JPH04111764A - Method and device for polishing plate surface of strip - Google Patents

Abstract

PURPOSE:To cancel polishing resistances, generated in strip surfaces, each other through polishing rolls by providing constitution such that the strip surfaces are polished by rotating two-roll one set of polishing rolls in a reverse direction to each other. CONSTITUTION:When plate surfaces of a strip 1 in running are polished, polishing rolls(51a, 51b), (52a, 52b), constituted of at least two as one set, are used to rotate the one roll 51a of the rolls in a reverse direction to a running direction F of the strip 1 and the other one roll 52a in an equal direction to the running direction F of the strip 1. Next, a roll pressing down position is adjusted by a pressing down force adjuster 12 in such a manner that polishing resistance between the polishing roll 52a, rotated in the equal direction to this strip 1, and the strip 1 is obtained in an equal value to the polishing resistance of the polishing roll 51a rotated in the reverse direction to the strip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method and apparatus for polishing a strip surface.

<Prior Art> A conventional strip polishing apparatus in a continuous process line is constructed as shown in FIG. That is,
The strip l fed from the continuous process setup (ii2 is
A plurality of polishing rolls 5a and a back unroll 5b pass through the upstream priddle roll 3 and the tension meter 4.
The plate surface polishing device 5 consists of a polishing roll 5a and a polishing roll 5a.
After the plate surface is polished, it is sent to the next process equipment 7 via the downstream priddle roll 6.

In the continuous process equipment 2, since the stability of the strip tension directly affects the quality, it is necessary to keep the tension T at the input side of the upstream priddle roll 3 stable. On the other hand, when the strip 1 is polished with the polishing roll 5a, polishing resistance occurs, and its value varies greatly depending on the polishing conditions. This polishing resistance changes the tension of the strip 1 in contact with the polishing roll 5a, and changes the tension T2 on the upstream side thereof, and also the tension T on the upstream side thereof. Therefore, in order to keep the tension T1 stable, the strip tension T2 is detected by the tension meter 4 and the tension is controlled.

<Problems to be Solved by the Invention> In the conventional strip tension control method described above, even when the tension of the strip l is controlled using the tension meter 4, there is a delay between the fluctuation of the polishing resistance and the detection of the tension. When there is a drastic change in the polishing resistance, such as occurs during a transitional period when the polishing roll 5a starts to come into contact with the strip 1, there is a drawback that the tension fluctuation cannot be sufficiently suppressed. Furthermore, since it is necessary to install the tension meter 4, the equipment cost and installation space will increase.

In addition, if you try to control tension using this method, the tension control circuit will become complicated, so if you use it incorrectly, it may cause serious trouble, and the maintenance burden will also be large. It has the disadvantage of becoming.

Another problem is that this method cannot be used unless a tension applying device such as a priddle roll is provided before and after the plate polishing device.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method and apparatus for polishing a strip plate surface, which can polish the plate surface without a tension applying device. shall be.

<Means for Solving the Problems> In a first aspect of the present invention, when polishing the plate surface of a traveling strip, a set of at least two polishing rolls is used, and one of the rolls is used to polish the surface of the strip. The polishing resistance between the strip and the polishing roll rotates in the opposite direction to the running direction of the strip, and the other roll rotates in the same direction as the running direction of the strip, and the polishing roll rotates in the same direction as the strip. This is a method for polishing a plate surface of a strip, characterized in that the rolling position of the roll is adjusted so as to have the same resistance value as the polishing resistance of the polishing roll rotating in the opposite direction.

A second aspect of the present invention is an apparatus for polishing the plate surface of a traveling strip, which comprises a polishing roll made up of at least two polishing rolls, and these two polishing rolls being arranged in the running direction of the strip. drive motors that rotate the drive motors in opposite directions, a power detector that detects input power supplied to these drive motors, a pulse transmitter that detects the number of rotations of the drive motors, and these power detectors and pulse transmitters. a polishing resistance calculation means for calculating the polishing resistance between the polishing roll and the strip in response to a detection signal from the polishing resistance calculation means; a comparison calculation means for comparing and calculating the polishing resistance values obtained by the polishing resistance calculation means; A strip surface polishing apparatus is characterized in that it comprises a rolling force regulator that adjusts the rolling position of a polishing roll rotating in the same direction as the running direction of the ST+J tube based on the result of comparison calculation.

