JPH0379474U - - Google Patents

Info

Publication number

JPH0379474U

JPH0379474U JP13942989U JP13942989U JPH0379474U JP H0379474 U JPH0379474 U JP H0379474U JP 13942989 U JP13942989 U JP 13942989U JP 13942989 U JP13942989 U JP 13942989U JP H0379474 U JPH0379474 U JP H0379474U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

component

printed

lead

Prior art date

1989-11-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000001035 drying Methods 0.000 claims 1
• 238000005187 foaming Methods 0.000 claims 1
• 239000000126 substance Substances 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 2
• 230000006378 damage Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000008646 thermal stress Effects 0.000 description 1

Cited By (1)