JPH0369269U - - Google Patents

Info

Publication number

JPH0369269U

JPH0369269U JP13189789U JP13189789U JPH0369269U JP H0369269 U JPH0369269 U JP H0369269U JP 13189789 U JP13189789 U JP 13189789U JP 13189789 U JP13189789 U JP 13189789U JP H0369269 U JPH0369269 U JP H0369269U

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

electrodes

leadless component

soldering

Prior art date

1989-11-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)