JPH0359106B2 - - Google Patents
Info
- Publication number
- JPH0359106B2 JPH0359106B2 JP60180131A JP18013185A JPH0359106B2 JP H0359106 B2 JPH0359106 B2 JP H0359106B2 JP 60180131 A JP60180131 A JP 60180131A JP 18013185 A JP18013185 A JP 18013185A JP H0359106 B2 JPH0359106 B2 JP H0359106B2
- Authority
- JP
- Japan
- Prior art keywords
- imide resin
- addition
- resin prepolymer
- type imide
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18013185A JPS6241262A (ja) | 1985-08-15 | 1985-08-15 | 付加型イミド樹脂プレポリマ−組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18013185A JPS6241262A (ja) | 1985-08-15 | 1985-08-15 | 付加型イミド樹脂プレポリマ−組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6241262A JPS6241262A (ja) | 1987-02-23 |
| JPH0359106B2 true JPH0359106B2 (cs) | 1991-09-09 |
Family
ID=16077953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18013185A Granted JPS6241262A (ja) | 1985-08-15 | 1985-08-15 | 付加型イミド樹脂プレポリマ−組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6241262A (cs) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5510605B2 (cs) * | 1972-05-16 | 1980-03-18 | ||
| JPS5116800B2 (cs) * | 1973-12-17 | 1976-05-27 | ||
| JPS569938A (en) * | 1979-07-03 | 1981-01-31 | Mitsubishi Electric Corp | Dust remover for cathode-ray tube |
| JPS5952557B2 (ja) * | 1981-09-29 | 1984-12-20 | 日立化成工業株式会社 | 印刷配線板の製造法 |
| JPS5941314B2 (ja) * | 1981-09-30 | 1984-10-05 | 株式会社東芝 | 酸化物圧電材料 |
-
1985
- 1985-08-15 JP JP18013185A patent/JPS6241262A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6241262A (ja) | 1987-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |