JPH0375544U - - Google Patents
Info
- Publication number
- JPH0375544U JPH0375544U JP1989135401U JP13540189U JPH0375544U JP H0375544 U JPH0375544 U JP H0375544U JP 1989135401 U JP1989135401 U JP 1989135401U JP 13540189 U JP13540189 U JP 13540189U JP H0375544 U JPH0375544 U JP H0375544U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- plate
- flange
- substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135401U JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135401U JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375544U true JPH0375544U (US06623731-20030923-C00012.png) | 1991-07-29 |
| JPH0648870Y2 JPH0648870Y2 (ja) | 1994-12-12 |
Family
ID=31682671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135401U Expired - Lifetime JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648870Y2 (US06623731-20030923-C00012.png) |
-
1989
- 1989-11-24 JP JP1989135401U patent/JPH0648870Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648870Y2 (ja) | 1994-12-12 |
