JPH0369248A - Telephone set - Google Patents

Telephone set

Info

Publication number
JPH0369248A
JPH0369248A JP20621789A JP20621789A JPH0369248A JP H0369248 A JPH0369248 A JP H0369248A JP 20621789 A JP20621789 A JP 20621789A JP 20621789 A JP20621789 A JP 20621789A JP H0369248 A JPH0369248 A JP H0369248A
Authority
JP
Japan
Prior art keywords
reader
telephone
dialing
telephone number
input device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20621789A
Inventor
Minoru Kataoka
Original Assignee
Nec Off Syst Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Off Syst Ltd filed Critical Nec Off Syst Ltd
Priority to JP20621789A priority Critical patent/JPH0369248A/en
Publication of JPH0369248A publication Critical patent/JPH0369248A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To perform an accurate dialing operation in a short period by using a reader to read the telephone number printed on a visiting card and converting read data to a numerical value to automatically dial a telephone.
CONSTITUTION: A telephone system consists of a ten-key input device A, a reader C which reads the telephone number printed on a visiting card, a decoder B which decodes data fetched by the reader, a whole control device D which controls the input of the ten-key input device A and the decoder B, and a dialing device which controls dialing based on the inputted telephone number. When an operator performs the input operation and the reader is used as the input device, read data is converted to a numerical value to dial the telephone.
COPYRIGHT: (C)1991,JPO&Japio
JP20621789A 1989-08-08 1989-08-08 Telephone set Pending JPH0369248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20621789A JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20621789A JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Publications (1)

Publication Number Publication Date
JPH0369248A true JPH0369248A (en) 1991-03-25

Family

ID=16519708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20621789A Pending JPH0369248A (en) 1989-08-08 1989-08-08 Telephone set

Country Status (1)

Country Link
JP (1) JPH0369248A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208023B1 (en) 1997-07-31 2001-03-27 Matsushita Electronics Corporation Lead frame for use with an RF powered semiconductor
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
JP2005123383A (en) * 2003-10-16 2005-05-12 Asahi Kasei Electronics Co Ltd Electromagnetic transducer element
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208023B1 (en) 1997-07-31 2001-03-27 Matsushita Electronics Corporation Lead frame for use with an RF powered semiconductor
US7786554B2 (en) 2000-09-13 2010-08-31 Carsem (M) Sdn. Bhd. Stress-free lead frame
US6867483B2 (en) 2000-09-13 2005-03-15 Carsen Semiconductor Sdn. Bhd. Stress-free lead frame
US7288833B2 (en) 2000-09-13 2007-10-30 Carsem (M) Sdn. Bhd. Stress-free lead frame
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
JP2005123383A (en) * 2003-10-16 2005-05-12 Asahi Kasei Electronics Co Ltd Electromagnetic transducer element
US6977431B1 (en) 2003-11-05 2005-12-20 Amkor Technology, Inc. Stackable semiconductor package and manufacturing method thereof
US7741161B2 (en) 2003-12-31 2010-06-22 Carsem (M) Sdn. Bhd. Method of making integrated circuit package with transparent encapsulant
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

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