JPH0378225B2 - - Google Patents
Info
- Publication number
- JPH0378225B2 JPH0378225B2 JP17816886A JP17816886A JPH0378225B2 JP H0378225 B2 JPH0378225 B2 JP H0378225B2 JP 17816886 A JP17816886 A JP 17816886A JP 17816886 A JP17816886 A JP 17816886A JP H0378225 B2 JPH0378225 B2 JP H0378225B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wires
- lead wire
- gripping
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 238000005452 bending Methods 0.000 claims description 19
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17816886A JPS6334079A (ja) | 1986-07-29 | 1986-07-29 | 電子部品のリ−ド線折曲加工用ペンチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17816886A JPS6334079A (ja) | 1986-07-29 | 1986-07-29 | 電子部品のリ−ド線折曲加工用ペンチ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6334079A JPS6334079A (ja) | 1988-02-13 |
| JPH0378225B2 true JPH0378225B2 (enrdf_load_stackoverflow) | 1991-12-13 |
Family
ID=16043802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17816886A Granted JPS6334079A (ja) | 1986-07-29 | 1986-07-29 | 電子部品のリ−ド線折曲加工用ペンチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6334079A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102752304B1 (ko) * | 2023-10-25 | 2025-01-10 | 한화시스템 주식회사 | 리드 가공 장치 및 방법 |
-
1986
- 1986-07-29 JP JP17816886A patent/JPS6334079A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6334079A (ja) | 1988-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |