JPH0379428U - - Google Patents
Info
- Publication number
- JPH0379428U JPH0379428U JP14046189U JP14046189U JPH0379428U JP H0379428 U JPH0379428 U JP H0379428U JP 14046189 U JP14046189 U JP 14046189U JP 14046189 U JP14046189 U JP 14046189U JP H0379428 U JPH0379428 U JP H0379428U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- conductive film
- anisotropic conductive
- support shaft
- metal cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046189U JPH0719144Y2 (ja) | 1989-12-04 | 1989-12-04 | 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14046189U JPH0719144Y2 (ja) | 1989-12-04 | 1989-12-04 | 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0379428U true JPH0379428U (US07922777-20110412-C00004.png) | 1991-08-13 |
| JPH0719144Y2 JPH0719144Y2 (ja) | 1995-05-01 |
Family
ID=31687436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14046189U Expired - Lifetime JPH0719144Y2 (ja) | 1989-12-04 | 1989-12-04 | 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719144Y2 (US07922777-20110412-C00004.png) |
-
1989
- 1989-12-04 JP JP14046189U patent/JPH0719144Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719144Y2 (ja) | 1995-05-01 |
