch S _N , and such sensor modules 2 are arranged in a matrix in the pressure sensing part 1 and are arranged in a matrix as described above. A pressure sensor is configured.

In the pressure sensor configured as described above, the address signal from the signal processing section 8 causes the decoders 5 and 6 to select the column switch in the sensor module 2 at the address corresponding to the signal.
S _M and step switch S _N are selected and energized;
The output switches S _X1 , S _X2 , S _Y1 , S _Y2 , S _Z1 and S _Z2 are in the "on" state.

Furthermore, the multiplexer 4 is driven in the sweep/amplification section 3 by the output selection signal from the signal processing section 8, and one of the pressure detection elements G _X , G _Y , and G _Z in the sensor module 2 at the selected address is driven. The output signal from the designated element can be amplified via the amplifier 7 and input to the signal processing section 8 .

However, in such a conventional pressure sensor, although the pressure sensing section 1 (not shown in the figure) is generally attached to the palm or foot, the signal processing section 8 takes up its weight and mounting space. Therefore, the sweep/amplification section 3 provided between the signal processing section 8 and the pressure sensing section 1 is connected to the pressure sensing section 1.
If the wiring was placed far away from the wiring, there was a risk that external noise would be superimposed on the wiring between them. Further, since the number of wiring lines between them is large as shown in the example of FIG. 3A, there is a possibility that the operation may be hindered.

Furthermore, since a large number of sensor modules 2 are arranged in the pressure sensing section 1, if a defect or failure occurs in a part of the sensor module 2 during post-manufacturing inspection or during use, it is not easy to correct or partially replace it. .

[Object of the Invention] In view of the above-mentioned points, an object of the present invention is to eliminate the drawbacks and provide a configuration in which a block consisting of a plurality of sensor modules can be freely attached to and detached from a board on which a sweep/amplification section is arranged. By integrating the pressure sensing section and the sweep/amplification section, it is possible to not only prevent external noise from being superimposed on the wiring between them, but also to easily connect the An object of the present invention is to provide a pressure sensor that can be partially replaced.

[Summary of the Invention] In order to achieve the above object, according to the present invention,
A pressure sensor in which a plurality of sensor modules provided with pressure detection elements are arranged in a matrix, and a sweep/amplification circuit for selectively extracting output signals from the individual pressure detection elements of the sensor module is arranged. a plurality of upper circuit boards to which a plurality of sensor modules are arranged and attached in a row or in a matrix, connection pins provided on the lower surface of the upper circuit board for taking out output signals from the pressure detection elements, and the upper circuit board. a socket board on which a plurality of sockets can be mounted and removably arranged sockets corresponding to the connection pins; a lower circuit board provided on the lower surface of the socket board; and the sweep board mounted on the lower surface of the lower circuit board. a sweep/amplification board comprising an amplifier circuit and a case provided on the lower surface of the lower circuit board to cover the sweep/amplification circuit;
The plurality of upper circuit boards and the sweep/amplification board are electrically connected and integrated by the connection pins and the sockets.

[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described in detail and specifically based on the drawings.

FIG. 1 shows an embodiment of the invention, where 1
2 includes a plurality of pressure detection elements G _X , G _Y , and G _Z as shown in FIG. 3B, and an output switch.
_{S X1 , S _ _} is small, only a few millimeters.

A plurality of such sensor modules 12 are arranged and mounted on the upper circuit board 13, and as shown in FIG. It has a multilayer printed wiring section 13B on the bottom surface, and a connecting pin 14 is provided on the lower surface, and connects the wiring section 12A disposed on the sensor module 12 and the wiring section 13A on the upper circuit board 13. are electrically connected, for example, by soldering.

Further, the middle layer multilayer printed wiring section 13B is configured to aggregate the electric circuits drawn out from each of the plurality of sensor modules 12 attached to the upper part into the minimum number of circuits, and this aggregated circuit The output signal from the terminal is led to the connection pin 14.

A structure in which a plurality of sensor modules 12 are disposed on the upper circuit board 13 in this manner will be referred to as a sensor array 20 hereinafter. , a sweep/amplification board 30 containing the functional elements of the sweep/amplification section is provided.
The sensor array 20 is arranged and attached to the amplifier board 30 as shown in FIG.