According to the present invention, at least two polishing rolls of 1 iJl are rotated in opposite directions to polish the surface of the strip, thereby reducing the polishing resistance generated on the surface of the strip by the polishing rolls. can be compensated for, thus making it possible to always keep the tension in the strip at a predetermined value.

<Examples> Examples of the present invention will be described in detail below with reference to open views.

The first flash is a professional diagram showing the configuration of an embodiment of the present invention.

This is a diagram.

Polish the surface of the strip l as shown in the figure! The plate surface polishing apparatus 5A provided for this purpose is composed of at least 1&12 polishing rolls 51a, 52a, and hack-up rolls 51b, 52b are attached to each.

These polishing rolls 51a and 52a are moved in opposite directions by drive motors 51c and 52c, that is, the polishing roll 51a is moved in the direction of arrow R opposite to the running direction of the strip 1, and the polishing roll 52a is moved in the direction of the arrow R opposite to the running direction of the strip 1.
The strip 1 is rotated in the same direction as the running direction of the strip 1, and the force with which it is pressed against the strip 1 is adjusted by the rolling position adjustment devices ff51d and 52d.

The input powers P, , P2 of the drive motors 51c, 52c are detected by the power detectors 8a, 8b, respectively, and the rotational speeds N, , N, of the drive motors 51c, 52c are detected by the pulse generator 9a.
, 9b, and these detection signals are input to respective polishing resistance calculators 10a, 10b to calculate polishing resistances F□ and FIK.

The calculated polishing resistances F□ and Fll□ are input to the comparison calculation circuit 11 and are compared and calculated, and the reduction position adjustment device 52d on the polishing roll 52a side is adjusted according to the difference via the reduction force regulator 12. The pressing force of the polishing roll 52b is adjusted so that the polishing resistance is the same.

For the reduction blade on the polishing roll 51a side, the signal F1 detected by the polishing resistance calculator 10a and the desired setting value F++ set by the polishing resistance setting device 14.

By comparing the difference between the
The polishing resistance is controlled to always be constant.

Next, the operation of the plate surface polishing apparatus 5A configured as described above will be explained.

2 As shown in the figure, the strip 1 is assumed to move in the direction of arrow F, the rotation direction of one polishing roll 51a is in the direction of arrow R, and the rotation direction of one polishing roll 51a is in the direction of arrow R, and the rotation direction of one polishing roll 51a is in the direction of arrow R.
The direction of rotation is assumed to be the F direction. At this time, the polishing roll 5
It is assumed that the pressing force F PI (kgf) of 1a to the strip l is set by the roll-down force setting device 13 via the roll-down position adjustment device 51d.

■ Next, the input power P+(k1'l) of the drive motors 51c and 52c detected by the power detectors 8a and 8b
, Pg (k) and the rotational speed N (11
M)+Nz (rp+w) are input to polishing resistance calculators 10a and 1Ob, respectively, and respective polishing resistances F□(kgf) and F*□(kgf) are calculated using the following formulas.

FRI8=:974 X (P + Pt+)/(
N1 ・r, ) --(1)F R2ζ
974 x (Pt-pL□)/(N2 ・r, )
---42) Here, PLl+ pL
t is the power loss (kW) of the drive motors 51c, 52c and their mechanical systems, and r is the radius (m) of each of the polishing rolls 51a, 51b.

■ Furthermore, in the comparison calculation circuit 11, each polishing roll 5
Difference ΔF between polishing resistances Flll and Fl12 of 1a and 51b
.

Perform a comparison operation. At this time, the drive motor 51c.

The rotational speed of the polishing rolls 52c is the same, that is, Nz=N+, and the radius of the polishing rolls 51a and 51b is the same, rz=r.)
Then, the polishing resistance difference ΔFll is expressed by the following equation (3).

ΔFl =F,, -F□=k・ ((p, -PLI)
(P! P Lri] ””'--・-----
-(3) where k ==974/(NI-r I
)■ And then, the reduction blade comes from the comparison calculation circuit 11! When a signal corresponding to the polishing resistance difference ΔF obtained by equation (3) is output to the l1 moderator 12, the rolling position on the polishing roll 52b side is adjusted by the control signal output from the rolling force regulator 12. The pressing position of the device 52d is adjusted to adjust the pressing force F pg (kgf) of the polishing roll 52b.

As a result, the polishing resistance FII of the polishing roll 51b! is the same as the polishing resistance F□ of the polishing roll 51a, and the difference ΔF is
, but the tension of the strip 1c does not change at all.

