JPH0381627U - - Google Patents

Info

Publication number
JPH0381627U
JPH0381627U JP14331389U JP14331389U JPH0381627U JP H0381627 U JPH0381627 U JP H0381627U JP 14331389 U JP14331389 U JP 14331389U JP 14331389 U JP14331389 U JP 14331389U JP H0381627 U JPH0381627 U JP H0381627U
Authority
JP
Japan
Prior art keywords
chamfered
center
periphery
corners
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14331389U
Other languages
English (en)
Japanese (ja)
Other versions
JPH071793Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989143313U priority Critical patent/JPH071793Y2/ja
Publication of JPH0381627U publication Critical patent/JPH0381627U/ja
Application granted granted Critical
Publication of JPH071793Y2 publication Critical patent/JPH071793Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP1989143313U 1989-12-11 1989-12-11 半導体ウエハの面取り構造 Expired - Lifetime JPH071793Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989143313U JPH071793Y2 (ja) 1989-12-11 1989-12-11 半導体ウエハの面取り構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989143313U JPH071793Y2 (ja) 1989-12-11 1989-12-11 半導体ウエハの面取り構造

Publications (2)

Publication Number Publication Date
JPH0381627U true JPH0381627U (US20020051482A1-20020502-M00012.png) 1991-08-21
JPH071793Y2 JPH071793Y2 (ja) 1995-01-18

Family

ID=31690090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989143313U Expired - Lifetime JPH071793Y2 (ja) 1989-12-11 1989-12-11 半導体ウエハの面取り構造

Country Status (1)

Country Link
JP (1) JPH071793Y2 (US20020051482A1-20020502-M00012.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463111A (zh) * 2020-05-06 2020-07-28 哈尔滨科友半导体产业装备与技术研究院有限公司 一种边缘便于识别的无损单晶片及其标记方法和专用砂轮

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144831A (ja) * 1984-12-18 1986-07-02 Nec Kansai Ltd 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144831A (ja) * 1984-12-18 1986-07-02 Nec Kansai Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463111A (zh) * 2020-05-06 2020-07-28 哈尔滨科友半导体产业装备与技术研究院有限公司 一种边缘便于识别的无损单晶片及其标记方法和专用砂轮

Also Published As

Publication number Publication date
JPH071793Y2 (ja) 1995-01-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term