Reference numeral 16 denotes a socket plate in which sockets 15 into which the connection pins 14 of the sensor array 20 are inserted are formed at positions corresponding to the pins 14, and the sweep/amplification board 30 is provided with the socket plate 16 on the upper layer thereof. Although not shown, the lower circuit board 17 attached to the lower surface of the socket board 16 in a laminated state is provided with a circuit as shown in FIG. 3A in the form of multilayer printed wiring, Electronic components 18 including sweep and amplification circuits such as a waver, a decoder, and an amplifier are mounted, and these electronic components 18 are electrically connected to the socket 15 through the circuits described above.

Reference numeral 19 denotes a case that is installed under the lower circuit board 17. The case 19 protects the electronic components 18 and circuits, and also serves as an attachment part to an attached body (not shown). Board 1
6. By inserting and mounting the connecting pin 14 of the sensor module 12 into the socket 15 of the sweep/amplification board 30 integrated by the lower circuit board 17 and case 19, the connection between the pressure sensing section and the sweep/amplification section is established. Not only can the wiring length between them be significantly shortened, but also the sensor module 12 can be attached/detached or replaced in units of the sensor array 20.

[Effects of the Invention] As described above, according to the present invention, a plurality of sensor modules provided with pressure detection elements are arranged in a matrix, and the output from each pressure detection element of the sensor module is A pressure sensor equipped with a sweep/amplification circuit for selectively extracting a signal, comprising: a plurality of upper circuit boards to which the plurality of sensor modules are arranged and attached in a row or in a matrix; and a plurality of upper circuit boards provided on the lower surface of the upper circuit board. a connecting pin for extracting an output signal from the pressure sensing element, a socket plate to which a plurality of the upper circuit boards can be attached and having sockets arranged in a detachable manner corresponding to the connecting pins; and a socket plate provided on the lower surface of the socket plate. a sweep/amplification board comprising a lower circuit board, the sweep/amplifier circuit mounted on the lower surface of the lower circuit board, and a case provided on the lower surface of the lower circuit board to cover the sweep/amplifier circuit; Ingredients,
Since the plurality of upper circuit boards and the sweep/amplification board are electrically connected and integrated by the connection pins and the socket, the pressure sensing section and the sweep/amplification circuit are integrated, and the wiring length between them can be reduced. Not only can it be shortened and prevent external noise from being superimposed on the wiring part, but since this type of wiring is not exposed to the outside, it does not interfere with the behavior of the robot's limbs. Furthermore, since the sensor array is designed to be easily attached and detached from the sweep/amplification board, defective sensor modules can be easily replaced in sensor array units during inspection or repair.

[Brief explanation of drawings]

FIG. 1 is a partially exploded perspective view showing an example of the configuration of the pressure sensor of the present invention, FIG. 2 is a cross-sectional view of the sensor array, and FIG. 3A is a diagram of a sensor output signal preprocessing device in a conventional pressure sensor. The circuit diagram, FIG. 3B, is a configuration diagram of an output signal extraction circuit in the sensor module. 1... Pressure sensing part, 2... Sensor module, 3...
...Sweep/amplification section, 4...Multiplexer, 5,
6...Decoder, 7...Amplifier, 8...Signal processing unit, _GX , _GY , _GZ ...Pressure detection element, _SX1 , _SX2 ,
S _Y1 , S _Y2 , S _Z1 , S _Z2 ... Output switch, S _M ... Row switch, S _N ... Stage switch, 12 ... Sensor module, 13 ... Upper circuit board, 12A, 13
A...Wiring section, 13B...Multilayer printed wiring section,
14... Connection pin, 15... Socket, 16...
socket board, 17...lower circuit board, 18...electronic component, 19...case, 20...sensor array,
30...Sweep/amplification board.

Claims (1)

[Claims] 1. A pressure sensor in which a plurality of sensor modules provided with pressure detection elements are arranged in a matrix, and a sweep/amplification circuit is arranged to selectively extract output signals from the individual pressure detection elements of the sensor module, a plurality of upper circuit boards to which the plurality of sensor modules are arranged and attached in a row or matrix, a connection pin provided on the lower surface of the upper circuit board for taking out an output signal from the pressure detection element, and the upper circuit A socket board to which a plurality of boards can be attached and in which sockets are arranged in a detachable manner corresponding to the connection pins, a lower circuit board provided on the lower surface of the socket board, and the sweep board mounted on the lower surface of the lower circuit board.・Amplification circuit and sweep・
a sweep/amplification board comprising a case provided on the lower surface of the lower circuit board to cover an amplifier circuit, and a plurality of upper circuit boards and the sweep/amplification board are connected by the connection pins and the socket A pressure sensor characterized by being electrically connected and integrated.