JPH0394445A - Semiconductor wafer transfer system - Google Patents

Semiconductor wafer transfer system

Info

Publication number
JPH0394445A
JPH0394445A JP23219989A JP23219989A JPH0394445A JP H0394445 A JPH0394445 A JP H0394445A JP 23219989 A JP23219989 A JP 23219989A JP 23219989 A JP23219989 A JP 23219989A JP H0394445 A JPH0394445 A JP H0394445A
Authority
JP
Japan
Prior art keywords
wafer
temperature
transfer device
semiconductor wafer
keeps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23219989A
Inventor
Kouichirou Tsutahara
Toru Yamaguchi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23219989A priority Critical patent/JPH0394445A/en
Publication of JPH0394445A publication Critical patent/JPH0394445A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To reduce foreign bodies adhering to the surface of a semiconductor wafer by installing a transfer device which transports the semiconductor wafer while a temperature of the wafer is being kept at a high temperature; and a wafer stocker which holds the semiconductor wafer while the temperature of the wafer is being kept at the high temperature.
CONSTITUTION: In a transfer device 3 which transfers a wafer 2 to individual treatment devices 1, one route of the transfer device is formed as a module; a transfer operation between modules is executed by using another intermodule transfer device 4. A wafer stocker 5 which temporarily keeps the wafer is provided at an entrance of the module to execute the transfer operation smoothly; a clean bench 6 is provided at the upper part of the wafer stocker 5. That is to say, the following are provided: the transfer device 3 which keeps a temperature of the semiconductor wafer 2 at a temperature higher than an ambient temperature and which transports the wafer 2; and the wafer stocker 5 which keeps the temperature of the semiconductor wafer 2 at the temperature higher than the ambient temperature and which keeps the wafer 2. Thereby, it is possible to prevent a foreign body from adhering as far as possible in a wafer transfer system and to enhance yield during manufacturing operation of the wafer at a low cost and surely.
COPYRIGHT: (C)1991,JPO&Japio
JP23219989A 1989-09-06 1989-09-06 Semiconductor wafer transfer system Pending JPH0394445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23219989A JPH0394445A (en) 1989-09-06 1989-09-06 Semiconductor wafer transfer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23219989A JPH0394445A (en) 1989-09-06 1989-09-06 Semiconductor wafer transfer system

Publications (1)

Publication Number Publication Date
JPH0394445A true JPH0394445A (en) 1991-04-19

Family

ID=16935542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23219989A Pending JPH0394445A (en) 1989-09-06 1989-09-06 Semiconductor wafer transfer system

Country Status (1)

Country Link
JP (1) JPH0394445A (en)

Cited By (14)

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JP2005354025A (en) * 2004-05-13 2005-12-22 Tokyo Electron Ltd Substrate transfer mechanism, substrate transfer equipment including the same, particles removing method for substrate transfer mechanism, particles removing method for substrate transfer equipment, program for executing its method, and storage medium
JP2007227626A (en) * 2006-02-23 2007-09-06 Tokyo Electron Ltd System and method for processing substrate, and storage medium
JP2008507848A (en) * 2004-07-23 2008-03-13 株式会社ニコン Extreme ultraviolet reticle protection
WO2008093787A1 (en) * 2007-01-31 2008-08-07 Tokyo Electron Limited Substrate treating apparatus and method of preventing particle adhesion
JP2010194685A (en) * 2009-02-26 2010-09-09 Tokyo Electron Ltd Working table
JP2015079779A (en) * 2013-10-15 2015-04-23 東京エレクトロン株式会社 Heat treatment method and heat treatment device
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method

Cited By (21)

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Publication number Priority date Publication date Assignee Title
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
JP2005354025A (en) * 2004-05-13 2005-12-22 Tokyo Electron Ltd Substrate transfer mechanism, substrate transfer equipment including the same, particles removing method for substrate transfer mechanism, particles removing method for substrate transfer equipment, program for executing its method, and storage medium
JP4623715B2 (en) * 2004-05-13 2011-02-02 東京エレクトロン株式会社 Substrate transfer apparatus comprising the substrate transfer mechanism and the substrate transfer mechanism
JP2008507848A (en) * 2004-07-23 2008-03-13 株式会社ニコン Extreme ultraviolet reticle protection
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP2007227626A (en) * 2006-02-23 2007-09-06 Tokyo Electron Ltd System and method for processing substrate, and storage medium
US8950999B2 (en) 2007-01-31 2015-02-10 Tokyo Electron Limited Substrate processing apparatus and particle adhesion preventing method
JP2008211196A (en) * 2007-01-31 2008-09-11 Tokyo Electron Ltd Device for treating substrate and method of preventing adhesion of particles
WO2008093787A1 (en) * 2007-01-31 2008-08-07 Tokyo Electron Limited Substrate treating apparatus and method of preventing particle adhesion
TWI423371B (en) * 2007-01-31 2014-01-11 Tokyo Electron Ltd
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP2010194685A (en) * 2009-02-26 2010-09-09 Tokyo Electron Ltd Working table
JP2015079779A (en) * 2013-10-15 2015-04-23 東京エレクトロン株式会社 Heat treatment method and heat treatment device

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