JPH0369246U - - Google Patents
Info
- Publication number
- JPH0369246U JPH0369246U JP1989130589U JP13058989U JPH0369246U JP H0369246 U JPH0369246 U JP H0369246U JP 1989130589 U JP1989130589 U JP 1989130589U JP 13058989 U JP13058989 U JP 13058989U JP H0369246 U JPH0369246 U JP H0369246U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- semiconductor chip
- resin
- solder
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims 8
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130589U JPH069518Y2 (ja) | 1989-11-10 | 1989-11-10 | 樹脂封止形半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130589U JPH069518Y2 (ja) | 1989-11-10 | 1989-11-10 | 樹脂封止形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0369246U true JPH0369246U (US07714131-20100511-C00038.png) | 1991-07-09 |
| JPH069518Y2 JPH069518Y2 (ja) | 1994-03-09 |
Family
ID=31678155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989130589U Expired - Lifetime JPH069518Y2 (ja) | 1989-11-10 | 1989-11-10 | 樹脂封止形半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069518Y2 (US07714131-20100511-C00038.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066717A (ja) * | 2004-08-27 | 2006-03-09 | Fuji Electric Holdings Co Ltd | 半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2485033C9 (ru) | 2007-12-10 | 2013-09-10 | Астразенека Аб | Колпачок пробирки 187 |
-
1989
- 1989-11-10 JP JP1989130589U patent/JPH069518Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006066717A (ja) * | 2004-08-27 | 2006-03-09 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP4572627B2 (ja) * | 2004-08-27 | 2010-11-04 | 富士電機システムズ株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069518Y2 (ja) | 1994-03-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |