JPH0382770A - Elecrtroless plating device - Google Patents

Elecrtroless plating device

Info

Publication number
JPH0382770A
JPH0382770A JP21935389A JP21935389A JPH0382770A JP H0382770 A JPH0382770 A JP H0382770A JP 21935389 A JP21935389 A JP 21935389A JP 21935389 A JP21935389 A JP 21935389A JP H0382770 A JPH0382770 A JP H0382770A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
vessel
plated
electroless
evacuating
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21935389A
Inventor
Kenji Goto
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/422Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Abstract

PURPOSE: To rapidly exhaust generated reactive gas from a vessel contg. an electroless plating soln. and to easily and surely form a nearly uniform plating layer even on the inside of each fine through hole by evacuating the internal space of the vessel with an evacuating means.
CONSTITUTION: Printed circuit boards 3 as bodies to be plated are set in a basket 4, immersed in an electroless plating soln. 1 in a vessel 5 and electroless- plated. At this time, an evacuating means 6 composed of a lid 6a and a pipe 6b is fitted to the vessel 5 and the space 5a on the plating soln. 1 is evacuated with the means 6. Reactive gas generated during electroless plating is rapidly exhausted from the vessel 5 and the sticking and remaining of the gas on the bodies 3 to be plated are prevented. A nearly uniform plating layer can be formed even on the inside of each through hole of about ≤0.4 mm diameter.
COPYRIGHT: (C)1991,JPO&Japio
JP21935389A 1989-08-25 1989-08-25 Elecrtroless plating device Pending JPH0382770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21935389A JPH0382770A (en) 1989-08-25 1989-08-25 Elecrtroless plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21935389A JPH0382770A (en) 1989-08-25 1989-08-25 Elecrtroless plating device

Publications (1)

Publication Number Publication Date
JPH0382770A true true JPH0382770A (en) 1991-04-08

Family

ID=16734112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21935389A Pending JPH0382770A (en) 1989-08-25 1989-08-25 Elecrtroless plating device

Country Status (1)

Country Link
JP (1) JPH0382770A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0743812A1 (en) * 1994-12-01 1996-11-20 Ibiden Co, Ltd. Multilayer printed wiring board and process for producing the same
JP2003106066A (en) * 2001-09-27 2003-04-09 Fukuvi Chem Ind Co Ltd Sound insulation structure of door and door sound insulating member used therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0743812A1 (en) * 1994-12-01 1996-11-20 Ibiden Co, Ltd. Multilayer printed wiring board and process for producing the same
EP0743812A4 (en) * 1994-12-01 1999-05-06 Ibiden Co Ltd Multilayer printed wiring board and process for producing the same
JP2003106066A (en) * 2001-09-27 2003-04-09 Fukuvi Chem Ind Co Ltd Sound insulation structure of door and door sound insulating member used therefor

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