JPH0351553B2 - - Google Patents

Info

Publication number
JPH0351553B2
JPH0351553B2 JP58105137A JP10513783A JPH0351553B2 JP H0351553 B2 JPH0351553 B2 JP H0351553B2 JP 58105137 A JP58105137 A JP 58105137A JP 10513783 A JP10513783 A JP 10513783A JP H0351553 B2 JPH0351553 B2 JP H0351553B2
Authority
JP
Japan
Prior art keywords
spindle
holder
lens
machining
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58105137A
Other languages
Japanese (ja)
Other versions
JPS59232758A (en
Inventor
Shuji Ueda
Kunio Nakada
Mamoru Inoe
Kazuhiko Fujino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10513783A priority Critical patent/JPS59232758A/en
Priority to EP19840303987 priority patent/EP0128779B1/en
Priority to DE8484303987T priority patent/DE3483755D1/en
Publication of JPS59232758A publication Critical patent/JPS59232758A/en
Publication of JPH0351553B2 publication Critical patent/JPH0351553B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B11/00Machines or devices designed for grinding spherical surfaces or parts of spherical surfaces on work; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/0031Machines having several working posts; Feeding and manipulating devices

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、光学レンズ、ミラー等の光学部品の
球面研削装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a spherical surface grinding device for optical components such as optical lenses and mirrors.

従来例の構成とその問題点 従来の球面研削装置は第1図にその具体構成を
示すように、コレツトチヤツク1に保持され、回
転スピンドル2に取り付けられ低速で回されるレ
ンズ3が、傾斜スライド軸4により所定の傾斜角
にて傾けられ、さらに平行スライド軸5により所
定位置に置かれる高速回転スピンドル6に取り付
けられ高速回転するダイヤモンド砥石7によつて
球面研削加工される。この場合、ガラス素材は作
業者が手でコレツトチヤツク1へ持ち込むか、或
はオートローダーにて持ち込み保持され、加工後
の取り出しについても同様である。又、一般に使
用されるダイヤモンド砥石はメタルボンドの#
100〜# 400程度が使用され、Rnax2〜6μの仕上
げ面粗度となる。後工程に於ては、ダイヤモンド
メタルボンドペレツト及びレジノイドボンドペレ
ツトにてスムージングが行なわれ、さらにその後
工程に於て、CeO2等の研摩材を用いてポリシン
グが行なわれるのである。
Construction of the conventional example and its problems As shown in Fig. 1, the concrete construction of the conventional spherical grinding device is such that the lens 3, which is held by the collector chuck 1 and is attached to the rotary spindle 2 and rotated at low speed, is attached to the tilted slide shaft. 4 is tilted at a predetermined angle of inclination, and is further attached to a high-speed rotation spindle 6 placed at a predetermined position by a parallel slide shaft 5, and subjected to spherical grinding by a diamond grindstone 7 rotating at high speed. In this case, the glass material is brought into the collection chuck 1 manually by an operator or brought in and held in an autoloader, and the same applies to removal after processing. In addition, the commonly used diamond whetstone is metal bond #
Approximately #100 to #400 is used, resulting in a finished surface roughness of R nax 2 to 6μ. In the subsequent process, smoothing is performed using diamond metal bond pellets and resinoid bond pellets, and furthermore, in the subsequent process, polishing is performed using an abrasive such as CeO 2 .

しかしながら、上記のように装置では、コレツ
トチヤツク1により保持されるレンズ3は、1つ
のダイヤモンド砥石7でしか研削出来ず、さらに
これを仕上げ研削する場合、砥石を交換するか、
或は他の球面加工装置へレンズを移し替える必要
があるがレンズをコレツトチヤツクに再保持する
ことは、レンズの保持姿勢を変化させ、仕上げ研
削の加工代を大きくしなければならない。したが
つて効率良く荒研削加工及び仕上げ研削加工が出
来ない。又、荒研削加工に於ては、強制切り込み
方式、仕上げ研削加工に於ては、定圧切り込み方
式のそれぞれの方式が容易に採れない為、良好な
仕上げ面が得られず、同一タクトタイムで生産に
供することが出来ないという欠点を有していた。
However, in the device as described above, the lens 3 held by the collect chuck 1 can only be ground with one diamond grindstone 7, and when finishing grinding this, the grindstone must be replaced or
Alternatively, it may be necessary to transfer the lens to another spherical surface machining device, but re-holding the lens in the collect chuck requires changing the holding posture of the lens and increasing the machining allowance for finish grinding. Therefore, rough grinding and finish grinding cannot be performed efficiently. In addition, it is not easy to use the forced cutting method in rough grinding, and the constant pressure cutting method in finish grinding, making it impossible to obtain a good finished surface and production in the same takt time. It had the disadvantage that it could not be used for

発明の目的 本発明は上記欠点を解消するものであり、良好
な研削加工仕上げ面を効率良く実現するものであ
る。
OBJECTS OF THE INVENTION The present invention solves the above-mentioned drawbacks and efficiently realizes a good polished surface.

