JPH0365666B2 - - Google Patents

Info

Publication number
JPH0365666B2
JPH0365666B2 JP57011958A JP1195882A JPH0365666B2 JP H0365666 B2 JPH0365666 B2 JP H0365666B2 JP 57011958 A JP57011958 A JP 57011958A JP 1195882 A JP1195882 A JP 1195882A JP H0365666 B2 JPH0365666 B2 JP H0365666B2
Authority
JP
Japan
Prior art keywords
light
receiving element
integrated circuit
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57011958A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58128762A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57011958A priority Critical patent/JPS58128762A/ja
Publication of JPS58128762A publication Critical patent/JPS58128762A/ja
Publication of JPH0365666B2 publication Critical patent/JPH0365666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Wire Bonding (AREA)
JP57011958A 1982-01-27 1982-01-27 半導体装置 Granted JPS58128762A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57011958A JPS58128762A (ja) 1982-01-27 1982-01-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57011958A JPS58128762A (ja) 1982-01-27 1982-01-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS58128762A JPS58128762A (ja) 1983-08-01
JPH0365666B2 true JPH0365666B2 (enrdf_load_stackoverflow) 1991-10-14

Family

ID=11792121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57011958A Granted JPS58128762A (ja) 1982-01-27 1982-01-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS58128762A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1267468C (en) * 1983-11-21 1990-04-03 OPTICS MOUNTING
JPH02277273A (ja) * 1989-04-18 1990-11-13 Fujitsu Ltd 光検知装置
JPH03259571A (ja) * 1990-03-08 1991-11-19 Fujitsu Ltd 光検知装置
US5418566A (en) * 1990-09-10 1995-05-23 Kabushiki Kaisha Toshiba Compact imaging apparatus for electronic endoscope with improved optical characteristics
US6351027B1 (en) * 2000-02-29 2002-02-26 Agilent Technologies, Inc. Chip-mounted enclosure
FR2819940B1 (fr) * 2001-01-22 2003-10-17 St Microelectronics Sa Procede de fabrication d'un boitier semi-conducteur optique et boitier semi-conducteur optique
JP2002329873A (ja) * 2001-05-01 2002-11-15 Mitsubishi Electric Corp 半導体モジュールおよび半導体装置
JP4191954B2 (ja) * 2002-05-17 2008-12-03 富士フイルム株式会社 撮像素子実装構造および撮像装置
FR3081257B1 (fr) * 2018-05-18 2020-07-31 St Microelectronics Grenoble 2 Circuit d'emission/reception optique
FR3081256B1 (fr) 2018-05-18 2020-07-31 St Microelectronics Grenoble 2 Circuit d'emission/reception optique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650008Y2 (enrdf_load_stackoverflow) * 1976-08-31 1981-11-24
JPS5624752Y2 (enrdf_load_stackoverflow) * 1976-08-31 1981-06-11

Also Published As

Publication number Publication date
JPS58128762A (ja) 1983-08-01

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