JPH0375557U - - Google Patents
Info
- Publication number
- JPH0375557U JPH0375557U JP13754389U JP13754389U JPH0375557U JP H0375557 U JPH0375557 U JP H0375557U JP 13754389 U JP13754389 U JP 13754389U JP 13754389 U JP13754389 U JP 13754389U JP H0375557 U JPH0375557 U JP H0375557U
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- substrate
- insulating substrate
- substrate via
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 13
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13754389U JPH0375557U (cs) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13754389U JPH0375557U (cs) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375557U true JPH0375557U (cs) | 1991-07-29 |
Family
ID=31684695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13754389U Pending JPH0375557U (cs) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375557U (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007861A1 (ja) * | 2005-07-07 | 2007-01-18 | Ibiden Co., Ltd. | 多層プリント配線板 |
| KR100900671B1 (ko) * | 2007-11-06 | 2009-06-01 | 삼성전기주식회사 | 다층 배선 기판에 사용되는 도전성 비아 형성 방법 |
| JP2010034258A (ja) * | 2008-07-29 | 2010-02-12 | Kyocera Corp | 配線基板、実装構造体及び配線基板の製造方法 |
-
1989
- 1989-11-27 JP JP13754389U patent/JPH0375557U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007007861A1 (ja) * | 2005-07-07 | 2007-01-18 | Ibiden Co., Ltd. | 多層プリント配線板 |
| KR100900671B1 (ko) * | 2007-11-06 | 2009-06-01 | 삼성전기주식회사 | 다층 배선 기판에 사용되는 도전성 비아 형성 방법 |
| JP2010034258A (ja) * | 2008-07-29 | 2010-02-12 | Kyocera Corp | 配線基板、実装構造体及び配線基板の製造方法 |