発明の構成 本発明は被加工物を保持する保持具と、これを
スピンドルに於て付け回転させるとともに軸方向
に送り込む手段と前記被加工物を所定の球面形状
に加工する為、所定の角度に傾斜して配置される
加工工具とを有し、前記スピンドル及び加工工具
は、荒加工用、仕上げ加工用を各々有しており、
前記被加工物を保持した保持具が、荒加工用スピ
ンドル、及び仕上げ加工用スピンドルへ移載され
被加工物が加工される。
Structure of the Invention The present invention includes a holder for holding a workpiece, a means for attaching the holder to a spindle and rotating it and feeding it in the axial direction, and a means for processing the workpiece into a predetermined spherical shape at a predetermined angle. and a machining tool arranged at an angle, the spindle and the machining tool each having one for rough machining and one for finishing machining,
The holder holding the workpiece is transferred to a rough machining spindle and a finishing spindle, and the workpiece is machined.

従つて、良好な研削加工仕上げ面が効率良く実
現出来、後工程が簡略化できる。したがつて精度
維持管理上、或は低コスト化にきわみて有利であ
る。
Therefore, a good ground surface can be efficiently achieved and the post-process can be simplified. Therefore, it is extremely advantageous in terms of precision maintenance and management and cost reduction.

実施例の説明 以下本発明の一実施例について、図面を参照し
ながら説明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第2図は被加工物の移載を示す概念図であり、
コンベア8上のレンズ9はオートハンド10によ
り吸着されて、a方向へ搬送され、被加工物受渡
し部でレンズ9を固定保持する保持具であるチヤ
ツクユニツト12に取り込まれ保持される。11
はチヤツクユニツト12を挟持する保持具挟持部
材である挟持部11である。この挟持部11は、
インデツクステーブル13上にあり、120゜b方向
へ回転し、レンズ9は荒研削加工され、さらに
120゜c方向へ回転し、精研削加工にて仕上げられ、
もう一度120゜d方向へ回転し、チヤツクユニツト
12からレンズ9が取り外されe方向へ取り出
し、コンベア14に載せられる。以上の動作を同
一タクトタイムで次から次へ連続して行なう。
Figure 2 is a conceptual diagram showing the transfer of the workpiece.
The lens 9 on the conveyor 8 is attracted by the automatic hand 10 and conveyed in the direction a, and taken into and held by a chuck unit 12, which is a holder for fixing and holding the lens 9, at the workpiece transfer section. 11
1 is a holding part 11 which is a holder holding member that holds the chuck unit 12. This holding part 11 is
It is placed on the index table 13 and rotates in the 120°b direction, and the lens 9 is roughly ground and further
It rotates in the 120°c direction and is finished with precision grinding.
The lens 9 is rotated again by 120° in the d direction, and the lens 9 is removed from the chuck unit 12, taken out in the e direction, and placed on the conveyor 14. The above operations are performed one after another in the same takt time.

