JPH0373455U - - Google Patents

Info

Publication number

JPH0373455U

JPH0373455U JP13435289U JP13435289U JPH0373455U JP H0373455 U JPH0373455 U JP H0373455U JP 13435289 U JP13435289 U JP 13435289U JP 13435289 U JP13435289 U JP 13435289U JP H0373455 U JPH0373455 U JP H0373455U

Authority

JP

Japan

Prior art keywords

resin

semiconductor device

semiconductor chip

encapsulated

forming

Prior art date

1989-11-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229920005989 resin Polymers 0.000 claims description 12
• 239000011347 resin Substances 0.000 claims description 12
• 239000004065 semiconductor Substances 0.000 claims description 11
• 238000007789 sealing Methods 0.000 claims description 4
• 239000003822 epoxy resin Substances 0.000 claims 1
• 239000000463 material Substances 0.000 claims 1
• 229920000647 polyepoxide Polymers 0.000 claims 1
• 229920002050 silicone resin Polymers 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1