JPH0351259B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a socket for a piezoelectric resonator, such as a crystal resonator, a filter, etc., for facilitating attachment and detachment on a circuit.

(Prior art) Conventionally, when mounting a piezoelectric resonator such as a crystal oscillator or a filter on a printed board on which an electronic circuit is mounted, or when replacing a damaged piezoelectric resonator, it is easy to attach and detach the piezoelectric resonator. As shown in Fig. 2, a through hole is provided at the bottom of an insulator case 1 made of synthetic resin, etc., and pin receivers 2, 2 made of a spring elastic conductor such as phosphor bronze are fixed therein. Sockets with protruding terminals 3, 3 connected to pin receivers 2, 2 are widely used.

As is clear from this figure, such a socket is used to insert the terminals 3, 3 into through holes in the printed circuit board 4 and electrically connect and fix them to the circuit patterns 5, 5 by soldering.

However, in the conventional socket as described above, the terminal 7 of the piezoelectric resonator 6 to be attached to the socket,
In order to insert this into the pin receivers 2 and 2 of the socket and firmly fix it, the lead terminal 7 needs to be considerably thicker than the lead terminal of a normal piezoelectric resonator, which not only lacks versatility but also makes it difficult to use a piezoelectric resonator. There were defects such as damage to the glass hermetic during attachment and detachment or due to stress due to vibration impact.

Furthermore, such sockets have to be rigid from the viewpoint of workability when attaching and detaching the piezoelectric resonator 6, so they also have the drawback of being difficult to accommodate the trend toward thinner electronic devices. Ta.

(Object of the Invention) The present invention eliminates the defects of the conventional piezoelectric resonator support socket as described above, and increases the versatility by supporting and fixing a piezoelectric resonator having ordinary lead terminals in a recumbent state. It is an object of the present invention to provide a socket for a piezoelectric resonator which allows the circuit to be made thinner and which does not cause the risk of damage to the hermetic when the resonator is attached or detached due to an impulse shock.

(Summary of the Invention) In order to achieve the above object, the socket according to the present invention has the following configuration.

That is, a lead wire connection fixing part for fixing the lead wires protruding from the package cage by pressure is provided at a suitable position on the periphery of an insulator case capable of storing a package containing a piezoelectric resonator in a lying position, and the lead wire connection fixing part is connected to a suitable position on the outer periphery of the case. For example, a lead terminal is protruded from the outer periphery of the case and connected to an electric circuit.

(Embodiments of the Invention) The present invention will be described in detail below with reference to embodiments shown in the drawings.

FIG. 1 is a perspective view showing a basic embodiment of a piezoelectric resonator socket according to the present invention.

In this figure, an insulator case 8 is formed using glass, ceramics, plastics, etc., and a package 6 containing a piezoelectric resonator can be housed therein in a recumbent state.

Then, recesses 9, 9 are provided at appropriate positions on the periphery of the insulator case 8, and the piezoelectric resonator package 6 is inserted into the recesses 9, 9.
Lead wire pressure welding fixing fittings 10, 10 having a generally U-shaped cross section are fitted into which the lead wires protruding from are inserted and pressure welded. is buried, and the other end is electrically connected to conductor strips 11, 11 protruding from the outer periphery of the case 8.

By doing so, if the socket 8 is connected and fixed to a required electric circuit using the conductor strips 11, 11, the piezoelectric resonator can be easily attached to and detached from the circuit. Since the circuit element is housed in the socket lying down, the thickness of the circuit element such as a printed board can be reduced after it is mounted.

In addition, the piezoelectric resonator housed in this socket can be replaced as long as its package size matches that of the socket, which not only increases the versatility of the resonator, but also makes it possible to Since no large stress is applied to the base of the lead terminal, the hermetic will not be damaged.

By the way, it would be convenient to manufacture the socket as described above by the following method from the viewpoint of utilizing the existing manufacturing process of piezoelectric resonator packages.

3a to 3b are manufacturing process diagrams showing one embodiment of the manufacturing procedure of a socket according to the present invention.

That is, in FIG. 1A, the peripheral frame 12 constituting the socket, the block 13 forming a part thereof, and the bottom plate 14 are manufactured by press molding of borosilicate powder glass, and the frames 12, 13 and the bottom plate 14
Lead members 15, 15 made of Kovar (iron-nickel-cobalt alloy) thin plates are stacked between the lead members 15 and 15, and then passed through a heating furnace and fused together to create a semi-finished socket as shown in Figure b. do.

In the gap between the peripheral frame 12 and the block 13 of this socket semi-finished product, a piezoelectric resonator lead wire pressure contact fixing member 16 made of press-molded phosphor bronze thin piece is fitted (FIG. 3(c)), and the lead member is soldered with solder. 15,
15 to obtain a socket as shown in Figure d.

As a method for mounting the socket according to the present invention as described above on the printed board 4, etc., a reflow method using paste solder may be used as shown in FIG. 4a, or a method using the conductor as shown in FIG. The tip of the strip 11 may be formed to a desired size, inserted into a through hole in the printed board 4, and fixed together with other mounted components through a solder bath.