第3図は具体的実施例であり、球面加工装置の
平面図、第4図はその正面図である。図に於て、
15は荒加工用ダイヤモンド砥石でメタルボンド
の# 100〜# 400程度を用いる。16は精加工用ダ
イヤモンド砥石でメタルボンド# 800〜# 1500程
度を用いる。17,18は砥石15,16のそれ
ぞれ回転スピンドルであり、19,20はその駆
動モーターである。21,22は砥石15,16
をレンズ9の中心に砥石15,16の外周部が接
する様に移動させるスライド駆動モーターであ
る。また、砥石15,16は所定の曲率半径の球
面が研削加工が出来るように図示なき駆動モータ
ーにより軸23,24を中心に所定の傾斜角にて
傾斜される。25,26はインデツクステーブル
13の下に設けられた回転スピンドルであり、挟
持部11により搬送されてくるレンズ9を保持し
たチヤツクユニツト12をクランプするとともに
これを5〜50rpm程度で回転させるものである。
また、回転スピンドル25,26は図示しない送
り込み装置により、砥石15,16に送り込まれ
る。29,30は回転スピンドル25,26を回
転させる駆動モーターである。回転スピンドル2
5は荒加工用であり、ダイヤモンド砥石15に対
し、強制的に送り込まれ強制切り込み方式の研削
を実現する。回転スピンドル26は、精加工用で
あり、ダイヤモンド砥石16に対し定圧で送り込
まれ、定圧切り込み方式の研削を実現する。
FIG. 3 shows a specific embodiment, a plan view of the spherical surface machining device, and FIG. 4 a front view thereof. In the figure,
15 is a diamond grindstone for rough machining, and metal bond #100 to #400 is used. 16 is a diamond grindstone for precision machining, and metal bond #800 to #1500 is used. 17 and 18 are rotating spindles of the grinding wheels 15 and 16, respectively, and 19 and 20 are drive motors thereof. 21 and 22 are whetstones 15 and 16
This is a slide drive motor that moves the grinding wheels 15 and 16 so that their outer peripheries touch the center of the lens 9. Further, the grindstones 15 and 16 are tilted at a predetermined inclination angle about shafts 23 and 24 by a drive motor (not shown) so that spherical surfaces with a predetermined radius of curvature can be ground. Reference numerals 25 and 26 denote rotary spindles provided under the index table 13, which clamp the chuck unit 12 holding the lens 9 conveyed by the clamping part 11 and rotate it at about 5 to 50 rpm. .
Further, the rotating spindles 25 and 26 are fed into the grindstones 15 and 16 by a feeding device (not shown). Reference numerals 29 and 30 are drive motors that rotate the rotary spindles 25 and 26. Rotating spindle 2
5 is for rough machining, and is forcibly fed into the diamond grindstone 15 to realize forced cutting type grinding. The rotating spindle 26 is used for precision machining, and is fed to the diamond grindstone 16 at a constant pressure to achieve constant pressure cutting method grinding.

10はレンズ9を吸着してチヤツクユニツト1
2に保持させたり、或はチヤツクユニツト12か
ら取り外す動作を行なうオートハンドでる。11
はインデツクステーブル13上に取り付けられた
支持部であり、チヤツクユニツト12を挟持する
ものである。又、34は本体ベースである。
10 attracts the lens 9 and attaches it to the chuck unit 1.
2, or an automatic hand that performs the operation of holding it in the chuck unit 12 or removing it from the chuck unit 12. 11
is a support section attached to the index table 13, which holds the check unit 12 therebetween. Further, 34 is the main body base.

以上のように構成された球面加工装置に於て、
以下その動作を説明する。
In the spherical surface machining device configured as above,
The operation will be explained below.

まず、オートハンド10が、コンベア8上のレ
ンズ9を吸着して、a方向に回転して、被加工物
受渡し部のチヤツクユニツト12にレンズ9をセ
ツトし保持させる。次に、チヤツクユニツト12
は挟持部11にて挟持される。その後、チヤツク
ユニツト12は、挟持部11に挟持されたまま、
インデツクステーブル13により、120゜f方向に
回転し、位置決めされ、挟持部11から開放され
ると同時に回転スピンドル25に固定される。レ
ンズ9が所望の曲率半径に研削加工される様配置
されたダイヤモンド砥石15は8000〜1200rmpで
高速回転している。これに対して回転スピンドル
25の端面に固定されたレンズ9は、5〜50rpm
で回転しながら砥石15に対して送り込まれるた
め、砥石15はレンズ9に対して強制的に定寸切
り込みを行ない荒研削加工を行なう。加工後、チ
ヤツクユニツト12は、回転スピンドル25から
解除され、挟持部11に再挟持され、さらにイン
デツクステーブル13により120゜f方向に回転し
位置決めされ、挟持部11から開放されると同時
に回転スピンドル26に固定される。
First, the automatic hand 10 attracts the lens 9 on the conveyor 8, rotates in the direction a, and sets and holds the lens 9 in the chuck unit 12 of the workpiece transfer section. Next, check unit 12
is held by the holding part 11. Thereafter, the check unit 12 is held between the holding parts 11 and
The index table 13 rotates the index table 13 in the direction of 120 degrees f, positions it, releases it from the clamping part 11, and fixes it to the rotary spindle 25 at the same time. A diamond grindstone 15 arranged to grind the lens 9 to a desired radius of curvature is rotating at a high speed of 8000 to 1200 rpm. On the other hand, the lens 9 fixed to the end face of the rotating spindle 25 has a rotation speed of 5 to 50 rpm.
Since the lens 9 is fed into the grindstone 15 while rotating, the grindstone 15 forcibly cuts into the lens 9 to a fixed size and performs rough grinding. After processing, the chuck unit 12 is released from the rotary spindle 25, re-clipped by the clamping part 11, further rotated and positioned in the 120° f direction by the index table 13, and simultaneously released from the clamping part 11 and placed on the rotary spindle 26. Fixed.

