JPH0377488U - - Google Patents

Info

Publication number

JPH0377488U

JPH0377488U JP13902989U JP13902989U JPH0377488U JP H0377488 U JPH0377488 U JP H0377488U JP 13902989 U JP13902989 U JP 13902989U JP 13902989 U JP13902989 U JP 13902989U JP H0377488 U JPH0377488 U JP H0377488U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

electronic component

hole

bending

Prior art date

1989-11-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002184 metal Substances 0.000 claims description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• 238000005452 bending Methods 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 1

Cited By (2)