Furthermore, as shown in FIG.
It is also possible to cut the metallized layer 16 at the outer circumferential wall surface of the socket and attach the metallized layer 16 to that portion, thereby mounting it by a reflow method.

Although the basic structure and manufacturing method of the piezoelectric resonator socket according to the present invention have been described above, the present invention is not limited to this.

First, regarding the structure of the socket, there are cases where the piezoelectric resonator is required to ground the case, and in order to do this, for example, as shown in FIG. In addition to the members 15, 15, a case grounding lead member 17 is buried at the same time as the socket is formed, and this is connected with a piezoelectric resonator package holding member 18, which is also pressed from a spring elastic thin conductor such as phosphor bronze, by soldering. Just do it.

Furthermore, the shape of the member that presses and clamps the lead wire and package of the piezoelectric resonator mentioned above can be of various shapes, but any shape can be used as long as it satisfies the requirements for electrical connection and mechanical fixation with the piezoelectric resonator at the same time. You are also free to choose the shape.

On the other hand, it is obvious that integral molding of heat-resistant plastics or ceramics may be used as a manufacturing method for the socket according to the present invention, and since these manufacturing methods are already known, their explanation will be omitted to avoid complexity.

(Effects of the Invention) Since the piezoelectric resonator socket according to the present invention is constructed as described above, it is possible to construct an electric circuit including the piezoelectric resonator in a thin structure, and the piezoelectric resonator can be easily attached and detached. Not only that, but even when a large vibration shock is applied to this electric circuit during attachment/detachment, unnecessary stress is not applied to the base of the lead terminal, so there is no risk of hermetic breakdown, and the electrical characteristics of the piezoelectric resonator are It exhibits a remarkable effect in keeping the stability of the electronic equipment and, by extension, the performance of the electronic equipment that uses it stable.

Additionally, since there is no need to directly mount the piezoelectric resonator on the printed circuit board, the piezoelectric resonator is not exposed to the heat generated when the printed board is passed through a solder bath, which also helps maintain the characteristics of the piezoelectric resonator. This is extremely convenient.

Furthermore, by using the socket according to the present invention, any ordinary piezoelectric resonator can be inserted as long as the compatibility of the size and shape of the piezoelectric resonator is satisfied, so the piezoelectric resonator can be replaced or changed. Not only does it have a large degree of freedom and is highly versatile, but when the exact frequency assignment has not yet been determined in wireless communication equipment, etc., the set can be adjusted using piezoelectric vibrators with nearby frequencies, and after the assigned frequency is determined. This also has the effect of making it possible to complete a large number of sets in a short period of time by inserting a vibrator of that frequency.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the basic structure of a piezoelectric resonator socket according to the present invention, FIG. 2 is a sectional view showing an example of a conventional socket, and FIGS. 3 a to 3 d are piezoelectric resonators according to the present invention. 4A to 4C are cross-sectional views showing variations of the method of mounting the socket on the circuit according to the present invention, and FIG. FIG. 7 is a perspective view showing another embodiment of the socket. 4... Printed board, 6... Piezoelectric resonator (package), 8... Insulator case (socket) periphery,
10... Lead wire pressure welding fixing part, 11... Conductor strip connected to the lead wire pressure welding fixing part, 16...
Metalized part on the outer periphery of the socket.

Claims (1)

[Scope of Claims] 1. A lead wire pressure welding fixing portion for pressure welding and fixing the lead wire protruding from the piezoelectric resonator package is provided at a suitable position on the periphery of an insulator case capable of horizontally housing a conductor package containing a piezoelectric resonator, and A socket for a piezoelectric resonator, characterized in that a lead wire pressure welding fixing part and a suitable position on the outer periphery of the insulator case are electrically connected. 2. In order to ground the piezoelectric resonator package, a package pressure-contacting fixing part for fixing the package's outer periphery under pressure is added, and this is electrically connected to an appropriate position on the outer periphery of the insulator case. A socket for a piezoelectric resonator according to range 1. 3 Metalizing a suitable part of the outer periphery of the insulator case, electrically connecting the part and the lead wire press-fitting fixing part and/or the piezoelectric resonator package press-fitting fixing part, and also attaching the metallized part to the insulating case at the metallized part. 3. A socket for a piezoelectric resonator according to claim 1 or 2, characterized in that the piezoelectric resonator is connected to an electric circuit. 4. Claim 1, characterized in that a conductor wire or a conductor strip is protruded from a suitable position on the outer periphery of the insulator case, and the insulator case and an electric circuit are connected by the conductor wire or conductor strip. Or the piezoelectric resonator socket according to 2. 5. A conductor wire or a conductor strip having a reduced tip width is protruded from an appropriate position on the outer periphery of the insulator case, and the tip of the conductor wire or conductor strip is inserted and fixed into a through hole of a printed circuit board. A piezoelectric resonator socket according to claim 1 or 2.