レンズ9が所望の曲率半径に研削加工される様
配置されたダイヤモンド砥石16は所定の回転速
度で高速回転している。これに対し、スピンドル
26の端面に固定されたレンズ9は、5〜50rpm
で回転しながら砥石16に対して送り込まれるた
め、砥石16はレンズ9に対して定圧で切り込み
を行ない精研削加工を行なう。加工後、同様にチ
ヤツク挟持部11に再挟持され、もう一度120゜f
方向に回転し元の位置に戻る。その後、前述した
ように精研削加工で仕上げられたレンズ9はオー
トハンド10により、チヤツクユニツト12から
取り出される。以上のような一連の動作を同一の
タクトタイムで連続で行なう。
A diamond grindstone 16 arranged to grind the lens 9 to a desired radius of curvature is rotating at a predetermined rotational speed. On the other hand, the lens 9 fixed to the end face of the spindle 26 has a rotation speed of 5 to 50 rpm.
Since the lens 9 is fed into the grindstone 16 while rotating, the grindstone 16 cuts into the lens 9 at a constant pressure to perform precision grinding. After processing, it is held again by the chuck holding part 11 in the same way and heated to 120°F again.
rotate in the direction and return to the original position. Thereafter, the lens 9, which has been finely ground as described above, is taken out from the chuck unit 12 by the automatic hand 10. The above-mentioned series of operations are performed continuously with the same takt time.

以上のように本実施例によれば、タクトタイム
20〜50sec程度で、精研削加工仕上げ後でRnax
0.2μm程度が容易に得られ、又、自動化が可能と
なつた。
As described above, according to this embodiment, the takt time
R nax after fine grinding finish in about 20-50 seconds
A thickness of about 0.2 μm can be easily obtained, and automation has become possible.

発明の効果 このように、本発明においては、被加工物は保
持具にて保持されて荒加工用回転スピンドル、及
び仕上げ加工用回転スピンドルに移載され、保持
具にて保持されたまま荒加工、仕上げ加工が行な
われる。
Effects of the Invention As described above, in the present invention, the workpiece is held by the holder and transferred to the rotary spindle for rough machining and the rotary spindle for finish machining, and the workpiece is rough-processed while being held by the holder. , finishing processing is performed.

すなわち、被加工物は加工中、保持具にてその
保持姿勢が変化することなく、保持されているの
で、被加工物の良好な研削仕上面が、効率良く短
時間で実現できる。
That is, since the workpiece is held by the holder without changing its holding posture during processing, a good ground surface of the workpiece can be efficiently achieved in a short time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の球面研削装置の具体構成を示す
平面図、第2図は本発明の一実施例に於ける被加
工物の移載を示す概念図、第3図は同球面加工装
置を示す平面図、第4図は同正面図である。 7,15,16……ダイヤモンド砥石、3,
9,27……被加工物(レンズ)、10,31…
…オートハンド、11,32……チヤツク挟持ハ
ンド、12,28……チヤツクユニツト、6,1
7,18……砥石回転スピンドル、2,29,3
0……ワーク回転スピンドル。
Fig. 1 is a plan view showing the specific configuration of a conventional spherical surface grinding device, Fig. 2 is a conceptual diagram showing the transfer of a workpiece in an embodiment of the present invention, and Fig. 3 is a plan view showing the specific configuration of a conventional spherical surface grinding device. The plan view shown in FIG. 4 is a front view of the same. 7,15,16...Diamond whetstone, 3,
9, 27... Workpiece (lens), 10, 31...
...Auto hand, 11,32...Chuck clamping hand, 12,28...Chuck unit, 6,1
7, 18... Grinding wheel rotation spindle, 2, 29, 3
0...Work rotation spindle.