Note that the surface polishing apparatus 5A in the above-mentioned embodiment has 2
Although the explanation has been made assuming that the polishing rolls 1 & [l are rotated in opposite directions, the present invention is not limited to this. For example, as shown in FIG. A surface polishing device 5 configured to provide two sets of polishing rolls 51a, 52a and 53a, 54a in opposite directions.
It may also be B.

The positional relationship between the mat and -1 polishing roll 51 and the handle unbroil 52 does not necessarily have to be limited to the same direction,
For example, as shown in Figures 3(a) and (b), two
One polishing roll 51a of the set is rotated in the direction of arrow R with the polishing roll 51a above the line, and the other polishing roll 51a is rotated in the direction of arrow R.
The operation and effect are the same even if the surface polishing device 5C is configured to rotate in the direction of arrow F with 1b facing downward, and similarly, as shown in FIG. 3(b), two sets of polishing rolls are used. 5
The surface polishing device 5D may be configured such that 1a, 52a, and 53a54a are placed in a vertical relationship and rotated in opposite directions.

<Effects of the Invention> As explained above, according to the present invention, the surface of the strip is polished by rotating at least two gI polishing rolls in opposite directions, so that the surface of the strip is polished by the polishing roll. This makes it possible to offset the polishing resistance that occurs in the strip, thereby making it possible to maintain the tension of the strip at a predetermined value.Therefore, there is no need to install a tensioning device such as a priddle roll, and there is no need for complicated tension control. This makes it possible to simplify the process, contributing to savings in equipment costs and maintenance.

Furthermore, if polishing is always performed using a plurality of rolls, the motor capacity can be reduced by reducing the load per drive motor for the polishing rolls, so that savings such as energy saving can be expected.

Furthermore, since the same surface of the strip can be polished in both forward and reverse directions, it can be expected that the properties of the strip surface will be improved.

[Brief explanation of drawings]

Fig. 1 is a block diagram showing the configuration of one embodiment of the present invention, Fig. 2 is a block diagram showing another embodiment of the plate polishing apparatus, and Figs. 3(a) and 3(b) are the plate polishing apparatus. FIG. 4 is a side view showing an example of a continuous process line having a conventional plate surface polishing apparatus. p,,p,...Input power r PLl, PLl
... Power loss + rl + r2 ... Radius of polishing roll. 1...Strip, 5A, 5B, 5C, 5D.
...Plate surface polishing device, 8a, 8b...Power detector 9a, 9b...Pulse transmitter, lOa, lOb
... Polishing resistance calculator (polishing resistance calculating means), 11...
Comparison calculation means (comparison calculation means), 12... Reduction force regulator, 13... Reduction force setting device, 14... Polishing resistance setting device, 51a, 52a, 53a, 54a.
...Polishing roll. 51b, 52b, 53b, 54b... Backup rolls 51c, 52c... Drive motor, 51
d, 52d... Lowering position adjustment device + FIIl,
F++z...polishing resistance, FpHFpz...
Pressing force, I'L, Nz... Number of revolutions.

Claims (1)

[Claims] 1. When polishing the surface of a running strip, a set of at least two polishing rolls is used, one of which is rotated in the opposite direction to the running direction of the strip. , the other one rotates in the same direction as the running direction of the strip, and the polishing resistance between the polishing roll and the strip rotates in the same direction as the strip, and the polishing roll rotates in the opposite direction to the strip. A method for polishing a plate surface of a strip, characterized in that the roll pressure position is adjusted so as to have the same value as the resistance. 2. A device for polishing the plate surface of a running strip, comprising a set of at least two polishing rolls, and a drive for rotating these two polishing rolls in directions opposite to each other with respect to the running direction of the strip. a motor, a power detector that detects the input power supplied to these drive motors, a pulse transmitter that detects the number of rotations of the drive motor, and the polishing according to the detection signals from the power detector and the pulse transmitter. A polishing resistance calculation means for calculating the polishing resistance between the roll and the strip, a comparison calculation means for comparing and calculating the polishing resistance values obtained by these polishing resistance calculation means, and a comparison calculation means for calculating the polishing resistance values obtained by the polishing resistance calculation means, and a running speed of the strip based on the result of this comparison calculation. 1. An apparatus for polishing a strip plate surface, comprising: a rolling force adjuster for adjusting the rolling position of a polishing roll rotating in the same direction as the polishing roll.