Claims (1)

【特許請求の範囲】[Claims] 1 外部より供給される被加工物を固定保持する
保持具と、前記保持具を挟持する移動可能な保持
具挟持部材と、前記保持具が端面に固定された後
回転する回転スピンドルと、前記被加工物を所定
の球面形状に加工するため所定の角度に傾斜して
配置される加工工具と、前記加工工具に対し前記
回転スピンドルを前記加工工具の回転軸方向に送
り込む手段とからなり、前記回転スピンドルと前
記加工工具は荒加工用及び仕上げ加工用としてそ
れぞれ一対ずつ対向させて有しているとともに、
前記保持具挟持部材は被加工物受渡し部、前記荒
加工用加工具に対向するスピンドルおよび前記仕
上げ加工用加工工具に対向するスピンドル間を移
動することを特徴とする球面加工装置。
1. A holder that fixedly holds a workpiece supplied from the outside, a movable holder holding member that holds the holder, a rotating spindle that rotates after the holder is fixed to an end surface, and a rotating spindle that rotates after the holder is fixed to an end surface. It consists of a processing tool arranged at an angle at a predetermined angle in order to process a workpiece into a predetermined spherical shape, and a means for feeding the rotary spindle to the processing tool in the direction of the rotation axis of the processing tool, The spindle and the machining tool are provided in pairs facing each other for rough machining and finishing machining, and
A spherical surface machining device, wherein the holder clamping member moves between a workpiece delivery section, a spindle facing the rough machining tool, and a spindle facing the finishing machining tool.
JP10513783A 1983-06-13 1983-06-13 Spherical face working system Granted JPS59232758A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10513783A JPS59232758A (en) 1983-06-13 1983-06-13 Spherical face working system
EP19840303987 EP0128779B1 (en) 1983-06-13 1984-06-13 Spherical surface grinding device
DE8484303987T DE3483755D1 (en) 1983-06-13 1984-06-13 GRINDING DEVICE FOR SPHERICAL AREAS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10513783A JPS59232758A (en) 1983-06-13 1983-06-13 Spherical face working system

Publications (2)

Publication Number Publication Date
JPS59232758A JPS59232758A (en) 1984-12-27
JPH0351553B2 true JPH0351553B2 (en) 1991-08-07

Family

ID=14399359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10513783A Granted JPS59232758A (en) 1983-06-13 1983-06-13 Spherical face working system

Country Status (1)

Country Link
JP (1) JPS59232758A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131156A (en) * 1983-12-20 1985-07-12 Matsushita Electric Ind Co Ltd Nc spherical-surface working apparatus
JPS6299065A (en) * 1985-10-22 1987-05-08 Matsushita Electric Ind Co Ltd Spherical surface grinder
JP2005014176A (en) * 2003-06-27 2005-01-20 Tateno Kikai Seisakusho:Kk Inner-outer peripheral surface grinding work system of glass disc
DE102005021639A1 (en) * 2005-05-06 2006-11-09 Satisloh Gmbh High-performance milling and lathe and process for processing spectacle lenses
JP5303246B2 (en) * 2008-11-13 2013-10-02 ナブテスコ株式会社 Spherical processing machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834751A (en) * 1981-08-21 1983-03-01 Hitachi Seiko Ltd Wafer grinder
JPS5845852A (en) * 1981-09-11 1983-03-17 Hitachi Seiko Ltd Index table type wafer grinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834751A (en) * 1981-08-21 1983-03-01 Hitachi Seiko Ltd Wafer grinder
JPS5845852A (en) * 1981-09-11 1983-03-17 Hitachi Seiko Ltd Index table type wafer grinder

Also Published As

Publication number Publication date
JPS59232758A (en) 1984-12-27

Similar Documents

Publication Publication Date Title
US5149337A (en) Lens grinder and method of grinding lens
US4928435A (en) Apparatus for working curved surfaces on a workpiece
JPH1133886A (en) Method and device for polishing inside surface of glass disc
JPH0351553B2 (en)
JP2945021B2 (en) Lens processing method
JPH11347953A (en) Wafer chamfering grinding wheel
JPS6044263A (en) Spherical processing device
EP0128779B1 (en) Spherical surface grinding device
JPS61146471A (en) Dressing device
JP2875344B2 (en) Processing apparatus and processing method for toric and aspheric lenses
JP3630950B2 (en) Manufacturing method of spherical lens
JPS60177853A (en) Spherical grinder
JPS6328552A (en) Nonspherical face machining method
JP2001260023A (en) Forming method for grinding wheel
JPS60131156A (en) Nc spherical-surface working apparatus
JPS61117056A (en) Spherical working apparatus
JPH0425366A (en) Curved face working device
JPS6133665B2 (en)
JP2752710B2 (en) Optical element processing method and apparatus
JPS59219152A (en) Mirror finishing machine
JPH02284874A (en) Grinding stone
JPS62282852A (en) Grinding method
JPH01121153A (en) Spherical surface machining device
JPS63216664A (en) Toric surface polisher
JPH05185372A (en) Grinding method and grinder